• 한국전기전자재료학회논문지
• /
• 제16권12S호
• /
• pp.1181-1186
• /
• 2003

Chemical Mechanical Polishing (CMP) is an essential dielectric planarization in multilayer microelectronic device fabrication. In the CMP process, it is necessary to minimize the extent of surface defect formation while maintaining good planarity and optimal material removal rates. The polishing mechanism of W-CMP process has been reported as the repeated process of passive layer formation by oxidizer and abrasion action by slurry abrasives. Thus, it is important to understand the effect of oxidizer on W passivation layer, in order to obtain higher removal rate (RR) and very low non-uniformity (NU %) during W-CMP process. In this paper, we compared the effects of oxidizer or W-CMP process with three different kind of oxidizers with 5 wt% hydrogen peroxide such as Fe(NO$_3$)$_3$, H$_2$O$_2$, and KIO$_3$. The difference in removal rate and roughness of W in stable and unstable slurries are believed to caused by modification in the mechanical behavior of Al$_2$O$_3$ particles in presence of surfactant stabilizing the slurry.

• Carbon letters
• /
• 제27권
• /
• pp.72-80
• /
• 2018

In the present work, a comparative study of the mechanical behavior of two series of elastomeric composites, based on carboxylated styrene butadiene rubber (X-SBR) and reinforced with rice bran carbon (RBC) and graphite, is reported. Hybrid composites of X-SBR filled with RBC-graphite were also investigated in terms of the cure characteristics, hardness, tensile properties, abrasion resistance, and swelling. It was observed that the cure times decreased with the incorporation of a carbon filler whereas the torque difference, tensile strength, tensile modulus, hardness, and swelling resistance increased compared to the neat X-SBR revealing a favorable characteristic of crosslinking. Dynamic rheological analysis showed that the G' values of the composites, upon the addition of RBC-graphite, were changed to some extent. This demonstrates that the presence of a strongly developed network of fillers will ensure a reinforcing characteristic in a polymer matrix.

• 한국표면공학회지
• /
• 제27권4호
• /
• pp.193-206
• /
• 1994

A wear behavior of electroless (Ni-P-X, X: SiC, $Al_2O_3$, Diamond) composite coating layers, formed under various conditions on commerical grade low carbon steel, has been investigated using Taber abrasion tester and scanning electron microscope. Several factors, which are type of particles, co-deposited content, particle size, distribution of particles and heat-treatment, influenced the wear resistance. The wear resistance of the composited coating layers after heat-treatment at $400^{\circ}C$ for 1 hr was increased 70 times with diamond, 15 times with SiC and 8 times with $Al_2O_3$, compared with the electroless nickel plating layer without heat-treatment.

• Elastomers and Composites
• /
• 제57권3호
• /
• pp.92-99
• /
• 2022

A large amount of particles on the roads is produced by friction between the vehicles and the road surface and by inflow from outside. The type of these particles affects the abrasion behavior of tire tread. In this study, road dust collected at a bus stop was separated by size, and the particles with sizes of 106-212 mm were analyzed. The particles were separated by density using NaI and NaBr aqueous solutions with densities in the range of 1.10-1.80 g/cm³ with the 0.10 g/cm³ interval. In the road dust sample, the following particle types were found: tire-road wear particles (TRWPs), asphalt pavement wear particles (APWPs), plant-related particles (PRPs), road paint wear particles (RPWPs), and plastic particles (PPs). The densities of TRWPs, APWPs, PRPs, and RPWPs were 1.20-1.80, >1.60, >1.10, and >1.40 g/cm³, respectively, while PPs were found in all density ranges. Additionally, many small mineral particles were observed on the particles. Order of the relative content of the particles was PRP > TRWP > APWP ~ RPWP > PP. APWPs that were stuck to TRWP could be removed by chloroform treatment. The shapes of the particles were characterized using their magnified images.

