Improvement of Oxide-Mechanical Polishing Characteristics According to the Ceria Abrasive Adding

세리아 연마제 첨가량에 따른 산화막 CMP 특성 고찰

To investigate the possibility of ceria abrasive-added slurry for the oxide-chemical mechanical polishing (oxide-CMP) application, two kinds of retreated methods were introduced as follows: First, the characteristics of mixed abrasive slurry (MAS) using $CeO_2$ powder as an abrasive added within diluted silica slurry (DSS) were evaluated to achieve the improvement of removal rates and non-uniformity. Second, the control of pH level due to the dilution of slurry was examined. And then, we have discussed the CMP characteristics as a function of abrasive dispersion time.