• Title/Summary/Keyword: and abrasive

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Nozzle Condition Monitoring System for Abrasive Waterjet Process (연마재 워터젯을 위한 노즐상태 모니터링 시스템 설계)

  • Kim, Jeong-Uk;Kim, Roh-Won;Kim, Chul-Min;Kim, Sung-Ryul;Kim, Hyun-Hee;Lee, Kyung-Chang
    • Journal of the Korean Society of Industry Convergence
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    • v.23 no.5
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    • pp.817-823
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    • 2020
  • In recent, the machining of difficult-to-cut materials such as titanium alloys, stainless steel, Inconel, ceramic, glass, and carbon fiber reinforced plastics (CFRP) used in aerospace, automobile, medical industry is actively researched. Abrasive waterjet is a non-traditional processing method in which ultra-high pressure water and abrasive particles are mixed in a mixing chamber and shoot out jet through a nozzle, and removed by erosion due to collision with a material. In particular, the nozzle of the abrasive waterjet is one of the most important parts that affect the machining quality as with a cutting tool in general machining. It is very important to monitor the condition of the nozzle because the workpiece is uncut or the surface quality deteriorates due to wear, expanding of the bore, damage of the nozzle and clogging of the abrasive, etc. Therefore, in this paper, we propose a monitoring system based on Acoustic Emission(AE) sensor that can detect nozzle condition in real time during AWJ processing.

Development and Evaluation of Fixed Abrasive Pad in Tungsten CMP (고정입자패드를 이용한 텅스텐 CMP 개발 및 평가)

  • Park, Boumyoung;Kim, Hoyoun;Kim, Gooyoun;Jeong, Haedo
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.2 no.4
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    • pp.17-24
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    • 2003
  • Chemical mechanical polishing(CMP) has been applied for planarization of topography after patterning process in semiconductor fabrication process. Tungsten CMP is necessary to build up interconnects of semiconductor device. But the tungsten dishing and the oxide erosion defects appear at end-point during tungsten CMP. It has been known that the generation of dishing and erosion is based on the over-polishing time, which is determined by pattern selectivity. Fixed abrasive pad takes advantage of decreasing the defects resulting flam reducing pattern selectivity because of the lower abrasive concentration. The manufacturing technique of fixed abrasive pad using hydrophilic polymers is introduced in this paper. For application to tungsten CMP, chemicals composed of oxidizer, catalyst, and acid were developed. In comparison of the general pad and slurry for tungsten CMP, the fixed abrasive pad and the chemicals resulted in appropriate performance in point of removal rate, uniformity, material selectivity and roughness.

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Abrasive Water Jet Machining of Alumina Ceramics (어브레이시브 워터제트를 이용한 알루미나 세라믹스의 가공)

  • 최기상;최기흥;김정수
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.18 no.8
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    • pp.2073-2080
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    • 1994
  • In this paper, a model of material removal in abrasive water jet machining of brittle material is developed, and experimentally evaluated. Abrasive water jet machining proved to yield better material removal rate than other machining techniques for hard and brittle material (alumina ceramics). It was also found that large scale fracture may develop at the exit of the jet from the material. The fracture size was predicted as a function of water jet pressure and size of the hole. Finally, the feasibility of using acoustic emission signals for in-process monitoring of the abrasive water jet machining process is investigated.

A Study on Monitoring of the MAP for Non-magnetic Material by AE Signal Analysis (AE신호 분석을 통한 비자성체의 자기연마 모니터링에 관한 연구)

  • Lee, Sung-Ho;Kim, Sang-Oh;Kwak, Jae-Seob
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.20 no.3
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    • pp.304-309
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    • 2011
  • A monitoring system for magnetic abrasive polishing process is necessary to ensure the polishing products the high quality and integrity. Acoustic emission (AE) signal is known to reflect the material removal phenomena in other machining processes. In a case of the magnetic abrasive polishing of non-magnetic materials, application of AE method is very difficult because of lower machining force on the surface of workpiece and the level of AE signal is extremely lower. In this study, AE sensor-based monitoring system is applied to the magnetic abrasive polishing. The relation between the level of the AE RMS and the surface roughness during the magnetic abrasive polishing of magnesium alloy steel is investigated.

