Journal of the Korean Society for Aeronautical & Space Sciences
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v.34
no.3
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pp.60-66
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2006
The purpose of this paper is to evaluate potential application of Lightweight Piezo-composite Actuator (LIPCA) to suppress vibrations of structures. The LIPCA, consisting of a piezoelectric layer, a carbon/epoxy layer and glass/epoxy layers, has advantages in terms of high performance, durability and reliability, compared to the bare piezoelectric ceramic (PZT) actuator. We performed two kinds of experiments on static actuation and active vibration suppression to investigate the actuation performances of the LIPCA and the bare PZT. We attached the actuator on one side and a strain gage on the other side of an aluminum beam. In the static actuation test, we evaluated the performance by comparing equivalent actuation moments of the LIPCA and the bare PZT due to the applied voltage. In the active vibration control test, control signals were generated to suppress the vibration of the beam by the PID control algorithm based on the measured strain signals. The performances were estimated based on settling times of the strain responses. It can be concluded that the LIPCA has better actuation performances than the bare PZT in active control of free vibration as well as static actuation.
Although endobronchial hamartoma is a rare benign tumor, most patients with endobronchial hamartoma have respiratory symptoms such as obstructive pneumonia, hemoptysis, cough, or dyspnea due to bronchial obstruction. It can cause irreversible post-obstructive pulmonary destruction, thus early diagnosis and treatment is very important. Recently, there have been cases of neodymium-doped yttrium aluminum garnet (Nd:YAG) laser and electrocautery procedures for bronchoscopic treatment of malignant or benign central airway obstruction with comparable therapeutic efficacy and few complications. Bronchoscopic cryotherapy is a newly developed technique for management of central airway obstruction. Moreover, it provides diagnostic methods with improving diagnostic yield and safety. We report two cases of endobronchial hamartoma, each diagnosed and definitively treated with bronchoscopic techniques. Endobronchial biopsy and removal was successfully performed by cryotherapy via flexible bronchoscopy without notable complications. Follow-up bronchoscopic examinations excluded residual or recurrent disease.
For heat exchanger applications, 2-ply clad materials were fabricated by rolling of aluminum (Al) and mild steel sheets. Effects of annealing temperature on interface properties, especially on inter-layer formation and softening of strain hardened mild-steel, for Al/mild steel clad materials, were investigated. To obtain optimum annealing conditions for the Al/mild steel clad materials, annealing temperature was varied from room temperature to $600^{\circ}C$. At the annealing temperature about $450^{\circ}C$, an inter-layer was formed in an island-shape at the interface of the Al/mild steel clad materials; this island expanded along the interface at higher temperature. By analyzing the X-ray diffraction (XRD) peaks and the energy dispersive X-ray spectroscopy (EDX) results, it was determined that the exact chemical stoichiometry for the inter-layer was that of $Fe_2Al_5$. In some samples, an X-layer was formed between the Al and the inter-layer of $Fe_2Al_5$ at high annealing temperature of around $550^{\circ}C$. The existence of an X-layer enhanced the growth of the inter-layer, which resulted in the delamination of the Al/mild-steel clad materials. Hardness tests were also performed to examine the influence of the annealing temperature on the cold deformability, which is a very important property for the deep drawing process of clad materials. The hardness value of mild steel gradually decreased with increasing annealing temperature. Especially, the value of hardness sharply decreased in the temperature range between $525^{\circ}C$ and $550^{\circ}C$. From these results, we can conclude that the optimum annealing temperature is around $550^{\circ}C$ under condition of there being no X-layer creation.
