• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.86-90
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• 2023

The packaging of electronic devices performs a protective function to ensure that their durability and reliability are not affected by changes in the operating environment caused by external factors. Recent advances in materials have led to ongoing research into bonded packaging of heterogeneous materials such as polymers and inorganic materials in electronic devices. In this packaging process, it is important to have a binding that joins the materials and ensures the operating environment, which includes adhesion to the substrate, corrosion and oxidation resistance through moisture removal, and durability. In this study, the hygroscopicity of the coating layer by modifying the polymer surface based on PVA was evaluated by controlling and measuring the contact angle, and the adhesion was confirmed by applying water-based ink and testing according to ASTM_D3363. For the durability of the polymer surface, the IPL post-treatment process was used to improve the hardness and toughness against applied voltage, and the pencil hardness test and nanoindentation test were conducted. Through this, we analyzed and proposed solutions to ensure the reliability and durability of polymer devices in polymer microfabrication against environmental factors such as moisture, temperature fluctuations and adhesion, and surface abrasion.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.371-372
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• 2012

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.98.3-98
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• 1998

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.206-208
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• 2002

Metalworking fluids (MWFs) are fluids used during machining and grinding to prolong the life of the tool , carry away debris, and protect the surfaces of work pieces. These fluids reduce friction between the cutting tool and the work surface, reduce wear and galling, Protect surface characteristics, reduce surface adhesion or welding and carry away generated heat. Workers can be exposed to MWFs by inhaling aerosols (mists) and by skin contact with the fluid. Skin contact occurs by dipping the hands into the fluid, splashes, or handling workpieces coated with the fluids. The amount of mist generated (and the result ins level of exposure) depends on many factors. To reduce the potential health risks associated with occupational exposures to MWFs, it is required to establish optimum MWFs supply method and condition with minimum Quantity in all over the mechanical machining field including high speed type heavy cult ing process.

• Macromolecular Research
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• v.17 no.11
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• pp.886-893
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• 2009

Surface modifications using a radio frequency Ar-plasma treatment were performed on a polypropylene (PP) blend used for automotive bumper fascia. The surface characterization and morphology were examined. With increasing aging time, there was an increase in wettability, oxygen containing polar functional groups (i.e., C-O, C=O and O-C=O) due to oxidation, the amount of tale, and bearing depth and roughness on the PP surface, while there was a decrease in the number of hydrocarbon groups (i.e., C-C and C-H). AFM indicated that the Ar-plasma-treatment on a PP blend surface transforms the wholly annular surface into a locally dimpled surface, leading to an improvement in wettability. SEM showed that the PP layer observed in the non-plasma-treated sample was removed after the Ar-plasma treatment and the rubber particles were exposed to the surface. The observed surface characterization and morphologies are responsible for the improved wettability and interfacial adhesion between the PP blend substrate and bumper coating layers.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.7-12
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• 2018

The effects of Ru deposition temperature and post-annealing conditions on the interfacial adhesion energies of atomic layer deposited (ALD) Ru diffusion barrier layer and Cu thin films for the advanced Cu interconnects applications were systematically investigated. The initial interfacial adhesion energies were 8.55, 9.37, $8.96J/m^2$ for the sample deposited at 225, 270, and $310^{\circ}C$, respectively, which are closely related to the similar microstructures and resistivities of Ru films for ALD Ru deposition temperature variations. And the interfacial adhesion energies showed the relatively stable high values over $7.59J/m^2$ until 250h during post-annealing at $200^{\circ}C$, while dramatically decreased to $1.40J/m^2$ after 500 h. The X-ray photoelectron spectroscopy Cu 2p peak separation analysis showed that there exists good correlation between the interfacial adhesion energy and the interfacial CuO formation. Therefore, ALD Ru seems to be a promising diffusion barrier candidate with reliable interfacial reliability for advanced Cu interconnects.

• Journal of the Korean Electrochemical Society
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• v.21 no.2
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• pp.28-38
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• 2018

Although the adhesion properties of composite electrodes are important for securing long-term reliability and realizing high energy density of lithium secondary batteries, related research has not been carried out extensively due to the limitation of measurement technology. However, surface and interfacial cutting analysis system(SAICAS), which can measure the adhesion properties while cutting and peeling a coating layer of $1{\sim}1000{\mu}m$ thickness, has been developed and applied for analyzing the adhesion properties of composite electrodes for lithium secondary batteries. Thus, this review presents not only the principle and measurement method of SAICAS but also comparison results between SAICAS and conventional peel test. In addition, application examples of SAICAS are introduced in the study of electrode design optimization, new binder derivation study, and binder distribution in composite electrode. This suggests that SAICAS is an analytical method that can be easily applied to investigate the adhesion properties of composite electrodes for lithium secondary batteries.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.566-569
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• 2001

Hot Plate is the major unit that it used to remove damp of wafer surface, to strength adhesion of photoresist(PR) and to bake coated PR in FAB process of semiconductor. It is necessary to guarantee the performance of Hot Plate(HP). Therefore, in this study designed and developed the reliability system of HP to measure and estimated thermal uniformity and flatness in temperature setting amplitude $0~250^{\circ}C$. We developed the techniques that measures and analyzes thermal uniformity using infrared thermal vision, and compensates measuring error of flatness using laser displacement sensor. For measuring flatness, we specially makes the measurement stage of 3 axes which adopts the precision encoder. The allowable error of measuring technique is less than thermal uniformity, $\pm 0.1^{\circ}C$ and flatness, $\pm 1mm$. It is expected that the developed system can measure from $\Phi$210(wafer 8") to $\Phi$356(wafer 12") and also can be used in performance test of the Cool Plate and industrial heater, etc.

• Journal of Information Display
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• v.4 no.1
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• pp.17-23
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• 2003

A thermoset type anisotropic conductive adhesive film (ACAF) comprising epoxy resin and natural butyl rubber (NBR) as the binder, micro-encapsulated imidazole as the curing agent, and Ni/Au coated polymer bead as a conductive particle has been studied. These films have been prepared to respond to requirements such as improved contact resistance, current status less of than 60 ${\mu}m$ and reliability. These films can also be used for connection between the ITO glass for LCD panel and the flexible circuit board. The curing conditions for the connection were 40, 20 and 15 seconds at 150, 170 and 190 $^{\circ}C$, respectively. The initial contact resistance and adhesion strength were 0.5 ${\Omega}/square$ and 0.4 kg/cm under the condition of 30 kgf/$^{cm}^2}$, respectively. After completing one thousand thermal shock cycling tests between -15 $^{\circ}C$ and 100 $^{\circ}C$, the contact resistance was maintained below 0.7 ${\Omega}/square$. Durability against high temperature (80$^{\circ}C$) and high humidity (85 % RH) was also tested to confirm long-term stability (1000 hrs) of the conduction.

• Journal of Adhesion and Interface
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• v.14 no.3
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• pp.135-145
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• 2013

Epoxy resin compositions were studied on the view of self-extinguishing properties without retardant additives and suitability as materials of eco-friendly EMC (Epoxy molding compound). Cured epoxy and phenolic resin composition having conjugated double bond of aromatic structure exhibited self-extinguishing properties and low heat release capacity. In this study, the structure of long conjugated double bond of hetero-atom type azomethyne group between conjugated double bonds of aromatic structure showed lower heat release capacity. Low heat release capacity seemed to be related with high reaction enthalpy, $T_g$ and reactivity affected by hetero-atom structure in azomethyne group.