• Journal of radiological science and technology
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• v.37 no.1
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• pp.7-14
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• 2014

By using a Chest Phantom(DUKE Phantom) focusing on dose reduction of diagnostic radiation field with the most use of artificial radiation, and attempt to reduce radiation dose studies technical radiation. Publisher of the main user of the X-ray Radiological technologists, Examine the effect of reducing the radiation dose to apply additional filtering of the X-ray generator. In order to understand the organ dose and effective dose by using the PC-Based Monte Carlo Program(PCXMC) Program, the patient receives, was carried out this research. In this experiment, by applying a complex filter using a copper and Al(aluminum,13) and filtered single of using only aluminum with the condition set, and measures the number of the disk of copper indicated by DUKE Phantom. The combination of the composite filtration and filtration of a single number of the disk of the copper is the same, with the PCXMC 2.0. Program looking combination of additional filtration fewest absorbed dose was calculated effective dose and organ dose. Although depends on the use mAs, The 80 kVp AP projection conditions, it is possible to reduce the effective amount of about 84 % from about 30 % to a maximum at least. The 120 kVp PA projection conditions, it is possible to reduce the effective amount of about 71 % from about 41 % to a maximum of at least. The organ dose, dose reduction rate was different in each organ, but it showed a decrease of dose rate of 30 % to up 100 % at least. Additional filtration was used on the imaging conditions throughout the study. There was no change in terms of video quality at low doses. It was found that using the DUKE Phantom and PCXMC 2.0 Program were suitable to calculate the effect of reducing the effective dose and organ dose.

• Journal of agricultural medicine and community health
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• v.22 no.2
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• pp.215-223
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• 1997

To estimate association of minerals relating to non-insulin dependent diabetes mellitus(NIDDM) the contents of essential minerals and toxic heavy metals in the scalp hair were measured during the period from March 1993 to June 1993. The cases were selected 69 (32 male, 37 female) from the patients who visited Kyungpook University Hospital during the period from March 1993 to June 1993 and 74 controls (47 male 27 female) from normal population. zinc, copper, manganese, lead, cadmium and aluminum were analyzed by atomic absorption spectrophotometer(IL. 551). The results were summarized as follows. In NIDDM group, mean contents of zinc and copper were $132.99{\pm}19.66$ ppm, $8.58{\pm}5.07$ ppm respectively; where as $152.51{\pm}46.15$ ppm, $12.48{\pm}6.56$ ppm in control group. The mean of above two mineral content showed significant difference statistically (p<0.01). But, in manganese the content of NIDDM group; $0.44{\pm}0.27$ ppm were significantly higher than the control group; $0.34{\pm}0.18$ ppm(p<0.05). A thesis submitted to the Council of the Graduate School of Kyungpook National University in partial fulfillment of the require ements for the degree of Ph.D. in Medical Science in June 1994. The mean contents of toxic metals - lead, cadmium, aluminum - in NIDDM group were $10.04{\pm}4.60$ ppm, $0.57{\pm}0.12$ ppm, $11.31{\pm}3.98$ ppm; whereas $8.10{\pm}2.45$ ppm, $0.41{\pm}0.23$ ppm, $7.61{\pm}4.16$ ppm in control group. The mean of above three mineral showed significant difference statistically(p<0.01). Cadmium, zinc and copper were selected statistically significant variables with presence of the NIDDM by multiple logistic regression analysis; copper, zinc and cadmium may be associated with NIDDM.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.1
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• pp.17-21
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• 2011

Copper (Cu) had been attractive material due to its superior properties comparing to other metals such as aluminum or tungsten and considered as the best metal which can replace them as an interconnect metal in integrated circuits. CMP (Chemical Mechanical Polishing) technology enabled the production of excellent local and global planarization of microelectronic materials, which allow high resolution of photolithography process. Cu CMP is a complex removal process performed by chemical reaction and mechanical abrasion, which can make defects of its own such as a scratch, particle and dishing. The abrasive particles remain on the Cu surface, and become contaminations to make device yield and performance deteriorate. To remove the particle, buffing cleaning method used in post-CMP cleaning and buffing is the one of the most effective physical cleaning process. AE(Acoustic Emission) sensor was used to detect dynamic friction during the buffing process. When polishing is started, the sensor starts to be loaded and produces an electrical charge that is directly proportional to the applied force. Cleaning efficiency of Cu surface were measured by FE-SEM and AFM during the buffing process. The experimental result showed that particles removed with buffing process, it is possible to detect the particle removal efficiency through obtained signal by the AE sensor.

