• Proceedings of the Korea Concrete Institute Conference
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• 2001.05a
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• pp.243-248
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• 2001

The objective of this study is to investigate the thermal conductivity of cement mortar for apartment housing floor using expansive admixture, copper fiber, cower lathe, hollowed aluminum plate. According to test results, temperature at point (a) located above heating pipe does not show significant variation with age, and temperature at (b), which is located at the finishing surface above heating pipe, and temperature at (c), which is located at center surface between heating pipe has remarkable change. Temperature distribution sat (b) are in order for, structure containing copper fiber>plain structure>structure containing hollowed aluminum plate>structure containing expansive admixture. Temperature distribution, shows high tendency in order for, structure containing copper fiber>structure containing copper lathe>structure containing hollowed aluminum plate>plain structure>structure containing expansive admixture. (a) estimation of temperature distribution is determined with the variation of temperature between (b) point and (c) point during 60 minutes heating.

• The Transactions of the Korean Institute of Electrical Engineers A
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• v.55 no.8
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• pp.334-340
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• 2006

Copper is widely used in electric wire, cable, conductor in electric devices. As the demand for electric power is increasing rapidly, electric power devices are getting amazingly bigger and complicated. The using of light-weight conductor can reduce the size and making cost of the electric devices. In high-frequency application, Electric current in a conductor tends to shift to the surface of the conductor, resulting in an uneven current distribution in the inner conductor. In the extreme case the current may essentially concentrate in the 'skin' of the inner conductor as a surface current. In high frequency application, therefore, inner area of copper conductor may replace with aluminum conductor, which reduces the weight of conductor. This paper describes the manufacture and evaluation of composite conductors made of copper and aluminum. The optimum extruding ratio was 16 at $300^{\circ}C$. The electrical resistance of manufactured composite bus bar was $57{\mu}{\Omega}$ at DC and $49.5{\mu}\{Omega}$ at 300Hz.

• Journal of Welding and Joining
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• v.15 no.4
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• pp.109-115
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• 1997

Laser cladding is a technique for modification of metal surface. In this laser cladding experiment a metal powder feeding system was developed for more efficient laser cladding. This system can reduce processing time and be used simpler than the conventional method. The feeding of metal powder has given a rise to the process for sequential buildup of bulk rapidly solidified materials in the form of fine powder stream to the laser cladding process. The parameters of laser cladding have been investigated using this experimental equipment. Bronze on aluminum alloy and copper on aluminum alloy were experimented by using defocused beam, powder feeding system, and gas shielding. Good cladding was achieved in the range of beam travel speed of 2.25m/min. In the case of copper/aluminum and bronze/aluminum substrate, the absorption of laser beam was too high to produce low diluted clad. In the case of copper/1050 aluminum, the optimal laser cladding condition was of laser power of 2.8kW, powder feed rate of 0.31g/s and beam travel speed of 2.25m/min. In the case of bronze/aluminum the optimal condition is of laser power of 2.5kW, powder feed rate of 0.31g/s, and beam travel speed of 2.36m/min.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.61 no.1
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• pp.70-74
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• 2012

Copper die casting motor (CDM) has a better design flexibility than aluminium die casting motor (ADM) because of the higher conductivity of copper. However, CDM has an economic and manufacturing weak point due to high copper price and high melting temperature compared to ADM. This paper describes a comparison of the design parameters, specifications, performances and material cost between CDM and ADM of 5.5kW_6P.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.11
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• pp.721-726
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• 2015

In this study, the properties of C-V degradation for thermal conductivity silicone rubber sample which is attached by copper-copper, copper-aluminum, aluminum-aluminum on upper-side and under-side has been measured at temperature of $80^{\circ}C{\sim}140^{\circ}C$. The results of this study are as follows. In case the frequency is increased, it found that the electrostatic capacity increased with increasing temperature to $80^{\circ}C$, $110^{\circ}C$, $140^{\circ}C$ regardless of kind of electrode. It found that the electrostatic capacity increased with becoming high temperature range of frequency regardless of kind of electrode. This result is considered to be caused by thermal absorption on the thermal conductivity silicone rubber sample. It found that the electrostatic capacity decreased with increasing temperature and frequency. This result is considered to be caused by molecular motion of C-F radical or OH radical.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1999.05a
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• pp.9-19
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• 1999

