• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.697-698
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• 2010

• Journal of the Society of Disaster Information
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• v.16 no.3
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• pp.602-610
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• 2020

Purpose: This paper aims to develop an asphalt pavement system with reduced cracks, structural stability and waterproofing at sub-zero temperature conditions. Method: Under various temperature conditions, SIS polymer asphalt, normal asphalt, and guss asphalt were tested for adhesion strength of the binder and deformation strength of the mixture. Result: The adhesion strength of asphalt binder was higher in SIS polymer asphalt than that of normal asphalt and guss asphalt. The deformation strength of the asphalt mixture was almost the same as that of SIS polymer asphalt and normal asphalt. The energy absorption of the SIS polymer asphalt mixture was relatively higher than that of the normal asphalt mixture and the guss asphalt mixture. Conclusion: The maximum load of the SIS polymer asphalt mixture was lower than that of the guss asphalt mixture. However, in sub-zero temperature conditions, sufficient energy absorption was secured by stable load reduction. Therefore, it is expected to improve the durability of asphalt pavement by reducing the occurrence of microcracks with stable fracture behavior.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.41-47
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• 2020

The effect of Co interlayer on the interfacial reliability of SiN_x/Co/Cu thin film structure for advanced Cu interconnects was systematically evaluated by using a double cantilever beam test. The interfacial adhesion energy of the SiN_x/Cu thin film structure was 0.90 J/㎡. This value of the SiN_x/Co/Cu thin film structure increased to 9.59 J/㎡.Measured interfacial adhesion energy of SiN_x/Co/Cu structure was around 10 times higher than SiN_x/Cu structure due to CoSi₂ reaction layer formation at SiN_x/Co interface, which was confirmed by X-ray photoelectron spectroscopy analysis. The interfacial adhesion energy of SiN_x/Co/Cu structure decreased sharply after post-annealing at 200℃ for 24 h due to Co oxidation at SiN_x/Co interface. Therefore, it is required to control the CoO and Co₃O₄ formation during the environmental storage of the SiN_x/Co/Cu thin film to achieve interfacial reliability for advanced Cu interconnections.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.31-37
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• 2009

Cu-Cu thermo-compression bonding process was successfully developed as functions of the $N_2+H_2$ forming gas annealing conditions before and after bonding step in order to find the low temperature bonding conditions of 3-D integrated technology where the quantitative interfacial adhesion energy was measured by 4-point bending test. While the pre-annealing with $N_2+H_2$ gas below $200^{\circ}C$ is not effective to improve the interfacial adhesion energy at bonding temperature of $300^{\circ}C$, the interfacial adhesion energy increased over 3 times due to post-annealing over $250^{\circ}C$ after bonding at $300^{\circ}C$, which is ascribed to the effective removal of native surface oxide after post-annealing treatment.

• Proceedings of the Materials Research Society of Korea Conference
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• 1995.11a
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• pp.138-138
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• 1995

• Proceedings of the Korean Fiber Society Conference
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• 1991.06b
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• pp.88-88
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• 1991

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.39-46
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• 2021

The quantitative measurement of interfacial adhesion energy (Gc) of multilayer thin films for Cu interconnects was investigated using a double cantilever beam (DCB) and 4-point bending (4-PB) test. In the case of a sample with Ta diffusion barrier applied, all Gc values measured by the DCB and 4-PB tests were higher than 5 J/㎡, which is the minimum criterion for Cu/low-k integration without delamination. However, in the case of the Ta/Cu sample, measured Gc value of the DCB test was lower than 5 J/㎡. All Gc values measured by the 4-PB test were higher than those of the DCB test. Measured Gc values increase with increasing phase angle, that is, 4-PB test higher than DCB test due to increasing plastic energy dissipation and roughness-related shielding effects, which matches well interfacial fracture mechanics theory. As a result of the 4-PB test, Ta/Cu and Cu/Ta interfaces measured Gc values were higher than 5 J/㎡, suggesting that Ta is considered to be applicable as a diffusion barrier and a capping layer for Cu interconnects. The 4-PB test method is recommended for quantitative adhesion energy measurement of the Cu interconnect interface because the thermal stress due to the difference in coefficient of thermal expansion and the delamination due to chemical mechanical polishing have a large effect of the mixing mode including shear stress.

• Journal of Adhesion and Interface
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• v.7 no.2
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• pp.1-11
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• 2006

Interfacial evaluation of the untreated and treated Jute and Hemp fibers reinforced different matrix polypropylene-maleic anhydride polypropylene copolymer (PP-MAPP) composites were investigated by micromechanical technique and dynamic contact angle measurement. For the statistical tensile strength of Jute and Hemp fibers, bimodal Weibull distribution was fitted better than the unimodal distribution. The acid-base parameter on the interfacial shear strength (IFSS) of the natural fiber composites was characterized by calculating the work adhesion, $W_a$. The effect of alkaline, silane coupling agent on natural fibers were obtained with changing MAPP content in PP-MAPP matrices. Alkaline treated fibers made the surface energy to be higher due to removing the weak boundary layers and thus increasing surface area, whereas surface energy of silane treated Jute and Hemp fibers decreased due to blocked high energy sites. MAPP in the PP-MAPP matrix caused the surface energy to increase due to introduced acid-base sites. Microfailure modes of two natural fiber composites were observed clearly differently due to different tensile strength of natural fibers.

• Polymer(Korea)
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• v.39 no.3
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• pp.514-521
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• 2015

In this study, we would like to describe peel strength and dynamic shear property on various substrates of multi-layered structural double-sided adhesive tape with or without adhesive (AD) prepared by UV curing for an automobile, construction, and display junction. According to adapt the adhesive, the peel and dynamic shear strength of adhesion tape prepared with acrylic foam or various plastic substrates increased with increasing molecular weight, however, decreased over 650000 molecular weight. The adhesion property shows high value at the thin AD layer with decreasing temperature. The interface property shows highest at MW 615000 (AD-4), and the interface junction below MW 615000 resulted to divide from acrylic foam and adhesive layer. From this study, the multi-layered structural double-sided adhesive tapes seem to be a useful for industrial area such as a low surface energy plastic material and curved substrate.

• Journal of the Korean Society of Safety
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• v.30 no.1
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• pp.21-27
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• 2015

In this study, interfacial characteristics between SOFC and Ag paste as current collector was estimated in the high temperature environment. The Ag paste was used to connect the unit cell of SOFC strongly with interconnector and provide the electrical conductivity between them. To confirm electrical conductivity, Ag paste was treated in the furnace at $800^{\circ}C$ for 48 hours. The sheet resistance of Ag paste was measured to compare the resistance values before and after the heat treatment. Also, the four-point bending test was performed to measure the interfacial adhesion. The unit cell of SOFC and $SiO_2$ wafer were diced and then attached by Ag paste. The $SiO_2$ wafer had the center notch to initiate a crack from the tip of the notch. The modified stereomicroscope combined with the CCD camera and system for measuring the length was used to observe the fracture behavior. To compare the characteristics before heat treatment and after heat treatment, the specimen was exposed in the furnace at $800^{\circ}C$ for 48 hours and then the interfacial adhesion was evaluated. Finally, the interfacial adhesion energy quantitatively increases $1.78{\pm}0.07J/m^2$ to $4.9{\pm}0.87J/m^2$ between the cathode and Ag paste and also increase $2.9{\pm}0.47J/m^2$ to $5.12{\pm}1.01J/m^2$ between the anode and Ag paste through the high temperature. Therefore, it is expected that Ag paste as current collector was appropriate for improving the structural stability in the stacked SOFC system if the electrical conductivity was more increased.