• Journal of Applied Reliability
• /
• v.9 no.4
• /
• pp.331-341
• /
• 2009

PSA (Pressure Sensitive Adhesive) is used for various purposes in electronic appliances such as double-sided tape for fitting parts, product's name plate, and surface protecting film, and so forth. In several kinds of PSAs, this paper dealt with the failure analysis of PET (Polyethylene Terephthalate) acrylic adhesive tapes. The causes of interface failure were investigated through the test of adhesive strength, thickness, and structure. And test standard methods to prevent recurrences were established.

• Journal of Adhesion and Interface
• /
• v.17 no.3
• /
• pp.89-95
• /
• 2016

An environmentally friendly water-based pressure sensitive adhesive (PSA) was designed in an attempt to replace the solvent-based adhesive for dry lamination used in flexible food packaging films. Instead of using a low molecular weight surfactant, which may have variable material properties, a high molecular weight dispersant was used for emulsification. A polymeric nano-dispersant (PND) was synthesized using solution polymerization, and it was used as a micelle seed in the surfactant, resulting in the synthesis of a core/shell grafted acrylic adhesive. The shell and core exhibited different $T_g$ values, so that the initial adhesion strength and holding power were complemented by the film's flexibility, which is required to provide good adhesion of thin films. Results showed that the PSA designed in this study using the PND instead of traditional low molecular weight surfactant had adhesive properties applicable to the flexible packaging with appropriate tack.

• Polymer(Korea)
• /
• v.33 no.4
• /
• pp.319-325
• /
• 2009

The solution polymerization was conducted to synthesize pressure sensitive adhesive for polarizer film using acrylic monomers. 2-Ethylhexylacrylate, butylacrylate, acrylic acid were used as acrylic monomers. The ratio was 2-ethylliexylacrylate:butylacrylate:acrylic acid=25:50:3.6 by reflecting $-40^{\circ}C$ of glass transition temperature in the pressure sensitive adhesive. When 1 wt% of coupling agent was added to the polymerized pressure sensitive adhesive, the light transmissivity was significantly increased. This result is due to the enhancement of adhesive power against liquid crystal cell by Si-O bond of coupling agents. Cross-linking agent was added by 0.5, 1.0, and 1.5 wt% with respect to the synthesized polymer. Initial tackiness decreased, while cohesion increased with increasing crosslinking agent. In the analysis of contact angle, the increase of crosslinking agents yielded the enhancement of surface energy, resulting in the decrease of contact angle. From the measurement of heat resistance, the acrylic pressure sensitive adhesive showed excellent heat resistance regardless of change in temperature and contents in crosslinking agent. In the observation of a cutting plane, the increased crosslinking agent represented a smoother and cleaner section. Comprehensively, the optimum additive amount of crosslinking agent was determined to be 1.0 wt% to monomer.

• Journal of Adhesion and Interface
• /
• v.10 no.4
• /
• pp.174-181
• /
• 2009

The viscosity for hi-solid pressure sensitive adhesive to improve water soluble low viscosity pressure sensitive adhesive polymerized using seeded polymerization. While seed binder polymerizing it produces an optimum polymerization condition, and acrylic acid and seed binder concentration changed were measurement of viscosity variation and adhesive power at the substrate (SUS420J) as flowing results. In adhesive polymerization, seed binder concentration 7 wt%/monomer was recovered 60% of solid content, 2,100 cps of low viscosity and clear adhesive film. When acrylic acid content was 4 wt%/monomer, it was turned excellent adhesive power and holding power.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.30 no.3
• /
• pp.83-90
• /
• 2020