• Journal of Korea Foundry Society
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• v.41 no.5
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• pp.419-433
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• 2021

Al-Si-Cu alloys benefit from the addition of copper for better hardness and strength through precipitation hardening, which results in remarkably strong alloys. However, the addition of copper expands the solidification range of Al-Si-Cu alloys, and due to this, these alloys become more prone to hot tearing, which is one of the most common and serious fracture phenomena encountered during solidification. The conventional evaluation method of the hot tearing properties of an alloy is a relative and qualitative analysis approach that does not provide quantitative data about this phenomenon. In the present study, the mold itself part of a device developed in Instone et al. was partially modified to obtain more reliable quantitative data pertaining to the hot tearing properties of an Al-Si-Cu casting alloy. To assess the influence of Cu element, four levels of Cu contents were tested (0.5, 1.0, 3.0, and 5.0 wt.%) in the Al-Si-Cu system alloy and the hot tearing properties were evaluated in each case. As the Cu content was increased, the hot tearing strength decreased to 2.26, 1.53, 1.18, and 1.04 MPa, respectively. At the moment hot tearing occurred, the corresponding solid fraction and solidification rate decreased at the same temperature due to the increase in the solid-liquid coexistence range as the Cu content increased. The morphology of the fracture surfaces was changed from dendrites to dendrites covered with residual liquid, and CuAl₂ phases were observed in the vicinity of hot tearing.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.338-338
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• 2013

Monolithic three-dimensional integrated circuits (3D-ICs) 구현 시 bonding 과정에서 발생되는 aluminum (Al) 이나 copper (Cu) 등의 interconnect metal의 확산, 열적 스트레스, 결함의 발생, 도펀트 재분포와 같은 문제들을 피하기 위해서는 저온 공정이 필수적이다. 지금까지는 polymer 기반의 bonding이나 Cu/Cu와 같은 metal 기반의 bonding 등과 같은 저온 bonding 방법이 연구되어 왔다. 그러나 이와 같은 bonding 공정들은 공정 시 void와 같은 문제가 발생하거나 공정을 위한 특수한 장비가 필수적이다. 반면, 두 물질의 합금을 이용해 녹는점을 낮추는 eutectic bonding 공정은 저온에서 공정이 가능할 뿐만 아니라 void의 발생 없이 강한 bonding 강도를 얻을 수 있다. Aluminum-germanium (Al-Ge) 및 aluminum-indium (Al-In) 등의 조합이 eutectic bonding에 이용되어 각각 $424^{\circ}C$ 및 $454^{\circ}C$의 저온 공정을 성취하였으나 여전히 $400^{\circ}C$이상의 eutectic 온도로 인해 3D-ICs의 구현 시에는 적용이 불가능하다. 이러한 metal 조합들에 비해 indium (In)과 tin (Sn)은 각각 $156^{\circ}C$ 및 $232^{\circ}C$로 굉장히 낮은 녹는점을 가지고 있기 때문에 In-Sn 조합은 약 $120^{\circ}C$ 정도의 상당히 낮은eutectic 온도를 갖는다. 따라서 본 연구팀은 In-Sn 조합을 이용하여 $200^{\circ}C$ 이하에서monolithic 3D-IC 구현 시 사용될 eutectic bonding 공정을 개발하였다. 100 nm SiO2가 증착된 Si wafer 위에 50 nm Ti 및 410 nm In을 증착하고, 다른Si wafer 위에 50 nm Ti 및 500 nm Sn을 증착하였다. Ti는 adhesion 향상 및 diffusion barrier 역할을 위해 증착되었다. In과 Sn의 두께는 binary phase diagram을 통해 In-Sn의 eutectic 온도인 $120^{\circ}C$ 지점의 조성 비율인 48 at% Sn과 52 at% In에 해당되는 410 nm (In) 그리고 500 nm (Sn)로 결정되었다. Bonding은 Tbon-100 장비를 이용하여 $140^{\circ}C$, $170^{\circ}C$ 그리고 $200^{\circ}C$에서 2,000 N의 압력으로 진행되었으며 각각의 샘플들은 scanning electron microscope (SEM)을 통해 확인된 후, 접합 강도 테스트를 진행하였다. 추가로 bonding 층의 In 및 Sn 분포를 확인하기 위하여 Si wafer 위에 Ti/In/Sn/Ti를 차례로 증착시킨 뒤 bonding 조건과 같은 온도에서 열처리하고secondary ion mass spectrometry (SIMS) profile 분석을 시행하였다. 결론적으로 본 연구를 통하여 충분히 높은 접합 강도를 갖는 In-Sn eutectic bonding 공정을 $140^{\circ}C$의 낮은 공정온도에서 성공적으로 개발하였다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.9
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• pp.718-723
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• 2016

The use of the scroll compressor in the air conditioning of medium-sized vehicles has increased because of its low torque fluctuation, high energy efficiency and low noise. In addition, the main components of the compressor have been changed from steel to aluminum to reduce its weight, following studies on the constituent materials. The processing precision of the fixed scroll and orbiting involute scroll wrap of the scroll compressor must be below $10{\mu}m$. To ensure this, the surface roughness and contour tolerance are measured. To improve the hardness of the orbiting scrolls using aluminum subjected to anodizing treatment and as the base material, we used a sealing treatment and measured the resulting characteristics. The aluminum materials were made of an Al-Mg-Cu based alloy including small amounts of Ni, Fe, and Zn. The surface roughness was less than $3{\mu}m$ and the processing accuracy was within $10{\mu}m$. Also, the hardness of the nanodiamonds with CNTs used in the sealing treatment was more than 450. This was found to improve the hardness of the material by 50% or more compared to the water sealing treatment and there was little difference between the use of carbon nanotubes and nanodiamonds as sealing materials.

