• Title/Summary/Keyword: adhesion property

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Effect of the WC particle size and Co content on the adhesion property between AIP-TiN coating and WC-Co substrate (AIP-TiN/WC-Co계에서 WC입자크기와 Co함량이 밀착력에 미치는 영향)

  • 한대석;류정민;권식철;김광호
    • Journal of the Korean institute of surface engineering
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    • v.35 no.3
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    • pp.165-171
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    • 2002
  • TiN coating were deposited onto different WC-Co substrates using arc ion plating (AIP) technique. The structure and morphology for the deposited coating were characterized by x-ray diffraction (XRD) and scanning electron microscopy (SEM). The adhesion behavior of the deposited TiN coating was investigated with a conventional scratch test. Effects of WC particle size and Co content on the adhesion strength between the deposited TiN coating and substrate were studied. During the scratch test, the value of critical load was dependent of WC particle size and Co content on substrate. As the WC particle size and Co content on substrate decreased, the critical load increased. The highest critical load, approximately 110N, was obtained at WC particle size of 1$\mu\textrm{m}$ and Co content of 10wt.%.

Thin Metal Meshes for Touch Screen Panel Prepared by Photolithography (포토리소그래피 공정으로 제작된 터치스크린패널용 금속메시)

  • Kim, Seo-Han;Song, Pung-Keun
    • Journal of the Korean institute of surface engineering
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    • v.49 no.6
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    • pp.575-579
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    • 2016
  • The metal mesh films with thickness of 1.0, 1.5, $2.0{\mu}m$ were prepared by photolithography using Ag, Al, and Cu metals. Every metal films were showed C(111) preferred orientation and Ag showed the lowest resistivity and followed by Al and Cu. The transmittance of almost films were higher than 90%. But, the Ag film with thickness of $2.0{\mu}m$ was delaminated during photolithography process due to low adhesion. So, Cu and Ti metal films were introduced under Ag film to improve adhesion property. The Cu film showed higher adhesion properties compared to Ti film. Furthermore, the Ti films that deposited on Ag film showed higher acid resistance.

Preparation and Characterization of Anionic Emulsified Asphalt with Enhanced Adhesion Properties

  • Lee, Eun-Kyoung
    • Elastomers and Composites
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    • v.50 no.4
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    • pp.304-313
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    • 2015
  • In this study, the anionic emulsified asphalt was prepared by dispersing asphalt particles evenly into water with combination of anionic and nonionic surfactants. Effects of NaOH and $CaCl_2$ on the phase stability of the emulsified asphalt were also investigated through zeta potential value and rheology behavior; the emulsified asphalt added with NaOH and $CaCl_2$ showed higher zeta potential value than that the asphalt with addition of only anionic and nonionic surfactants. In addition, with regard to shear thinning behaviors, it was found that pH of the emulsified anionic asphalt and $Ca^{2+}$, counter ion, affected the phase stability. SBR (styrene-butadiene-rubber) latex, EPD (water dispersed Epoxy), PU (polyurethane) and RI-10S, SBS (styrene-butadiene-styrene)-based property improvement additive, were used and studied to enhance the adhesion properties with the aggregates. RI-10S, however, was found to be only compatible with the anionic emulsified asphalt; the coating rate, adhesion and compression strength were increased with the RI-10S content.

Development of Bioinspired Robotic Gripping Technology for Gripping Rough & Wet Surfaces based on Tactile Sensing (촉각센싱기반 거칠고 젖은 표면 파지가 가능한 생체모사 로봇용 그리핑 기술 개발)

  • Kim, Da Wan
    • The Journal of Korea Robotics Society
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    • v.17 no.3
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    • pp.282-287
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    • 2022
  • High shear adhesion on wet and rough surfaces and tactile feedback of gripping forces are highly important for realizing robotic gripper systems. Here, we propose a bioinspired robotic gripper with highly shear adhesion and sensitive pressure sensor for tactile feedback systems. To achieve them, we fabricated multi-walled carbon nanotube sensing layer on a thin polymeric adhesive layer of polydimethylsiloxane. With densely hexagonal-packed microstructures, the pressure sensor achieved 9 times the sensing property of a sensor without microstructures. We then assembled hexagonal microstructures inspired by the toe pads of a tree frog, giving strong shear adhesion under both dry and wet surfaces such as silicon (42 kPa for dry and ~30 kPa for underwater conditions) without chemical-residues after detachment. Our robotic gripper can prevent damage to weak or smooth surfaces that can be damaged at low pressure through pressure signal feedback suggesting a variety of robotic applications.

Effect of Starch and Base Paper Properties an Adhesion Problem of Corrugated Board (골판지 접착 불량에 대한 전분과 원지 특성의 영향)

  • Lee, Jin-Ho;Park, Jong-Moon;Lee, Sang-Hyun
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.38 no.2 s.115
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    • pp.43-51
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    • 2006
  • Starch is widely used as an adhesive material in the paper and corrugated board industry. The adhesion problem of corrugated board is categorized by two main parts called zipper board and white glue line. The object of this research is to investigate the factors affecting the adhesion problem by the gelatinization of various starch solutions and dynamic penetration properties measurements of various commercial base paper and handsheets. Flow property of starch solution is affected by sodium hydroxide addition and reaction level. Absorption property of commercial base papers and handsheets is affected by sizing and stock composition. Optimum bonding between top/bottom liners and corrugated medium is accomplished by acceptable flow viscosity of mixed starch solution and proper adsorption characteristic of base paper.

