• 대한치과보철학회지
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• 제33권4호
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• pp.645-661
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• 1995

As the mechanical property of composite resin improved, composite resin has been widely used esthetic dentistry. In the field of esthetic dentistry, the color of prosthetic material is very important. The purpose of this study was to evaluate the color difference of specimens, by the types of alloys and gold electrodeposit. Experimental groups were as follows : Group Prec : Au-Pt alloy with no gold coating and no resin veneer. Group Semi : Pd-Ag alloy with no gold coating and no resin veneer. Group BAse : Ni-Cr alloy with no gold coating and no resin veneer. Group Gsem : Pd-Ag alloy with no gold coating and no resin veneer. Group Gbas : Ni-Cr alloy with no gold coating and no resin veneer. Group PreR : Resin veneer on the Pd-Ag alloy without gold coating. Group SemR : Resin veneer on the Pd-Ag alloy without gold coating. Group GbsR : Resin veneer on the Ni-Cr alloy with gold coating Group BasR : Resin veneer on the Ni-Cr alloy without gold coating. In this study, colors of metal surfaces and veneered resins were evaluated by the CIE $L^{*}a^{*}b$ system. The results obtained were as follows : 1. different alloy types and gold coating make the $L^{*}a^{*}b$ system. 2. The ${\Delta}E^*$ab value between groups semi and Base was less than 1.5 and there was no $a^*$ and $b^*$ value difference between groups Gsem and Gbas 3. The values of $L^*$ and $a^*$ ain groups GsemR and GbasR were so similar that the ${\Delta}E^*$ab value was as small as 0.58. 4. In resin specimens with gold coated semiprecious or base alloys showed yellower and redder deviation than the resin specimens with precious alloy. 5. The ${\Delta}E^*$ab values between goups PreR-GsemR and groups PreR-GbasR were as small as 2.68 and 2.22 respectively.

• 한국표면공학회지
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• 제36권1호
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• pp.34-41
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• 2003

Effects of additives and plating conditions of high speed electroplating were investigated. The Sn content in electrodeposit was highly decreased with increasing current density from $10A/dm^2$ to $50A/dm^2$, and the current efficiency on the cathode was decreased. The carbon content in the electrodeposit was decreased with increasing current density from $10A/dm^2$ to $30A/dm^2$, however the carbon content was highly increased in the range of $40A/dm^2$$∼50A/dm^2$. The formation of tetravalent tin and stannic oxide sludge was prevented by the addition of gallic acid in the bath. The changing of Sn content in the electrodeposit is caused by the addition of gallic acid.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2003년도 추계학술발표회초록집
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• pp.94-95
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• 2003

• 한국표면공학회지
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• 제21권1호
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• pp.10-18
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• 1988

The variation of Composition and the microstructure of Zn-Ni alloy electrodespposits were investigated to the electrolysis conditions chloride bath. The codeposition mechanism is of the equilibrium type in the electrolysis condition of the high temperature(6$0^{\circ}C$)and high flow rate (1.2-3.0m/sec). The(411, 330) perferred orienation was mainly developed in the Zn-Ni electrodeposir with ${\gamma}$-phase structure, while the(422.600) orientation was closely related to the commposition and the structure of the alloy electrodeposit.

• Corrosion Science and Technology
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• 제6권5호
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• pp.233-238
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• 2007

Due to the occasional occurrence of a localizedcorrosion such as a SCC and pitting in steam generator tubing(Alloy 600), leading to a significant economical loss, an effective repair technology is needed. For a successful electrodeposition inside a tube, many processes should be developed. Among these processes, an anode to be installed inside a tube, a degreasing condition to remove any dirt and grease, an activation condition for a surface oxide elimination, a strike layer forming condition which needs to be adhered tightly between an electroforming layer and a parent tube and a condition for an electroforming layer should be established. Through a combination of these various process condition parameters, the desired material properties can be acquired. Among these process parameters, various material properties including a mechanical property and its variation along with the height of the electrodeposit inside a tube as well as its thermal stability and SCC resistance should be assessed for an application in a plant. This work deals with the material properties of the Ni electrodeposits formed inside a tube by using the anode developed in this study such as the current efficiency, hardness, tensile property, thermal stability and SCC behavior of the electrodeposit in a 40wt% NaOH solution at $315^{\circ}C$. It was found that a variation of the material properties within the entire length of the electrodeposit was quite acceptable and the Ni electrodeposit showed an excellent SCC resistance.

• 한국융합학회논문지
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• 제8권11호
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• pp.307-312
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• 2017

산업계에서는 희생양극의 원리를 이용한 아연도금이 사용되고 있다. 순수아연도금보다 내식성을 증가시키기 위한 방안의 하나로 Zn-Ni 합금도금이 개발되었다. 합금 도금층은 순 아연 도금층에 비하여 4-5배의 내식성을 가지고 있어서 도금 단가가 높음에도 불구하고 고내식성을 요구하는 자동차 부품 등에 적용이 증가되고 있다. Zn-Ni 합금도금액은 황산욕, 염화욕, 알칼리욕과 암모니아욕 등이 사용되고 있다. 여기에서는 염화욕에서 합금도금의 조성에 미치는 전해조건의 영향을 조사하였다. 그 결과는 음극 과전압 및 확산계수에 의해 설명하였다. 일반적으로 음극의 과전압이 증가함에 따라 활성화분극보다 농도분극이 중요하게 된다. 농도분극은 확산 층 내의 원소 확산에 의해 결정된다. 즉 음극의 과전압이 증가함에 따라 확산계수가 큰 Zn 함량이 증가한다.