Park, Cheol-Hyeon;O, Jae-Eung;No, Yeong-Gyun;Lee, Sang-Tae;Kim, Mun-Deok
Proceedings of the Korean Vacuum Society Conference
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2013.02a
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pp.183-184
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2013
Two main MBE growth techniques have been used: plasma-assisted MBE (PA-MBE), which utilizes a rf plasma to supply active nitrogen, and ammonia MBE, in which nitrogen is supplied by pyrolysis of NH3 on the sample surface during growth. PA-MBE is typically performed under metal-rich growth conditions, which results in the formation of gallium droplets on the sample surface and a narrow range of conditions for optimal growth. In contrast, high-quality GaN films can be grown by ammonia MBE under an excess nitrogen flux, which in principle should result in improved device uniformity due to the elimination of droplets and wider range of stable growth conditions. A drawback of ammonia MBE, on the other hand, is a serious memory effect of NH3 condensed on the cryo-panels and the vicinity of heaters, which ruins the control of critical growth stages, i.e. the native oxide desorption and the surface reconstruction, and the accurate control of V/III ratio, especially in the initial stage of seed layer growth. In this paper, we demonstrate that the reliable and reproducible growth of GaN on Si (110) substrates is successfully achieved by combining two MBE growth technologies using rf plasma and ammonia and setting a proper growth protocol. Samples were grown in a MBE system equipped with both a nitrogen rf plasma source (SVT) and an ammonia source. The ammonia gas purity was >99.9999% and further purified by using a getter filter. The custom-made injector designed to focus the ammonia flux onto the substrate was used for the gas delivery, while aluminum and gallium were provided via conventional effusion cells. The growth sequence to minimize the residual ammonia and subsequent memory effects is the following: (1) Native oxides are desorbed at $750^{\circ}C$ (Fig. (a) for [$1^-10$] and [001] azimuth) (2) 40 nm thick AlN is first grown using nitrogen rf plasma source at $900^{\circ}C$ nder the optimized condition to maintain the layer by layer growth of AlN buffer layer and slightly Al-rich condition. (Fig. (b)) (3) After switching to ammonia source, GaN growth is initiated with different V/III ratio and temperature conditions. A streaky RHEED pattern with an appearance of a weak ($2{\times}2$) reconstruction characteristic of Ga-polarity is observed all along the growth of subsequent GaN layer under optimized conditions. (Fig. (c)) The structural properties as well as dislocation densities as a function of growth conditions have been investigated using symmetrical and asymmetrical x-ray rocking curves. The electrical characteristics as a function of buffer and GaN layer growth conditions as well as the growth sequence will be also discussed. Figure: (a) RHEED pattern after oxide desorption (b) after 40 nm thick AlN growth using nitrogen rf plasma source and (c) after 600 nm thick GaN growth using ammonia source for (upper) [110] and (lower) [001] azimuth.
The effects of the pretreatment with coagulants on the recovery efficiency of poly (3-hydroxybutyrate, PHB) synthesized in Alcaligenes eutrophus were investigated. Al-base or Fe-base coagulants, and the dispersion method of 30% hypochlorite solution and chloroform were used as coagulants and PHB recovery method, respectively The recovery efficiency of PHB from the cells harvested with Al-base coagulants at the range from 0 to 1000 mg-Al/L was similar to that from cells harvested without the coagulants. At these conditions, the concentrations of residual aluminium in the purified PHB were below 250 mg-Al/kg-PHB, indicating the effect of residual aluminum on the characteristics of the purified PHB can be insignificant. When the dosage of coagulants was over 1000 mg-Al/L, the PHB recovery remarkably decreased with increasing the coagulant dosage. However, the PHB recovery could be enhanced by the use of 50% hypochlorite solution instead of 30% hypochlorite solution. Even though the reduction of PHB recovery efficiency was not found by using Fe-base coagulants, the purified PHB was stained pale red due to residual iron, These results suggest that the use of Al-base coagulants did not exert bad influence on neither PHB recovery efficiency and PHB purity.
The Journal of Korean Institute of Electromagnetic Engineering and Science
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v.24
no.9
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pp.936-943
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2013
This work presents the design and measured results of the single channel automotive radar system for 76.5~77 GHz long range FMCW radar applications. The transmitter uses a commercial GaAs monolithic microwave integrated circuit(MMIC) and the receiver uses the down converter designed using 65 nm CMOS process. The output power of the transmitter is 10 dBm. The down converter chip can operate at low LO power as -8 dBm which is easily supplied from the transmitter output using a coupled line coupler. All MMICs are mounted on an aluminum jig which embeds the WR-10 waveguide. A microstrip to waveguide transition is designed to feed the embedded waveguide and finally high gain horn antennas. The overall size of the fabricated radar system is $80mm{\times}61mm{\times}21mm$. The radar system achieved an output power of 10 dBm, phase noise of -94 dBc/Hz at 1 MHz offset and a conversion gain of 12 dB.
Recently the 2nd generation laboratory composite resins were introduced. Although the mechanical properties of these composite resins have been improved, there were some disadvantages such as discoloration, low abrasion resistance and debonding between metal and resin. The purpose of this study was to evaluate the tensile bond strength between non-pecious dental alloy(verabond) and four veneering reinforced composite resins ; Targis(Ivoclar Co., U.S.A.), Artglass(Kulzer CO., Germany), Sculpture(Jeneric Pentron Co., U.S.A.), and Estonia(Kurary Co., Japan). All test metal specimens were polished with #1,000 SiC paper, and sandblasted with $250{\mu}m$ aluminum oxide. After then. according to manufacturer's instructions metal adhesive primer and veneering resins were applied. All test specimens were divided into two groups. One group was dried in a desiccator at $25^{\circ}C$ for 3 days, the other group was subjected to thermal cycling($2,000{\times}$) in water($5/55^{\circ}C$). Tensile bond strength was measured using Instron Universal Testing machine and the fractured surface was examined under the naked eyes and scanning electron microscope. Within the limitations imposed in this study, the following conclusions can be drawn: 1. In no-thermal cycling groups, there were no significant differences between Estenia and VMK68 but there were significant differences between Targis, Artglass, Sculpture and VMK68(p<0.05). 2. In no-thermal cycling resin groups, the highest tensile bond strength was observed in Estenia and there were significant differences between Estenia and the other resins(p<0.05). 3. Before and after thermal cycling, there were significant differences in tensile bond strength of Targis and Artglass(p<0.05). The tensile bond strength of Artglass was decreased and that of Targis was increased. 4. In no-thermal cycling groups, Artglass showed mixed fracture modes(95%), but after thermal cycling, Artglass showed adhesive fracture modes(75%).