The Effect of Process Condition in Nano-molding on the Property of SAM (self-assembled monolayer) (나노성형 공정 조건이 자기조립 단분자막의 이형 특성에 미치는 영향)

  • Lee, Nam-Seok;Han, Jeong-Won;Kang, Shin-Ill
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2005.10a
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    • pp.83-86
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    • 2005
  • In this study, SAM (self-assembled monolayer) was applied as an anti-adhesion layer in the nano molding process, to reduce the surface energy between the nano-stamper and the moldeded polymeric nano patterns. Before depositing SAM on the stamper, the nickel stamper was pretreated to remove oxide on the nickel stamper surface. Then, using the solution deposition method, alkanethiol SAM as an anti-adhesion layer was deposited on nickel surface. To examine the effectiveness of the SAM deposition on the metallic nano stamper, the contact angle and the lateral friction force were measured at the actual processing temperature and pressure for the case of nano compression molding and at the actual UV dose for the case of nano UV molding. The surface energy due to SAM deposition on the nickel nano stamper markedly decreased and the high hydrophobic quality of SAM on the nickel stamper maintained under the actual molding environments.

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The Synthesis of Aziridine bonding agent and the Study of Characteristics (Aziridine계 Bonding agent 합성 및 특성연구)

  • Yang Eui-Seok;Ryu Hee-Jin;Yoo Kwang-Ho;Son Won-Jung;Lim Jeong-On
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 2004.10a
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    • pp.215-222
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    • 2004
  • We synthesized a aziridine bonding agent that play an important role in increasing the adhesion property between polymer binders and solid particles. It increases the physical properties of polymer-based propellant. Chemical reaction between two materials increase the interface adhesion. We analyzed and studied the chemical characteristics of the material and physical properties of a liner applied the aziridine bonding agent. We also studied the adhesion property of a liner/propellant applied the aziridine bonding agent. 3M was use as control group. In accordance with US MIS (Missile Interim Specification) we examined the chemical properties. As a result of our study, newly synthesized aziridine bonding agent was as good as quality of 3M HX-868.

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Curing Behavior and Adhesion Performance of Urea-Melamine-Formaldehyde (UMF) Resin by Staged Addition of Melamine (멜라민 첨가 순서에 따른 UMF 접착제의 경화거동과 접착력의 영향)

  • Xu, Guang-Zhu;Eom, Young-Geun;Lee, Young-Kyu;Lim, Dong-Hyuk;Lee, Byoung-Ho;Kim, Hyun-Joong
    • Journal of Adhesion and Interface
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    • v.10 no.2
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    • pp.84-89
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    • 2009
  • The objective of this research was to investigate the curing behavior and adhesion performance of urea-melamine-formaldehyde (UMF) resin for the four types of UMF-1, UMF-2, UMF-3, and UMF-4 which synthesized by the staged addition of melamine. Also, various network structures of these resin types were discussed based on their different curing behavior and adhesion performance. The curing behavior was evaluated by DMTA and thermal stability was checked by TGA. Adhesion performance was evaluated by dry and wet shear strengths and the pH value of each cured resin was checked to see its effect on the adhesion performance. The results indicated that the UMF-1 resin type by the addition of melamine initially with the urea and formaldehyde at the same F/(U+M) rate showed the lowest thermal stability, rigidity (${\Delta}E^{\prime}$), temperature of tan ${\delta}$ maximum ($T_{tan}\;_{\delta}$), and wet shear strength, and pH value of cured resin. In wet shear strength, however, the UMF-4 resin type appears to be slightly higher than UMF-1 resin type.

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Study on Adhesion and Mechanical Properties of Adhesive Resin Using Microcapsule with Isocyanate Compound (이소시아네이트를 포함하는 Microcapsule을 사용한 접착수지의 특성에 관한 연구)

  • Kim, Dong Ho;Kim, Gu Ni
    • Journal of Adhesion and Interface
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    • v.15 no.3
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    • pp.109-115
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    • 2014
  • In this study, we synthesized and identified microcapsule containing isocyanate, and investigated the mechanical and adhesion properties of polyurethane resin by adding microcapsule. We found out that the core material of microcapsule and the component weight fraction of microcapsule from the FT-IR and TGA analysis. From the results of adhesion and mechanical property tests, we confirmed that in case of using microcapsule for adhesive resin composition, adhesion strength, tensile strength and abrasion were improved by cross-linking reaction between urethane and IPDI in microcapsule.

Adhesion and Electrical Performance by Plasma Treatment on Semiconductive-Insulation Interface Layer of Silicone Rubber (실리콘 고무의 플라즈마 표면처리된 반도전-절연계면 처리에 따른 접착특성과 절연성능)

  • Hwang, Sun-Mook;Lee, Ki-Taek;Hong, Joo-Il;Huh, Chang-Su
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.05b
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    • pp.11-14
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    • 2004
  • In this paper, the effect of adhesion properties of semiconductive-insulating interface layer of silicone rubber on electrical properties was investigated. The modifications produced on the silicone surface by oxygen plasma were accessed using ATR-FTIR, contact angle and AFM. Adhesion was obtained from T-peel tests of semiconductive layer having different treatment durations. In addition, ac breakdown test was carried out for elucidating the change of electrical property with duration of plasma treatment. From the results, the treatment in the oxygen plasma produced a noticeable increase in surface energy, which can be mainly ascribed to the the creation of O-H and C=O. It is observed that adhesion performance was determined by not surface energy but roughness level of silicone surface. It is found that ac dielectric strength was increased with improving the adhesion between the semiconductive and insulating interface.

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