• Title/Summary/Keyword: a-C:H thin film

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Preparation of Paraelectric PLT Thin Films Using Reactive Magnetron Sputtering of Multicomponent Metal Target

  • Kim, H.H.;Sohn, K.S.;Casas, L.M.;Pfeffer, R.L.;Lareau, R.T.
    • Electrical & Electronic Materials
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    • v.11 no.10
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    • pp.53-59
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    • 1998
  • Paraelectric lead landthanum titanate(PLT) thin films have been prepared by a reactive dc magnetron sputtering system using a multicomponent metal target. The surface area control of each element on the target markedly facilitates the fabrication of thin films of complex ceramic compounds. A postdeposition heat-treatment was applied to all as-deposited PLT thin films at annealing temperatures up to 75$0^{\circ}C$ for crystalization. The composition of the PLT(28) thin filmannealed at $650^{\circ}C$ was: Pb, 0.73; La, 0.28; Ti, 0.88; O, 2.9. The dielectric constant and dissipation factor of the thin film(200 nm) at low filed measurements (500 Vcm-1) are 1216 and 0.018, respectively. The charge storage density using a typical Sawyer-Tower circuit with a 500 Hz sine wave was 12.5 $\mu$Ccm-2 at the electric field of 200 kVcm-1.

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Electrical and Optical Characteristics of ZnO:Al Films Prepared by rf Magnetron Sputtering for Thin Film Solar Cells Application (rf 마그네트론 스파터법에 의해 제조된 태양전지용 ZnO:Al 박막의 전기 광학적 특성)

  • Jeon, Sang-Won;Lee, Jeong-Chul;Park, Byung-Ok;Song, Jin-Soo;Yoon, Kyung-Hoon
    • Korean Journal of Materials Research
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    • v.16 no.1
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    • pp.19-24
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    • 2006
  • ZnO:Al(AZO) films prepared by rf magnetron sputtering on glass substrate and textured by post-deposition chemical etching were applied as front contact and back reflectors for ${\mu}c$-Si:H thin film solar cells. For the front transparent electrode contact, AZO films were prepared at various working pressures and substrate temperature and then were chemically etched in diluted HCl(1%). The front AZO films deposited at low working pressure(1 mTorr) and low temperature ($240^{\circ}C$) exhibited uniform and high transmittance ($\geq$80%) and excellent electrical properties. The solar cells were optimized in terms of optical and electrical properties to demonstrate a high short-circuit current.

Effect of H2S Concentration and Sulfurization Temperature on the Properties of Cu2ZnSnS4 Thin Films

  • Arepalli, Vinaya Kumar;Kim, Eui-Tae
    • Korean Journal of Materials Research
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    • v.25 no.12
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    • pp.708-712
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    • 2015
  • This study reports the effects of $H_2S$ gas concentration on the properties of $Cu_2ZnSnS_4(CZTS)$ thin films. Specifically, sulfurization process with low $H_2S$ concentrations of 0.05% and 0.1%, along with 5% $H_2S$ gas, was studied. CZTS films were directly synthesized on Mo/Si substrates by chemical bath deposition method using copper sulfate, zinc sulfate heptahydrate, tin chloride dihydrate, and sodium thiosulfate pentahydrate. Smooth CZTS films were grown on substrates at optimized chemical bath deposition condition. The CZTS films sulfurized at low $H_2S$ concentrations of 0.05 % and 0.1% showed very rough and porous film morphology, whereas the film sulfurized at 5% $H_2S$ yielded a very smooth and dense film morphology. The CZTS films were fully crystallized in kesterite crystal form when they were sulfurized at $500^{\circ}C$ for 1 h. The kesterite CZTS film showed a reasonably good room-temperature photoluminescence spectrum that peaked in a range of 1.4 eV to 1.5 eV, consistent with the optimal bandgap for CZTS solar cell applications.