A clad material is a different type of the typical composites which is composed of two or more materials joined at their interface surface. The advantage of clad material is that the combination of different materials can satisfy both the need of good mechanical properties and the other demand of user such as electrical properties instantaneouly. This paper is concerned with the direct and indirect extrusion process of copper-clad aluminum rod. Extrusion of copper-clad aluminum rod was simulated using a commercially available finite element package of DEFORM. The simulations were performed for copper-clad aluminum rod to predict the distributions of temperature, effective stress, effective strain rate and moan stress for some sheath thicknesses, die exit diameters and die temperatures.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.437-440
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• 2000

Composite material consists of more than two materials and make various kinds of composite materials by combining different single materials. Copper clad aluminum composite material is composed of Al and Cu, and it has already been put to practical use in Europe because of its economic benefits. This paper presents the interface bonding according to the variation of extrusion ratio and semi-angle die by observing the interface between Cu and Al using metal microscope. By that result, we can predict the conditions of the interface bonding according to the extruding conditions.

• Journal of Electrochemical Science and Technology
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• v.3 no.1
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• pp.35-43
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• 2012

Highly ordered and perforated anodic aluminum oxide membranes were prepared by anodic oxidation and subsequent removal of the barrier layer. By using these homemade anodic aluminum oxide membranes as templates, metal selenide nanowires and nanotubes were synthesized. The structure and composition of these one-dimensional nanomaterials were studied by field emission scanning electron microscopy as well as transmission electron microscopy and energy dispersive X-ray spectroscopy. The growth process of metal selenide inside anodic aluminum oxide channel was traced by investigating the series of samples using scanning electron microscopy after reacting for different times. Straight and dense copper selenide and silver selenide nanowires with a uniform diameter were successfully prepared. In case of nickel selenide, nanotubes were preferentially formed. Phase and crystallinity of the nanostructured materials were also investigated.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.8
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• pp.99-109
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• 2022

In this study, an electric resistance-heated surface friction spot-welding process was proposed and tested for the spot-welding ability of copper and aluminum dissimilar metal sheets using electric resistance heating and surface friction heating. This process has welding variables, such as the current value, energizing cycles, rotational speed, and friction time. The current value and energizing cycle can affect the resistance heat, and the rotational speed of the rotating pin and friction time influence frictional heat generation. Resistance heating before friction heating has a preheating effect on the Cu-Al contact interface and a positive effect on preventing friction heat loss during the friction stage. However, because resistance preheating can soften the copper sheet and affect the contact stress and friction coefficient, it has difficulties that may adversely affect frictional heat generation. Therefore, the optimal combination of welding variables should be determined through simulations and experiments of the spot-welding process to determine the effects of electric resistance preheating on the suggested process. Through this procedure, it is known that the proposed spot-welding process can improve the welding quality during the spot welding of Cu-Al sheets.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.4
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• pp.69-74
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• 2010

A new package substrate for dynamic random access memory(DRAM) devices has been developed using selective aluminum anodization. Unlike the conventional substrate structure commonly made by laminating epoxy-based core and copper clad, this substrate consists of bottom aluminum, middle anodic aluminum oxide and top copper. Anodization process on the aluminum substrate provides thick aluminum oxide used as a dielectric layer in the package substrate. Placing copper traces on the anodic aluminum oxide layer, the resulting two-layer metal structure is completed in the package substrate. Selective anodization process makes it possible to construct a fully filled via structure. Also, putting vias directly in the bonding pads and the ball pads in the substrate design, via in pad structure is applied in this work. These arrangement of via in pad and two-layer metal structure make routing easier and thus provide more design flexibility. In a substrate design, all signal lines are routed based on the transmission line scheme of finite-width coplanar waveguide or microstrip with a characteristic impedance of about $50{\Omega}$ for better signal transmission. The property and performance of anodic alumina based package substrate such as layer structure, design method, fabrication process and measurement characteristics are investigated in detail.