• 한국공작기계학회논문집
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• 제17권3호
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• pp.14-19
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• 2008

In the semiconductor IC(Integrated Circuit) package, the top surface of silicon chip is directly attached to the area of the leadframe with a double-sided adhesive layer, in which the base layer have the upper adhesive layer and the lower adhesive layer. The IC package structure has been known to encounter a thermo-mechanical failure mode such as delamination. This failure mode is due to the residual stress on the adhesive surface of silicon chip and leadframe in the curing-cooling process. The induced thermal stress in the curing process has an influence on the cooling residual stress on the silicon chip and leadframe. In this paper, for the minimization of the chip surface damage, the adhesive topologies on the silicon chip are studied through the finite element analysis(FEA).

• Journal of Welding and Joining
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• 제13권2호
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• pp.106-114
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• 1995

The characteristics of adhesive bonded joint of steels for automobile were investigated. Shear and tear strength were tested and analyzed for the joints of cold rolled steel sheets bonded with three kinds of epoxy and urethane based adhesive. The results showed that the tensile shear strength and the tear strength of adhesive joint were affected by the shape of adhesive joint such as the length and width of adhesive joint. The thickness of adhesive layer was very important factor affecting the bonding strength. The shear strength increased with decrease of the thickness of adhesive layer, while the tear strength decreased as the thickness of adhesive layer decreased. In comparison with the strength of spot welded joint, the shear strength of adhesive Joint was higher than that of spot welded joint, but the tear strength of adhesive Joint was lower than that of spot welded joint.

• Journal of Welding and Joining
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• 제24권5호
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• pp.43-48
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• 2006

This paper is concerned with a fracture strength study of composite adhesive lap joints. The tests were carried out on specimen joints manufactured hybrid stacked composites such as the polyester and bamboo natural fiber layer. The main objective of the work was to test the fracture strength using hybrid stacked composites with a polyester and bamboo natural fiber layer. Tensile and peel strength of hybrid stacked composites are tested before appling adhesive bonding. From results, Natural fiber reinforced composites have lower tensile strength than the original polyester. and The load directional orientation and small amount and low thickness of bamboo natural fiber layer have a good effect on the tensile and peel strength of natural fiber reinforced composites. The failure strength of these materials applied adhesive bonding is also affected by fiber orientation and thickness of bamboo natural fiber layer. There for, Fiber orientation of bamboo natural fiber layer have a great effect on the tensile-shear strength of natural fiber reinforced composites including adhesive bonded joints.

• 반도체디스플레이기술학회지
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• 제11권2호
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• pp.71-74
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• 2012

Uniformity of the wafer temperature is one of the important factors in etching process. Plasma, chucking force, backside helium pressure and the surface temperature of ESC(electrostatic chuck) affect the wafer temperature. ESC consists of several layers of structure. Each layer has own thermal resistance and the Si-adhesive layer has highest thermal resistance among them. In this work, the temperature distribution of ESC was analyzed by 3-D FEM with various defects and the thickness deviation of the Si-adhesive layer. The result with Si-adhesive layer with the low center thickness deviation shows modified temperature distribution of ESC surface.

• 한국재난정보학회 논문집
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• 제15권2호
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• pp.259-267
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• 2019

연구목적: 본 논문에서 접착제로 접착된 원통형 랩 접합부는 피착체가 탄성이고, 접착제가 선형 점탄성이라고 가정한다. 연구방법: 피착제의 응력 분포는 유한요소법을 사용하며, 4개의 아이소파라메터 점탄성 고체 접착제를 통해 피착제에 대한 해석결과를 검증한다. 연구결과: 접착층에서의 시간에 대한 응력분포와 피착제의 두께와 탄성율이 규격화에 미치는 응력의 영향을 검토한다. 결론: 본 연구는 접착제층의 점탄성을 고려한 랩접착된 원통체의 접착제층의 응력분포에 대해서 4요소 탄성체 모델을 사용하여 수치해석을 하였다.

