• 대한화장품학회지
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• 제48권1호
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• pp.77-85
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• 2022

레틴알(RA)은 레티놀과 레티노익애씨드의 중간체로 비타민A 유도체이며 주름개선 효과가 우수하다. 본 연구에서는 drug-in-cyclodextrin-in-liposome (DCL)을 이용하여 레틴알의 안정성을 높였다. 레틴알과 hydroxypropyl-β-cyclodextrin (HP-β-CD) 복합체를 동결건조 방식으로 제조하였고, UV-Vis 분광법, FT-IR 및 SEM 이미지로 레틴알의 포접 여부를 확인하였다. 레틴알과 HP-β-CD의 비율이 1 : 15 (w/w)일 때 약 95.6% 포집되었다. 레틴알-HP-β-CD 복합체는 호모믹서 및 마이크로플루다이저로 리포좀에 담지시켰으며, 평균 입자 크기는 215.3 ± 4.2 nm, 제타포텐셜 -33.2 ± 1.5 mv로 나타났다. 레틴알의 분해 안정도 평가에서, 물에서 레틴알-HP-β-CD-리포좀의 레틴알 감소율은 1.8%로 레틴알-리포좀(5.8%), 레틴알-HP-β-CD복합체(9.7%), 레틴알 단독(37.6%)보다 높게 나타났다. 레틴알-HP-β-CD-리포좀이 함유된 크림(0.05% RA 함유)을 제조하여, 미간, 이마, 목, 눈가, 입가, 팔자 주름개선 효능 및 피부 치밀도를 2 ~ 4 주간 평가하였다. 그 결과 레틴알크림은 피부 자극 없이 유의한 주름 개선 효과를 보였다. 결론적으로, DCL시스템을 이용한 이중 안정화 기술은 레틴알의 안정화를 높여 피부 주름 개선 효과에 기여함을 확인하였다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 대한인간공학회지
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• 제31권2호
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• pp.379-388
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• 2012

Objective: This study developed a new shower carrier prototype to reduce caregivers' muscle burden and to increase use convenience by reflecting the needs of domestic long-term care institutions. Background: In the long-term care institutions, one of the ADL(Activities of Daily Life) factors is bathing/showering. Recently, bath/shower-assisting equipment is actively being introduced in care institutions to reduce the caregivers' care cost, but most of the domestic equipment was designed to imitate foreign products and rarely reflected the needs of care institutions. Method: Based on Korean elderly people's body information, the bed size(length: 1,900mm, width: 650mm) was set-up, and a variable headrest with a newly designed headform was developed to provide the comfort for the elderly and convenience for caregivers. To reduce caregivers' muscle burden on transferring and showering activities, a 3-step column lifting module equipped with dual actuators(lowest/highest levels from the ground: 600/1,100mm, Stroke: 500mm) was developed, and the wheelbase parameter(length: 1,250mm, width: 580mm) was defined securing the turn-over safety of the shower carrier. The drivability tests were performed for the prototype and foreign product, and the male and female subject's muscle activities were measured through the tests. Results: The structural stability of the shower carrier prototype was secured by finite element analysis, and the muscle activities of the subjects through the drivability tests largely decreased in the prototype, compared to the foreign product. Conclusion: In this study, a new shower carrier prototype was developed to possibly reduce caregivers' muscle burden and to increase use convenience based on the needs of long-term care institutions. It was expected that the drivability performance of the prototype could be relatively superior to that of the foreign product. Application: The results obtained from the study can be applied for the optimal development of a shower carrier including other equipment to effectively care for the elderly.

• 임산에너지
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• 제21권2호
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• pp.34-42
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• 2002

천연물계의 유지를 목재에 처리하여 발수성능을 평가하였다. 시험에 사용한 유지는 아마인유, 피마자유, 올리브유, 콩기름, 들기름, 해바라기 씨 기름이다. 발수성 평가는 흡습성, 흡수성 시험과 접촉각 시험으로 하였다. 발수 처리한 목재를 빛과 수분에 의해 촉진열화 시킨 후에 열화정도를 색차계로 측정하였다. 촉진열화된 처리목재의 발수성능을 흡수성시험과 접촉각 시험을 통하여 비교 측정 하였다. 흡습성 시험결과, 흡습 초기에는 무처리에비하여 흡습량이 적으나 흡습처리 시간이 증가할수록 무처리의 흡습량에 가까워져 48시간 흡습처리 후에는 흡습비의 큰 차이는 없었다. 접촉각 시험의 결과, 처리재와 무처리재간의 결과가 큰 차이를 나타내었다. 유지의 농도와 종류에 따른 접촉각 변화는 흡습성 시험과 같이 큰 차이는 나타나지 않았다. 천연유지의 발수성능으로는 기상열화에 대한 안정성이 낮았다. 천연오일 단독처리만으로는 광열화에 대한 안정성을 기대하기 어려웠다.

• 대한치과보철학회지
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• 제56권4호
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• pp.347-353
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• 2018

치아의 마모는 나이가 들어감에 따라 진행되는 정상적인 과정이지만, 과도한 마모는 교합 부조화, 기능 및 심미적인 문제를 가져온다. 특히, 구치부 지지가 상실된 경우 전치부 치아의 마모와 수직 고경의 감소가 발생할 수 있고 이로 인하여 측두 하악 관절 장애 및 비심미적인 안모 변화, 저작 효율 감소가 일어날 수 있다. 본 증례의 환자는 70세 남자 환자로 심한 치아의 마모로 인한 수직 고경 상실로 심미적인 회복을 위해 내원하였으며 구강 검사, 방사선 검사, 진단 모형 검사를 통해 수직 고경을 평가하고, 수직 고경 증가를 동반한 가철성 국소의치로 수복을 결정하였다. 10개월 간의 관찰 결과 안정적으로 교합이 유지되고 있는 것을 확인하였고, 환자의 기능적, 심미적인 만족을 얻었다.