• 한국산업융합학회 논문집
• /
• 제25권6_2호
• /
• pp.987-992
• /
• 2022

STS 410, a representative martensitic stainless steel, contains 13 % chromium and is used for building materials, automobile parts, office equipment, kitchen utensils, and tableware. In general, the strength of STS 410 changes by the carbon content, and STS 410 of low carbon has excellent toughness and high carbon has excellent abrasion resistance. In this study, a fatigue test was performed on the STS 410 material to evaluate the exact fatigue limit and to evaluate the behavior of the material against fatigue. In addition, the effect on burnishing, a kind of plastic processing that creates a smooth surface by pressing a ball or roller on the inner and outer surfaces of the material was evaluated. The fatigue limit was 509 MPa for the STS 410 material, and the result was 54.5 % of the tensile strength. The fatigue limit was 542 MPa for the specimen of diamind burnished STS 410 material, and it was 58.5 % of the tensile strength.

• 한국재료학회지
• /
• 제33권10호
• /
• pp.422-429
• /
• 2023

High-strength low-alloy steel is one of the widely used materials in onshore and offshore plant engineering. We investigated the alloying effect of solute atoms in α-Fe based alloy using ab initio calculations. Empirical equations were used to establish the effect of alloying on the Vicker's hardness, screw energy coefficient, and edge dislocation energy coefficient of the steel. Screw and edge energy coefficients were improved by the addition of V and Cr solute atoms. In addition, the addition of trace quantities of V, Cr, and Mn enhanced abrasion resistance. Solute atoms and contents with excellent mechanical properties were selected and their thermal conductivity and thermal expansion behavior were investigated. The addition of Cr atom is expected to form alloys with low thermal conductivity and thermal expansion coefficient. This study provides a better understanding of the state-of-the-art research in low-alloy steel and can be used to guide researchers to explore and develop α-Fe based alloys with improved properties, that can be fabricated in smart and cost-effective manners.

• 한국도로학회:학술대회논문집
• /
• 한국도로학회 2002년도 학술발표회 논문집
• /
• pp.89-92
• /
• 2002

본 연구의 목적은 여러 가지의 폐자원중 슬래그 및 폐주물사의 도로포장용 골재로서의 특성을 평가하고, 이를 이용한 다양한 조합의 재활용 아스팔트 혼합물의 소성변형 특성을 평가하는 것이다. 골재특성을 평가하기 위해 입도 및 입형분석, 비중 및 흡수성, 마모저항성, 골재안정성과 같은 시험을 수행하였다. 골재로서의 특성평가 시험 결과 고로슬래그는 비교적 강도 특성이 제강슬래그에 비해 작은 경향을 나타냈다. 마샬배합설계로서 최적 아스팔트 함량이 결정되었고, 그 범위는 7.2%에서 7.5%정도 였다. 재활용 골재를 이용한 조합의 아스팔트 혼합물의 소성변형 특성을 평가하기 위해 간접인장강도시험, 회복탄성계수시험, 크리프 시험을 수행하였다. 재활용 골재를 이용한 아스팔트 혼합물의 소성변형 특성이 일반골재를 이용한 아스팔트 혼합물에 비해 다소 떨어지는 경향을 나타내었다. 다만 현재진행중인 휠트래킹 시험 결과가 나오면 재활용 골재를 활용한 아스팔트 혼합물의 소성변형특성을 좀더 구체적으로 파악할 수 있을 것으로 판단된다.

• 한국추진공학회지
• /
• 제17권5호
• /
• pp.113-120
• /
• 2013

마모 마찰기구로 널리 사용되는 그라파이트에 대하여, 고온가스 조절 밸브 내에서 가스 유입 방지용 씰링 그라파이트 소재(HK-6)의 고온 마모 거동에 대하여 연구하였다. 구동축과 라이너 사이에 위치하여 지속적인 마모의 발생을 모사하기 위해 왕복동 마모 시험을 수행하였다. 마모 거동 변화의 영향 인자로 접촉 하중, 미끄럼 속도, 온도를 설정하고 민감도를 확인하였다. 마모 발생이 가장 적고 씰링 그라파이트 소재(HK-6)의 효율이 증대되는 최적조건에 대해 논의하였다.

