• Korean Journal of Materials Research
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• v.9 no.12
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• pp.1176-1180
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• 1999

The adhesion strength and high temperature/high humidity reliability of polyetherimide (PEI) adhesive on silicon wafer after being treated by each reactive ion etching (RIE) Aluminum (Al)-chelate adhesion promoter were investigated. 180$^{\circ}$ peel test and <85$^{\circ}C$ 85%> humidity test were performed for the initial adhesion strength and high temperature/high humidity reliability, respectively. For investigating surface effect scanning electron microscope (SEM), atomic force microscope (AFM), deionized (DI)-water contact angle studies were carried out. To investigate RIE effect, PEI was treated with $^O_2$ RIE, and then laminated. The initial peel strength increased slightly from 1.6 kg/cm for the first 2 minutes, and then decreased. High temp/high humid resistance decreased rapidly by RIE etching. RIE treatment on PEI affected on both of roughness and hydrophilicity increase. Aluminum-chelate adhesion promoter was coated by spinning on silicon wafer. The initial peel strength showed no effect of adhesion promoter treatment, but high temp/high humidity resistance increased remarkably. Al-chelate adhesion promoter did not affect the roughness but increased hydrophilicity.

• Journal of Adhesion and Interface
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• v.15 no.2
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• pp.49-56
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• 2014

In this study, properties of adhesion between adhesion promoter-containing rubber compound and zinc coated steel cord was investigated. Cobalt salt, resorcinol formaldehyde resin (RF resin) and hexamethoxymethylmelamine (HMMM) were used to adhesion promoter. Since cobalt salts accelerate sulphidation rate of zinc at zinc coated steel cord surface, pullout force of rubber compound applying cobalt salts was increased compared to that of rubber compound without applying cobalt salts. Pullout force and rubber coverage of rubber compounds applying all adhesion promoters were superior because strong interlocking between rubber matrix increased modulus due to applying RF resin and HMMM and grown zinc sulfides at zinc coated steel cord surface.

• Elastomers and Composites
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• v.57 no.2
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• pp.48-54
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• 2022

A polymeric adhesion promoter was synthesized to improve the adhesive strength of the Ni lead frame/epoxy composite. Poly(itaconic acid-co-acrylamide) (IAcAAM) was prepared by copolymerizing itaconic acid and acrylamide. We compared the adhesive strength between the Ni lead frame and epoxy composite according to the molecular weight of IAcAAM. The molecular weight of IAcAAM was controlled using an initiator, which made it possible to use IAcAAM in the epoxy molding compound (EMC) manufacturing process by modulating the melting temperature. The adhesive strength of Ni lead frame/epoxy composite increased with the addition of IAcAAM to the epoxy composite. In addition, as the molecular weight of IAcAAM increased, the adhesive strength of the Ni lead frame/epoxy composite slightly increased. We confirmed that IAcAAM with an appropriate molecular weight can be used in the EMC manufacturing process and increase the adhesive strength of the Ni lead frame/epoxy composite.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.531-532
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• 2006

• Bulletin of the Korean Chemical Society
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• v.35 no.10
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• pp.3025-3029
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• 2014

To realize copper-based electrode materials for printed electronics applications, it is necessary to improve the adhesion strength between conductive lines and the substrate. Here, we report the preparation of Cu pastes using (3-glycidoxypropyl) trimethoxysilane (GPTMS) prepolymer as an adhesion promoter (AP). The Cu pastes were screen-printed on glass and polyimide (PI) substrates and sintered at high temperatures (> $250^{\circ}C$) under a formic acid/$N_2$ environment. According to the adhesion strengths and electrical conductivities of the sintered Cu films, the optimized Cu paste was composed of 1.0 wt % GPTMS prepolymer, 83.6 wt % Cu powder and 15.4 wt % vehicle. After sintering at $400^{\circ}C$ on a glass substrate and $275^{\circ}C$ on a PI substrate, the Cu films showed the sheet resistances of $10.0m{\Omega}/sq$. and $5.2m{\Omega}/sq$., respectively. Furthermore, the sintered Cu films exhibit excellent adhesion properties according to the results of the ASTM-D3359 standard test.