• Corrosion Science and Technology
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• 제3권3호
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• pp.112-117
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• 2004

This work investigated the material properties of Ni-P-B alloy electrodeposits obtained from a Ni sulfamate bath as a function of the contents of the P and B sources($H_3PO_3$ and dimethyl amine borane complex(DMAB), respectively) with/without additives. Chemical composition, residual stress, microstructure and micro hardness were investigated using ICP(inductively coupled plasma) mass spectrometer, flexible strip, XRD, TEM and micro Vickers hardness tester, respectively. From the results of the compositional analysis, it was observed that P and B are incorporated competitively during the electrodeposition and the sulfur from the additive is codeposited into the electrodeposit. The measured residual stress value increased in the order of Ni, Ni-P, Ni-B and Ni-P-B electrodeposits indicating that boron affects the residual tensile stress greater than phosphorus. As the contents of the alloying element sources of P and B increased, crystallinity and the grain size of the electrodeposit decreased. The effect of boron on crystallinity and grain size was also relatively larger than the phosphorus. It can be explained that the boron with a smaller atomic radius contributes to the increase of residual stress in the tensile direction and the larger restraining force against the grain growth more significantly than the phosphorus with a larger atomic radius. Introduction of an additive into the bath retarded crystallization and grain growth, which may be attributed to the change of the grain growth kinetics induced by the additive adsorbed on the substrate and electrodeposit surfaces during electrodeposition.

• 한국표면공학회지
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• 제22권4호
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• pp.168-178
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• 1989

The compositions and microstructures of Pb-Sn alloy electrodeposits were investigated in terms of the electrolysis conditions conditions by using fluoborate bath. The Pb content of alloy deposit decreased with increasing dreasing current density until the limting content was obtained. The proferred orientation of Pb-phase in the alloy changed in the sequence of (110)longrightarrow(100)longrightarrow(100)+(110)(311)longrightarrowrandom distribution of crystals with increasing cathode overpotential, while that of $\beta$-Sn phase was (110)(301)(211)n mixed texture. The smooth surface with granular crystallites was obtained below medium current desity, while the rough surface texture was formed at high current density.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2017년도 춘계학술대회 논문집
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• pp.97-97
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• 2017

This study investigated the corrosion protection by electrodeposited copper layer on AZ31 Mg alloy with and without additional silver layer by immersion test, salt spray test, OCP transient and potentiodynamic polarization experiment. The single electrodeposited Cu layer on AZ31 Mg alloy showed a nodular structure with many imperfections of crevices between the nodules, which resulted in the fast initiation of pitting corrosion within first few hours of immersion. Double-layer coating of Cu and outer Ag layer slightly increased the initiation time for pitting corrosion. Triple-layer coatings of Cu/Ag/Cu exhibited the most efficient corrosion protection of AZ31 Mg alloy, compared to the single- and double-layer coatings. Surface morphology of the outer Cu layer in the triple-layer was changed from the nodular structure to fine particle structure with no crevices due to the presence of an additional Ag layer. Thus, the improved corrosion resistance of AZ31 Mg alloy by electrodeposited Cu/Ag or Cu/Ag/Cu layers is readily ascribed to the decreased number of imperfections in the electrodeposited layers due to the additional silver layer. It is concluded that the additional silver layer provides many nucleation sites for the second Cu plating, resulting in the formation of finer and denser structure than the first Cu electrodeposit.

• 한국표면공학회지
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• 제49권3호
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• pp.238-244
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• 2016

Copper electrodeposition on AZ91 Mg alloy was studied in views of preferential deposition on ${\alpha}$- or ${\beta}$- phases and how to achieve uniform deposition over the entire surface on ${\alpha}$- and ${\beta}$-phases in a cyanide solution. The inhomogeneous microstructure of AZ91 Mg alloy, particularly ${\alpha}$- and ${\beta}$-phases, was found to result in non-uniform deposition of zincate layer, preferential deposition of zincate on ${\beta}$-phases, which leads to non-uniform growth of copper layer during the following electrodeposition process. The preferential depositions of zincate can be attributed to higher cathodic polarizations on the ${\beta}$-phases. Pin-hole defects in the copper electrodeposit were observed at the center of large size ${\beta}$-phase particles which is ascribed to gas bubbles formed at the ${\beta}$-phases. The activation of AZ91 Mg alloy in hydrofluoric acid solution was used to obtain uniform growth of zincate layer on both the ${\alpha}$- and ${\beta}$-phases. By choosing an optimum activation time, a uniform zincate layer was obtained on the AZ91 Mg alloy surface and thereby uniform growth of copper was obtained in a cyanide copper electroplating solution.