• 한국터널지하공간학회 논문집
• /
• 제20권2호
• /
• pp.453-467
• /
• 2018

쉴드 TBM 공사에서 굴진율 예측과 마모량 예측은 설계 및 시공 단계에서 공사비와 공기를 추정하는데 매우 중요한 요소이다. 암반지반용 TBM의 경우 실험이나 축적된 현장 data를 기반으로 CSM 모델, NTNU 모델 등이 커터 마모량부터 굴진율 예측까지 널리 사용되고 있으나, 토사지반용 TBM은 지반의 복잡성과 정확한 실험방법의 부재로 인해 이를 정확하게 예측할 수 있는 모델이 없는 실정이다. 본 연구에서는 기존에 존재하는 토사지반용 TBM 실험장치들의 단점을 개선하여 TBM 굴착과정을 모사한 실험 장치(Soil Abrasivity Penetration Test, SAPT)를 개발하였다. 회전당 관입 깊이, RPM, 첨가재(foam) 배합비 및 농도 등의 TBM 굴진에 영향을 미치는 주요 변수들에 대한 시험을 실시하여 추력, 토크 등의 변화를 살펴보고 마모량을 측정하였다. 모래(규사) 70%와 점토(일라이트) 30%로 조성된 인공시료에 대한 실험 결과 foam 배합비가 굴진성능과 마모량에 주요한 영향을 끼치는 것으로 나타났다.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
• /
• pp.546-546
• /
• 2008

Copper (Cu) Chemical mechanical polishing (CMP) has been an essential process for Cu wifing of DRAM and NAND flash memory beyond 45nm. Copper has been employed as ideal material for interconnect and metal line due to the low resistivity and high resistant to electro-migration. Damascene process is currently used in conjunction with CMP in the fabrication of multi-level copper interconnects for advanced logic and memory devices. Cu CMP involves removal of material by the combination of chemical and mechanical action. Chemicals in slurry aid in material removal by modifying the surface film while abrasion between the particles, pad, and the modified film facilitates mechanical removal. In our research, we emphasized on the role of chemical effect of slurry on Cu CMP, especially on the effect of amine functional group on removal rate selectivity between Cu and Tantalum-nitride (TaN) film. We investigated the two different kinds of complexing agent both with amine functional group. On the one hand, Polyacrylamide as a polymer affected the stability of abrasive, viscosity of slurry and the corrosion current of copper film especially at high concentration. At higher concentration, the aggregation of abrasive particles was suppressed by the steric effect of PAM, thus showed higher fraction of small particle distribution. It also showed a fluctuation behavior of the viscosity of slurry at high shear rate due to transformation of polymer chain. Also, because of forming thick passivation layer on the surface of Cu film, the diffusion of oxidant to the Cu surface was inhibited; therefore, the corrosion current with 0.7wt% PAM was smaller than that without PAM. the polishing rate of Cu film slightly increased up to 0.3wt%, then decreased with increasing of PAM concentration. On the contrary, the polishing rate of TaN film was strongly suppressed and saturated with increasing of PAM concentration at 0.3wt%. We also studied the electrostatic interaction between abrasive particle and Cu/TaN film with different PAM concentration. On the other hand, amino-methyl-propanol (AMP) as a single molecule does not affect the stability, rheological and corrosion behavior of the slurry as the polymer PAM. The polishing behavior of TaN film and selectivity with AMP appeared the similar trend to the slurry with PAM. The polishing behavior of Cu film with AMP, however, was quite different with that of PAM. We assume this difference was originated from different compactness of surface passivation layer on the Cu film under the same concentration due to the different molecular weight of PAM and AMP.