• Journal of Adhesion and Interface
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• v.23 no.4
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• pp.108-115
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• 2022

In this study, we synthesized poly(itaconic acid-co-acrylamide) (IAcAAM) used as a novel polymer adhesion promoter to improve the adhesion strength of surface-treated Cu lead frames and epoxy composites. IAcAAM comprising itaconic acid, acrylamide was prepared through radical aqueous polymerization. The chemical structure and properties of IAcAAM was analyzed by FT-IR, ¹H-NMR, GPC, and DSC. The surface of the copper lead frame was treated with high temperature, alkali, and UV ozone to reduce the water contact angle and increase the surface energy. The adhesive strength of Cu lead frame and epoxy composite increased with the decrease of contact angle. The adhesive strength of Cu lead frame/epoxy composite increased with the addition of IAcAAM in epoxy composite. As silica content increased, the adhesive strength of Cu lead frame and epoxy composite tended to slightly decrease.

• Journal of Adhesion and Interface
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• v.19 no.4
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• pp.145-153
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• 2018

In this study, adhesion promoters with acrylate and carboxylic acid moiety were synthesized from malenized polybutadiene and 2-hydroxyethyl acrylate for producing adhesive film with low water absorption and high adhesion. The surface properties, adhesion strength, mechanical properties and water absorption of adhesive films were characterized according to the amount of acrylate and carboxylic acid in the synthesized adhesion promoters. As the carboxylic acid in the adhesion promoters increased, the adhesion strength showed a tendency to increase and the mechanical properties also improved compared to the commercial adhesion promoter. The compatibility of adhesion promoters improved remarkably due to the presence of polybutadiene (hydrophobic nature), maleic anhydride (hydrophilic nature) and carboxylic acid (hydrophilic nature).

• Journal of Adhesion and Interface
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• v.24 no.2
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• pp.54-59
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• 2023

Silver nanowire-based transparent electrodes are very attractive as a next-generation flexible and transparent electrode that can replace ITO-based flexible electrodes because they have excellent conductivity, transmittance and mechanical flexibility. However, weak understanding of the silver nanowire solution for the fabrication of silver nanowire-based transparent electrodes often cause abnormal operation of the electrical device or peeling problem of the electrode films when applied to electronic devices. Here, we studied a Hydroxypropyl Methylcellulose (HPMC) adhesion promoter, which is one of the additives for silver nanowire solution, to improve the understanding of silver nanowire solution. In detail, it is characterized how the HPMC changes the properties of silver nanowire solution and silver nanowire film, which is fabricated with silver nanowire solution including the HPMC adhesion promoter. As the characteristics of solution, polar surface tension and dispersive surface tension were measured. As the film characteristics, surface energy, surface morphology, silver nanowire density, and sheet resistance were analyzed.

• Korean Chemical Engineering Research
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• v.45 no.2
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• pp.149-154
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• 2007

Nanoimprint lithography (NIL) is useful technique because of its low cost and high throughput capability for the fabrication of sub-micrometer patterns which has potential applications in micro-optics, magnetic memory devices, bio sensors, and photonic crystals. Usually, a chemical surface treatment of the stamp is needed to ensure a clean release after imprinting and to protect the expensive original master against contamination. Meanwhile, adhesion promoter between resin and substrate is also important in the nanoscale pattern. In this work, we have investigated the effect of surface treatment using silane coupling agent as release layer and adhesion promoter for UV-Nanoimprint lithography. Uniform SAM (self-assembled monolayer) could be fabricated by vapor deposition method. Vapor phase process eliminates the use of organic solvents and greatly simplifies the handling of the sample. It was also proven that 3-acryloxypropyl methyl dichlorosilane (APMDS) could strongly improve the adhesion force between resin and substrate compared with common planarization layer such as DUV-30J or oxygen plasma treatment.

• Journal of Adhesion and Interface
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• v.19 no.4
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• pp.154-162
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• 2018

Plasma treatment and corona treatment have been used for surface modification of polydimethylsiloxane (PDMS) film by activating its surface with the -OH group. Adhesion promoter or coupling agent was also used to improve adhesion of PDMS film with various materials. However, obtained hydrophilicity onto the surface of PDMS films with those processes was transient and vulnerable. In this study, a new alkoxysilane-functionalized acrylic polymer precursor was first synthesized by copolymerization process, and then was reacted with HO-terminated PDMS through condensation reaction to prepare a new surface modifier for PDMS film. The structure and molecular weight of the prepared surface modifier were confirmed by 1H-NMR and GPC measurement. Surface properties of surface modifier-coated PDMS films were also investigated by using XPS, ATR and WCA analysis. The adhesion between the PDMS film and the surface modifier was tested using cross-cut test.