Microstructural evolution of tantalum nitride thin films synthesized by inductively coupled plasma sputtering

  • Sung-Il Baik;Young-Woon Kim
    • Applied Microscopy
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    • v.50
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    • pp.7.1-7.10
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    • 2020
  • Tantalum nitride (TaNx) thin films were grown utilizing an inductively coupled plasma (ICP) assisted direct current (DC) sputtering, and 20-100% improved microhardness values were obtained. The detailed microstructural changes of the TaNx films were characterized utilizing transmission electron microscopy (TEM), as a function of nitrogen gas fraction and ICP power. As nitrogen gas fraction increases from 0.05 to 0.15, the TaNx phase evolves from body-centered-cubic (b.c.c.) TaN0.1, to face-centered-cubic (f.c.c.) δ-TaN, to hexagonal-close-packing (h.c.p.) ε-TaN phase. By increasing ICP power from 100 W to 400 W, the f.c.c. δ- TaN phase becomes the main phase in all nitrogen fractions investigated. The higher ICP power enhances the mobility of Ta and N ions, which stabilizes the δ-TaN phase like a high-temperature regime and removes the micro-voids between the columnar grains in the TaNx film. The dense δ-TaN structure with reduced columnar grains and micro-voids increases the strength of the TaNx film.

Hydrogenated a-Si TFT Using Ferroelectrics (비정질실리콘 박막 트랜지스터)

  • Hur Chang-Wu
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.9 no.3
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    • pp.576-581
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    • 2005
  • In this paper. the a-Si:H TFT using ferroelectric of $SrTiO_3$ as a gate insulator is fabricated on glass. High k gate dielectric is required for on-current, threshold voltage and breakdown characteristics of TFT Dielectric characteristics of ferroelectric are superior to $SiO_2$ and $Si_3N_4$. Ferroelectric increases on-current and decreases threshold voltage of TFT and also ran improve breakdown characteristics.$SrTiO_4$ thin film is deposited by e-beam evaporation. Deposited films are annealed for 1 hour in N2 ambient at $150^{\circ}C\~600^{\circ}C$. Dielectric constant of ferroelectric is about 60-100 and breakdown field is about IMV/cm. In this paper, the TFT using ferroelectric consisted of double layer gate insulator to minimize the leakage current. a-SiN:H, a-Si:H (n-type a-Si:H) are deposited onto $SrTiO_3$ film to make MFNS(Metal/ferroelectric/a-SiN:H/a-Si:H) by PECVD. In this paper, TFR using ferroelectric has channel length of$8~20{\mu}m$ and channel width of $80~200{\mu}m$. And it shows that drain current is $3.4{\mu}A$at 20 gate voltage, $I_{on}/I_{off}$ is a ratio of $10^5\~10^8,\;and\;V_{th}$ is$4\~5\;volts$, respectively. In the case of TFT without having ferroelectric, it indicates that the drain current is $1.5{\mu}A$ at 20gate voltage and $V_{th}$ is $5\~6$ volts. If properties of the ferroelectric thin film are improved, the performance of TFT using this ferroelectric thin film can be advanced.

Characteristics of Copper Vanadium Oxide$(Cu_{0.5}V_2O_5)$ Cathode for Thin Film Microbattery (구리-바나듐 산화물 박막의 양극 특성 및 전 고상 전지의 제작)

  • Lim Y. C.;Nam S. C.;Park H. Y.;Yoon Y. S.;Cho W. I.;CHo B. W.;Chun H. S.;Yun K. S.
    • Journal of the Korean Electrochemical Society
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    • v.3 no.4
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    • pp.219-223
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    • 2000
  • All-solid state lithium rechargeable thin film batteries were fabricated with the configuration of$Cu_{0.5}V_2O_5/Lipon/Li$ using sequential thin film techniques. Copper vanadium oxide thin films and Lipon thin films were prepared by DC reactive dual source magnetron sputtering and RF magnetron sputtering, respectively. According to XRD analysis, we found out that copper vanadium oxide thin films were amorphous. The electrochemical behaviour of them was examined in half cell system using EC : DMC(1:1 in IM $LiPF_5$) liquid electrolyte. The ionic conductivity of Lipon thin film was $1.02\times10^{-6}S/cm$ at $25^{\circ}C$ and $Cu_{0.5}V_2O_5/Lipon/Li$ cell showed that the discharge capacity was about $50{\mu}Ah/cm^2{\mu}m$ beyond 500cyc1es.