The Study on the Application of CNT Particle in High-Precision Magnetic Abrasive Polishing Process (초정밀 자기연마 공정에 탄소나노튜브 입자의 적용에 관한 연구)

  • Kwak, Tae-Kyung;Kwak, Jae-Seob
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.20 no.3
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    • pp.274-279
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    • 2011
  • In this study, new abrasives that were composed of iron powder and carbon nanotube (CNT) particle were attempted to be abrasives for magnetic abrasive polishing. Because the CNT particles itself are very small ones with high hardness and magnetic strength, these properties are effective for magnetic abrasive polishing of nonmagnetic materials. As an experimental result for evaluating the machining characteristics in magnetic abrasive polishing, the CNT particles showed better performance than the conventional abrasives such as Fe and CBN powder.

Study on the Abrasive Capsulation Pad in Interlayer Dielectric Chemical Mechanical Polishing (층간절연막 화학기계연마에서 입자코팅패드에 관한 연구)

  • Kim, Ho-Yun;Park, Jae-Hong;Jeong, Hae-Do;Seo, Hyeon-Deok;Nam, Cheol-U;Lee, Sang-Ik
    • Journal of the Korean Society for Precision Engineering
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    • v.18 no.11
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    • pp.168-173
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    • 2001
  • The chemical mechanical polishing (CMP) is generally consisted of pad, slurry including abrasives and so on. However, there are some problems in a general CMP: defects, a high Cost of Consumable (CoC), an environmental problem. The slurry including abrasives especially gives rise to not only increase a CoC, but also prohibition from achieving an eco-process. This paper introduces an abrasive capsulation pad to achieve an eco-process decreasing abrasives used is CMP. The binder wth a water a water swelling and a water soluble characteristic is used for an auto-conditioning, and the $CeO_2$abrasive is selected for an abrasive capsulation pad. Comparing with a conventional CMP, an abrasive capsulation pad appears good characteristics in ILD CMP and is able to achieve an eco-process decreasing wasted slurry.

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Development of Magneto-Electrolytic-Abrasive Polishing System for Piston Pin (피스톤 핀의 자기전해 경면연마 시스템 개발)

  • 김정두
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 1998.03a
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    • pp.59-64
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    • 1998
  • We need to achieve th mass product through methods of higher efficient, higher precise manufacturing process than those of existing precision abrasive machining. Thus, this study is to develop mirror-like surface machining technique of outer diameter of the piston pin by the compound magneto-electrolytic abrasive polishing system. The procedure of machining is followed as first, fulfill the pre-processing by cylindrical grinder, second, complete mirror-like surface by the method of magneto-electrolytic abrasive polishing used CBN non-woven abrasive pads. In this study, it was found that the best suitable conditions of mirror-like surface polishing were that the electrode density was 0.1A/$\textrm{cm}^2$, the applied pressure 1.5kgf/$\textrm{cm}^2$, the feed rate 0.5mm/rev, and the rotoation velocity of workpiece 80rpm, and that the surface roughness was reduced in this conditions.

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Improvement of Oxide-Mechanical Polishing Characteristics According to the Ceria Abrasive Adding (세리아 연마제 첨가량에 따른 산화막 CMP 특성 고찰)

  • Han, Sang-Jun;Park, Sung-Woo;Lee, Woo-Sun;Sea, Yong-Jin
    • Proceedings of the KIEE Conference
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    • 2006.10a
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    • pp.87-88
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    • 2006
  • To investigate the possibility of ceria abrasive-added slurry for the oxide-chemical mechanical polishing (oxide-CMP) application, two kinds of retreated methods were introduced as follows: First, the characteristics of mixed abrasive slurry (MAS) using $CeO_2$ powder as an abrasive added within diluted silica slurry (DSS) were evaluated to achieve the improvement of removal rates and non-uniformity. Second, the control of pH level due to the dilution of slurry was examined. And then, we have discussed the CMP characteristics as a function of abrasive dispersion time.

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A study on grinding characteristics of CBN single abrasive grain (CBN 단입자의 연삭특성에 관한 연구)

  • 팽현진;손명환
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.14 no.6
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    • pp.1533-1541
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    • 1990
  • Cubic boron nitride (CBN) is known the second hardest material followed diamond and was provided industry as an abrasive grain in the late 1960's. Since the introduction of CBN, a large amount of research has been carried out to determine the best application condition for grinding operation. Despite the advantages in its characteristics, CBN has not yet gained full acceptance as more excellent abrasive grain than traditional one. The reason for this state is that the surface roughness ground by CBN is worse than by traditional one and dressing and truing is very difficult. This led user's resistance to the use of CBN as an abrasive grain. Present study is to investigate the cause of lower surface roughness ground by CBN single crystal abrasive grain comparing with traditional one.