Copper(Cu) as an interconnecting metal layer can replace aluminum (Al) in IC fabrication since Cu has low electrical resistivity, showing high immunity to electromigration compared to Al. However, it is very difficult for copper to be patterned by the dry etching processes. The chemical mechanical polishing (CMP) process has been introduced and widely used as the mainstream patterning technique for Cu in the fabrication of deep submicron integrated circuits in light of its capability to reduce surface roughness. But this process leaves a large amount of residues on the wafer surface, which must be removed by the post-CMP cleaning processes. Copper corrosion is one of the critical issues for the copper metallization process. Thus, in order to understand the copper corrosion problems in post-CMP cleaning solutions and study the effects of DC biases and post-CMP cleaning solution concentrations on the Cu film, a constant voltage was supplied at various concentrations, and then the output currents were measured and recorded with time. Most of the cases, the current was steadily decreased (i.e. resistance was increased by the oxidation). In the lowest concentration case only, the current was steadily increased with the scarce fluctuations. The higher the constant supplied DC voltage values, the higher the initial output current and the saturated current values. However the time to be taken for it to be saturated was almost the same for all the DC supplied voltage values. It was indicated that the oxide formation was not dependent on the supplied voltage values and 1 V was more than enough to form the oxide. With applied voltages lower than 3 V combined with any concentration, the perforation through the oxide film rarely took place due to the insufficient driving force (voltage) and the copper oxidation ceased. However, with the voltage higher than 3 V, the copper ions were started to diffuse out through the oxide film and thus made pores to be formed on the oxide surface, causing the current to increase and a part of the exposed copper film inside the pores gets back to be oxidized and the rest of it was remained without any further oxidation, causing the current back to decrease a little bit. With increasing the applied DC bias value, the shorter time to be taken for copper ions to be diffused out through the copper oxide film. From the discussions above, it could be concluded that the oxide film was formed and grown by the copper ion diffusion first and then the reaction with any oxidant in the post-CMP cleaning solution.
The Journal of Korean Institute of Electromagnetic Engineering and Science
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v.18
no.6
s.121
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pp.591-601
/
2007
In this paper, the miniaturized radio frequency identification(RFID) tag antennas used in UHF band$(908.5{\sim}914MHz)$ are designed and fabricated by using the circular loop antenna(CLA). Miniaturization of CLA was possible to transform the structure of circular loop into the structure of meander line. In the case of double meander line CLA is reduced up to 83% compared with the general type CLA. The $S_{11}$, -10 dB bandwidth, and gain of double meander line CLA were -11.9 dB, 12 MHz(1.3%), and -1.18 dBd. Also, a small half-wavelength CLA using double meander line is designed and fabricated for flat snack bag coated aluminum. The antenna is reduced up to 92.1% except ground. It shows the $S_{11}$ of -16.5 dB, -10 dB bandwidth of 48 MHz(5%) and gain of -0.58 dBd. The radiation pattern shows omni-directional pattern in z-y plane(x-axis pol.). Through this result, we can confirm that miniaturized type CLAs using meander lines are suitable for miniaturized RFIB tag antennas with the UHF band.
Journal of Korean Society of Environmental Engineers
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v.22
no.1
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pp.159-167
/
2000
In recent years, combined and separated sewer overflows (CSOs, SSOs) have been recognized as a significant pollution problem. To solve this problem a series of experiments were performed in a small scale Rapid Floc Settler (RFS) device to determine its ability in removing micro particles and dissolved materials from polluted waters. The RFS device is a compact physico-chemical wasterwater treatment system. Polyacrylamide (PAM) is used as a coagulant for treating stormwater in the RFS. The results of Jar test showed that PAM could be an excellent coagulant as compared with aluminum sulfate. and ferric chloride. In several experimental conditions, the influence of different variation parameters was tested to measure the efficiency of the RFS. Tests have been carried out with typical CSOs concentrations (50~1.000mg SS/L). The treatment efficiency with regard to SS and COD, which can be obtained at an overflow rate of $130m^3/m^2/day$, are 90% and 80%, respectively. Comparing other sedimentation technologies with RFS, the overflows rate of RFS is ten times faster. The distribution of particle size and number were analyzed. The RFS is suitable for the treatment of CSOs and also the removal of settleable and dissolved materials in urban stormwater runoff.
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