Two-step Electroless Plated Pt Ohmic Contacts to p-type InGaAs

  • Im, Hung-Su;Wang, Kai;Kim, Geun-Woo;Chang, Ji-Ho;Koo, Bon-Heun
    • Journal of Surface Science and Engineering
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    • v.43 no.2
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    • pp.47-50
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    • 2010
  • This work discusses a two-step electroless plating method for preparing a Pt thin film on p-type InGaAs substrate, which is defined as Pt I and Pt II. A thin Pt catalytic layer formed in Pt I bath on the substrate at $65^{\circ}C$. In the following Pt II bath, thick Pt films then easily grew on the sensitized layer on InGaAs previously formed in the Pt I bath. The growth of Pt film is strongly influenced by the plating temperature and pH value. To study the plating time effect, the plating of Pt II bath is 5 to 40 min at $80^{\circ}C$ after using Pt I bath at 50~$65^{\circ}C$ for 5min of pH 8~13. Pt film for ohmic contact to p-type InGaAs was successfully prepared by using the two-step Pt electroless plating.

Electro-Optical Performances of In plane Switching (IPS) Cell on the Inorganic Thin Film by Ion Beam (IB) Method

  • Kim, Sang-Hoon;Hwang, Jeoung-Yeon;Kim, Jong-Hwan;Han, Jung-Min;Seo, Dae-Shik;Kim, Sung-Yeon;Oh, Byeong-Yun;Myoung, Jae-Min
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.796-799
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    • 2006
  • We studied the nematic liquid crystal (NLC) alignment capability by the Ion beam (IB) alignment method on a NDLC (Nitrogen doped Diamond Like Carbon) as a C:H thin film, and investigated electro-optical (EO) performances of the IB aligned In plane switching (IPS) cell with NDLC surface. A good LC alignment by IB exposure on a NDLC surface was achieved. Monodomain alignment of the IB aligned IPS cell can be observed. The good electro-optical characteristics of the IB aligned IPS cell was observed with oblique IB exposure on the NDLC as a-C:H thin film for 1min.

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Electro-Optical Performances of In plane Switching(IPS) Cell on the Inorganic Thin Film by Ion Beam(IB) Method (NDLC박막에 이온빔배향법을 사용한 In Plane Switching(IPS) cell의 전기광학특성)

  • Kim, Sang-Hoon;Kim, Jong-Hwan;Kang, Dong-Hoon;Kim, Young-Hwan;Hwang, Jeoung-Yeon;Seo, Dae-Shik
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.04a
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    • pp.64-65
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    • 2006
  • We studied the nematic liquid crystal (NLC) alignment capability by the IB(on bean) alignment method on a NDLC(Nitrogen Diamond Like Carbon) as a-C:H thin film, and investigated electro-optical performances of the IB aligned IPS(In plane switching}cell with NDLC surface. A good LC alignment by IB exposure on a NDLC surface was achieved. Monodomain alignment of the IB aligned IPS cell can be observed. The goodelectro-optical (EO) characteristics of the IB aligned IPS cell was observed with oblique IB exposure on the NDLC as a-C:H thin film for 1 min.

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Optimization of annealing conditions in oxide-precursor-based MOD process for YBCO thin films (산화물 전구체를 이용한 YBCO 박막제조에서 열처리조건의 최적화)

  • Heo S. Y.;Kim Y. K.;Yoo J. M.;Ko J. W.;Hong G. W.;Lee H. G.;Yoo S. I.
    • Progress in Superconductivity
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    • v.6 no.2
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    • pp.118-123
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    • 2005
  • A low cost YBCO oxide powder was employed as a starting precursor for MOD process. YBCO oxide is advantageous over metal acetates or TFA salts which are popular starting precursors for conventional MOD-TFA process because that YBCO oxide precursor is cheap and easy to control molar ratio. YBCO thin films were prepared by this oxide-precursor-based MOD process and annealing condition was optimized. The YBCO thin film annealed at below $780^{\circ}C$ shows no transport $I_c$ and poor microstructure. Raman spectroscopic study of YBCO thin film indicates that YBCO thin film prepared at below $780^{\circ}C$ contains a number of imperfections such as non-superconducting $BaCuO_2$ phase, cation disorder, etc. However, the YBCO thin film treated at above $800^{\circ}C$ shows improvement in microstructure and current transport properties. This research was supported by a grant from Center for Applied Superconductivity Technology of the 21st Century Frontier R&D Program funded by the Ministry of Science and Technology, Republic of Korea.

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