The effect of substrate surface roughness and sintering temperature on the adhesion strength of Ag-based thick film conductors formed on AlN substrates with excellent thermal conductivity was studied. The adhesion strength of the thick-film conductor manufactured using an AlN substrate having a surface roughness (R_a) of 0.5 was higher than that of a thick-film conductor manufactured using a substrate having a surface roughness greater or smaller than this. In the case of a substrate with a surface roughness of less than 0.5, the contact area between the Ag thick film conductor and the substrate was relatively smaller than that of a substrate with a surface roughness of 0.5, resulting in a lower adhesive strength. On the other hand, when a substrate having a surface roughness of more than 0.5 was used, it was found that the conductor film was not completely adhered to the substrate, and as a result, it was found that the adhesive strength was small. In addition, it was found that the surface smoothness of the Ag-based thick film conductor film obtained by sintering at 850℃ was the best compared to the smoothness of the conductor film obtained by sintering at different sintering temperatures, and as a result, it was found that the adhesive strength of the conductor film was the highest.

• The monthly packaging world
• /
• s.315
• /
• pp.48-58
• /
• 2019

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2013.05a
• /
• pp.525-526
• /
• 2013

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2010.05a
• /
• pp.653-654
• /
• 2010

• Journal of the Korean Society of Clothing and Textiles
• /
• v.33 no.8
• /
• pp.1315-1324
• /
• 2009

This study is on the consolidation process of the conservation process of fabric with golden thread found in relics. Gold film was glued to pieces of Korean paper and satin using hide glue, which is a natural adhesive and resin Paraloid B-72, which is a liquid type adhesive. This study examines the types and concentration of the adhesives that are appropriate for consolidating gold film on fabric. The advantage of hide glue is that it is harmless to humans and has a high stability. This glue is also believed to be the closest to the adhesive that was used when the relic was originally made. Its weakness is that it is stiff and weaker than chemical glues, but after being washed with water the adhesion level increases. Therefore, hide glue is appropriate in the following instances: a) when washing after consolidation b) when the substrate of gold threads are significantly damaged, and c) when treating greater sized relics that take a longer time to work on. However, Paraloid B-72 has a better adhesion and flexibility than hide glue, but tends to spread out into a greater area, and the area where it is applied tends to absorb less water than before the application. In addition, it is noxious and can be harmful in long-term exposure. Therefore, Paraloid-72 is appropriate in the following instances: a) when consolidating the fabric after washing, and b) when working on smaller relics and consolidating smaller parts of a relic. The necessary concentration levels for consolidants for gold film are 30% for liquid type hide glue and at least 10% for Paraloid B-72 in order for the gold film to stay intact on the fabric during washing, consolidation, exhibition, and conservation.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2002.05a
• /
• pp.193-197
• /
• 2002

The tribological properties and van der Waals attractive forces and the thermal stability of films are very important characteristics of highly hydrophobic fluorocarbon (FC) films for the long-term reliability of nano system. The effect of thermal annealing on films and van der Waals attractive forces and friction coefficient of films have been investigate d in this study. It was coated Al wafer which was treated O2 and Ar that ocatfluorocyclobutane ($C_4_{8}$) and Ar were supplied to the CVD chamber in the ratio of 2:3 for deposition of FC Films. Static contact angle and dynamic contact angle were used to characterize FC films. Thickness of films was measured by variable angle spectroscopy ellipsometer (VASE). Nanotribological data was got by atomic force microscopy (AFM) to measure roughness, lateral force microscopy (LFM) to measure friction force, and force vs. distance (FD) curve to evaluate adhesion force. FC films were cured in N2 and vacuum. The film showed the slight changes in its properties after 3 hr annealing. FTIR ATR studies showed the decrease of C-F peak intensity in the spectra as the annealing time increased. A significant decrease of film thickness has been observed. The friction force of Al surface was at least thirty times higher than ones with FC films. The adhesive force of bare Al was greater than 100 nN. After deposit FC films adhesive force was decreased to 40 nN. The adhesive force of films was decreased down to 10 nN after 24 hr annealing. During 24 hr annealing in $N_2$and vacuum at $100^{\circ}C$ film properties were not changed so much.