• 반도체디스플레이기술학회지
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• 제17권1호
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• pp.35-39
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• 2018

This paper deals with the relaxation of singular stresses developed in an epoxy adhesive at high temperature. The interface stresses are analyzed using BEM. The adhesive employed in this study is an epoxy which can be cured at room temperature. The adhesive is assumed to be linearly viscoelastic. First, the distribution of the interface stresses developed in the adhesive layer under the uniform tensile stress has been calculated. The singular stress has been observed near the interface corner. Such singular stresses near the interface corner may cause epoxy layer separated from adherent. Second, the interfacial thermal stress has been investigated. The uniform temperature rise can relieve the stress level developed in the adhesive layer under the external loading, which can be viewed as an advantage of thermal loading. It is also obvious that temperature rise reduces the bonding strength of the adhesive layer. Experimental evaluation is required to assess a trade-off between the advantageous and deleterious effects of temperature.

• Structural Engineering and Mechanics
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• 제88권6호
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• pp.609-623
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• 2023

The objective of this study is to investigate the distribution of von Mises stress, peeling stress, and shear stress in the adhesive layer used to bond two composite panels, considering various parameters using a three-dimensional finite element method. The stiffness of the materials and the effect of the stacking order on the amount of load transferred to the adhesive layer were examined to determine which type of laminate generates less stress at the bond line. The study analyzed six different stacking sequences, all with a common first layer in contact with the adhesive and a 0° orientation. Additionally, the impact of using hybrid composites on reducing bond line stress was investigated.

• 대한기계학회논문집A
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• 제24권10호
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• pp.2520-2528
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• 2000

Mechanical and physical properties of composite materials make a great difference due to their cure process condition. In order to clarify the effect of cure process condition on the microscopic damage behavior and failure mechanism of Carbon/Epoxy composites, three point bend test has been performed. For this purpose, two kinds of specimens with single adhesive and multiple adhesive layers were prepared. For single adhesive layer, four different types of specimen were used, that is, non-sanding, sanding, cocured, laminated specimens. Three different types of specimen were also used for the multiple adhesive layer, non-sanding, sanding, cocured specimens. Acoustic emission technique has also been employed to monitor the damage progresses associated with each micro-failure mechanism. The characteristics of AE parameters associated with micro-failure mechanism of each specimen were discussed.

• 보존과학연구
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• 통권29호
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• pp.255-278
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• 2008

Considering the physical quality of the wall body in this study we tried to select a replenishing that is proper for filling the cracked part of the painting wall layer and apply the natural adhesives that have traditionally been used, investigating whether it is possible to substitute those for the chemical adhesive which is used at present time. The result of this study showed the red algae adhesive was, in a weathering environment, as safe as the synthetic resin originated from the polyvinyl acetate which is used generally on the present spot, and it was concluded that although the starch adhesive displayed its superiority in enhancing the strength of the earth mortar and its work disposition, it seemed proper for it to be used as a filling adhesive for the first or midterm layer because it showed a surface hardening phenomenon. And also the glue and fish glue were judged they were not qualified as a filling adhesive due to mold occurring in a environment of high moisture that is a biological problem, showing at same time a weak physical feature in a weathering environment. Therefore it would be possible to use the red algae adhesive or starch one substituting them for the original one sold on the present market, if among natural adhesives the weak points of the them were to be corrected.

• Journal of Welding and Joining
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• 제23권6호
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• pp.67-71
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• 2005

This paper is concerned with a study on fracture strength of composites in an adhesive single lap joint. The tests were carried out on joint specimens made with hybrid stacked composites consisting of the polyester and bamboo natural fiber layer. The main objective of this work was to evaluate the fracture properties adjacent to adhesive bonded joint of natural fiber reinforced composite specimens. From the results, natural fiber reinforced composites have lower tensile strength than the original polyester. But tensile-shear strength of natural fiber reinforced composites with bamboo layer far from adhesive bond is as high as that of the original polyester adhesive bonded joints. Spew filet at the end of the overlap reduced the stress concentration at the bonded area. Spew fillet and position of bamboo natural fiber layer have a peat effect on the tensile-shear strength of natural fiber reinforced composites including adhesive bonded joints.