• Journal of Chest Surgery
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• 제50권3호
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• pp.153-162
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• 2017

Background: The mesenchymal-epithelial transition factor (MET) receptor can be overexpressed in solid tumors, including small cell lung cancer (SCLC). However, the molecular mechanism regulating MET stability and turnover in SCLC remains undefined. One potential mechanism of MET regulation involves the C-terminus of Hsp70-interacting protein (CHIP), which targets heat shock protein 90-interacting proteins for ubiquitination and proteasomal degradation. In the present study, we investigated the functional effects of CHIP expression on MET regulation and the control of SCLC cell apoptosis and invasion. Methods: To evaluate the expression of CHIP and c-Met, which is a protein that in humans is encoded by the MET gene (the MET proto-oncogene), we examined the expression pattern of c-Met and CHIP in SCLC cell lines by western blotting. To investigate whether CHIP overexpression reduced cell proliferation and invasive activity in SCLC cell lines, we transfected cells with CHIP and performed a cell viability assay and cellular apoptosis assays. Results: We found an inverse relationship between the expression of CHIP and MET in SCLC cell lines (n=5). CHIP destabilized the endogenous MET receptor in SCLC cell lines, indicating an essential role for CHIP in the regulation of MET degradation. In addition, CHIP inhibited MET-dependent pathways, and invasion, cell growth, and apoptosis were reduced by CHIP overexpression in SCLC cell lines. Conclusion: C HIP is capable of regulating SCLC cell apoptosis and invasion by inhibiting MET-mediated cytoskeletal and cell survival pathways in NCI-H69 cells. CHIP suppresses MET-dependent signaling, and regulates MET-mediated SCLC motility.

• 한국산학기술학회논문지
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• 제19권2호
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• pp.1-8
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• 2018

최근 전 세계적으로 이상기후에 따른 국지성 폭우로 인한 홍수 발생과 하천제방의 노후화로 인하여 제방이 소실되고 저지대에서의 엄청난 재산 피해 및 인명 피해가 발생되고 있다. 특히 월류에 의한 제방붕괴는 약 40%에 달하는 것으로 보고되고 있다. 본 연구는 월류에 의한 제방붕괴의 원인 및 메커니즘을 파악하기 위해 수리모형실험을 수행하였고 제방의 내구성 향상을 위한 친환경 신소재인 바이오폴리머를 이용하여 월류에 따른 제방사면의 안정성 및 붕괴지연효과 등을 평가하였다. 영상계측장치를 이용한 실험분석 결과, 제방사면에 신소재 적용 시 총 제방붕괴시간은 흙 제방과 비교했을 때 약 2.25배의 차이를 보였고 신소재가 적용되지 않은 흙 제방의 경우 초기 붕괴발달속도가 약 1.43배 빠르게 나타났으며 시간이 지날수록 제체가 급격하게 붕괴되는 것을 관찰할 수 있었다. 또한 신소재 적용 제방의 붕괴메커니즘은 흙 제방에 비해 확연히 다르게 나타났으며 월류 흐름에 저항하여 사면침식속도를 경감시킴으로써 급격한 제체붕괴 예방이 가능한 것으로 평가되었다.

• KIEAE Journal
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• 제8권3호
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• pp.61-68
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• 2008

The development of urbanization in the twentieth century according to the rampant growth of industrialization not only brought about the improvement of life-quality but also induced us to reconsider the contemporary issues such as crisis of echo system which made us aware of the values and significance of the system and sustainable environments. As sustainability has been recognized as the holistic concept, it has been highlighted as one of the core concepts in the studies with the present ecological perspective. Particularly, as the plan of urbanization in Korea which had been based on the deconstruction has been converted into the regeneration, economic and cultural regeneration is also demanded for the future plan besides material regeneration. This study aims to scrutinize various attributes of socially sustainable designs in Yerba Buena Garden of San Francisco, USA which has been globally well known as a successful example of urban regeneration. By way of visit-and-observation of the place, the research for the study was conducted during the month of December, 2007. Three researchers visited Yerba Buena Garden to observe and take photographs and to obtain relevant data and public documents in local public library. Socially sustainable design was measured on the basis of such principles; social facilitation, permeability and accessibility, safely and emotional stability, softness and feminism, and child care convenience. Relevant data were systematically organized to support and prove the above principles. The result of the study is expected to effectively be utilized for Korean environment plan and design as a benchmarking guidelines against the crisis of degeneration and the aging society with the lowest birthrates in the world.

• 한국재료학회지
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• 제13권5호
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• pp.333-337
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• 2003

We report a new fabrication process for carbon nanotube field emitters with high performance. The key of the fabrication process is trim-and-leveling the carbon nanotubes grown in trench structures by employing a planarization process, which leads to a uniform distance from the carbon nanotube tip to the electrode. In order to enable this processing, spin-on-glass liquid is applied over the CNTs grown in trench to have them stubborn adhesion among themselves as well as to the substrate. Thus fabricated emitters reveal an extremely stable emission and aging characteristics with a large current density of 40 ㎃/$\textrm{cm}^2$ at 4.5 V/$\mu\textrm{m}$. The field enhancement factor calculated from the F-N plot is $1.83${\times}$10^{5}$ $cm^{－1}$ , which is a very high value and indicates a superior quality of the emitter originating from the nature of open-tip and high stability of the carbon nanotubes obtained new process.