• Journal of Welding and Joining
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• v.35 no.1
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• pp.43-48
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• 2017

Pulse TIG (Tungsten Inert Gas) welding is often considered the most difficult of all the welding processes commonly used in industry. Because the welder must maintain a short arc length, great care and skill are required to prevent contact between the electrode and the workpiece. Pulse TIG welding is most commonly used to weld thin sections of stainless steel, non-ferrous metals such as aluminum, magnesium and copper alloys. It is significantly slower than most other welding techniques and comparatively more complex and difficult to master as it requires greater welder dexterity than MIG or stick welding. The problems associated with manual TIG welding includes undercutting, tungsten inclusions, porosity, Heat affected zone cracks and also the adverse effect on health of welding gun operator due to amount of tungsten fumes produced during the welding process. This brings the necessity of automation. Hence, In this paper an attempt has been made to build a customerized setup of Pulse TIG welding based on through review of Pulse TIG welding parameters. The cost associated for making automated TIG is found to be low as compared to SPM (Special Purpose machines) available in the market.

• Tribology and Lubricants
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• v.25 no.5
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• pp.318-323
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• 2009

The oil characteristics and wear particles of Diesel engines with a DPF have been investigated as a function of a driving distance. The engine oil of SAE 5W30 with ACEA C3 is used for an oil film lubrication of the engine, which is equipped with Diesel particulate filter. Depending on the oil test results, the kinematic viscosity of used engine oils at 40 is degraded up to 5.1% compared with that of unused engine oils, SAE 5W30. And the kinematic viscosity of used engine oils at 100 is more degraded up to 8.1% compared with that of unused engine oils. The oil characteristic as a function of a mileage is not changed depending on the driving distance because of high quality of engine oils. But the aluminum and copper compounds, which are used as base materials of the engine bearing and a pin bush, are much worn and contaminated for the increased mileage of the car. The oil properties of used engine oils are relatively good except phosphorus and calcium additives, which are heavily engaged in the performance of the oils.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.23 no.6 s.165
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• pp.1048-1054
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• 1999

It is important to study the shielding effectiveness(SE) of reinforcing material of plastic composite materials against the electromagnetic(EM) waves. In this paper, SE of the shielding material of EM waves was investigated with actual experiments. The materials used in this study were made up of film, fiber and powder of conductive materials - Cu, Al, CF etc. Also, The resin film was used as matrix. The experiment was carried out by using a shielding evaluator(Shielding box) TR17302 with an ADVANTEST spectrum analyzer, model R3361C. It was found from the experimental results that copper, aluminum and carbon fiber were good candidates as a shielding material against the EM waves with increasing the SE as the composite was laminated. The characteristics of the SE against the EM waves depended on a mode of preparation of specimen. The effects of interval of wires on the SE were studied when the orientation and the space of Cu wires were changed. The SE strongly depended on the. orientation and the space of the Cu wire. SE decreased as the space of the Cu wires was increasing.

• Progress in Superconductivity
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• v.11 no.1
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• pp.78-82
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• 2009

We have fabricated a helmet type magnetoencephalogrphy(MEG) with a $1^{st}$ order gradiometer in vacuum to improve the signal-to-noise ratio(SNR) and the boil-off rate of liquid helium(LHe). The axial type first-order gradiometer was fabricated with a double relaxation oscillation SQUID(DROS) sensor which was directly connected with a pickup coil. The neck space of LHe dewar was made to be smaller than that of a conventional dewar, but the LHe boil-off ratio appeared to increase. To reduce the temperature of low Tc SQUID sensor and pickup coil to 9 K, a metal shield made of, such as copper, brass or aluminum, have been usually used for thermal transmission. But the metal shield exhibited high thermal noise and eddy current fluctuation. We quantified the thermal noise and the eddy current fluctuation of metal. In this experiment, we used the bobbin which was made of an alumina to wind Nb superconductive wire for pickup coil and the average noise of coil-in-vacuum type MEG system was $3.5fT/Hz^{1/2}$. Finally, we measured the auditory evoked signal to prove the reliability of coil-in-vacuum type MEG system.