• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.129-129
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• 2003

최근에 능동 영역 액정 표시 소자(Active Matrix Liquid Crystal Display, AMLCD)에서 고해상도와 빠른 응답속도를 요구하게 되면서부터 다결정 실리콘(poly-Si) 박막 트랜지스터(Thin Film Transistor, TFT)가 쓰이게 되었다. 그리고 일반적으로 디스플레이의 기판을 상대적으로 저가의 유리를 사용하기 때문에 저온 공정이 필수적이다. 따라서 새로운 저온 결정화 방법과 부가적으로 최근 디스플레이 개발 동향 중 하나인 대화면에 적용 가능한 공정인 금속유도 결정화 (Silicide Mediated Crystallization, SMC)가 연구되고 있다. 이 소자는 top-gated coplanar구조로 설계되었다. (그림 1)(100) 실리콘 웨이퍼위에 3000$\AA$의 열산화막을 올리고, LPCVD로 55$0^{\circ}C$에서 비정질 실리콘(a-Si:H) 박막을 550$\AA$ 증착 시켰다. 그리고 시편은 SMC 방법으로 결정화 시켜 TEM(Transmission Electron Microscopy)으로 SMC 다결정 실리콘을 분석하였다. 그 위에 TFT의 게이트 산화막을 열산화막 만큼 우수한 TEOS(Tetraethoxysilane)소스로 사용하여 실리콘 산화막을 1000$\AA$ 형성하였고 게이트는 3000$\AA$ 두께로 몰리브덴을 스퍼터링을 통하여 형성하였다. 이 다결정 실리콘은 3$\times$10^15 cm^-2의 보론(B)을 도핑시켰다. 채널, 소스, 드래인을 정의하기 위해 플라즈마 식각이 이루어 졌으며, 실리콘 산화막과 실리콘 질화막으로 passivation하고, 알루미늄으로 전극을 형성하였다 그리고 마지막에 TFT의 출력특성과 전이특성을 측정함으로써 threshold voltage, the subthreshold slope 와 the field effect mobility를 계산하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.1
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• pp.7-15
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• 2004

The ferroelectric SBT thin films as a material of capacitors for non-volatile FRAMs have some problems that its remanent polarization value is relatively low and the crystallization temperature is quite high abovc 80$0^{\circ}C$. Therefore, in this paper, SBTN solution with S $r_{0.9}$B $i_{2.1}$T $a_{1.8}$N $b_{0.2}$$O_{9}$ composition was synthesized by sol-gel method. Sr(O $C_2$ $H_{5}$)$_2$, Bi(TMHD)$_3$, Ta(O $C_2$ $H_{5}$)$_{5}$and Nb(O $C_2$ $H_{5}$)$_{5}$ were used as precursors, which were dissolved in 2-methoxyethanol. SBTN thin films with 200 nm thickness were deposited on Pt/Ti $O_2$/ $SiO_2$/Si substrates by spin-coating. UV-irradiation in a power of 200 W for 10 min and rapid thermal annealing in a 5-Torr-oxygen ambient at 76$0^{\circ}C$ for 60 sec were used to promote crystallization. The films were well crystallized and fine-grained after annealing at $650^{\circ}C$ in oxygen ambient. The electrical characteristics of 2Pr=11.94 $\mu$C/$\textrm{cm}^2$, Ps＋/Pr＋=0.54 at the applied voltage of 5 V were obtained for a 200-nm-thick SBTN films. This results show that 2Pr values of the UV irradiated and rapid thermal annealed SBTN thin films at the applied voltage of 5 V were about 57% higher than those of no additional processed SBTN thin films. thin films.lms.s.s.

• KIEE International Transactions on Electrophysics and Applications
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• v.11C no.2
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• pp.32-36
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• 2001

We investigate the surface order, defects and morphology of hexagonal columnar mesophases, Having a crown ether at one end which forms the center of the column and three fluorinated tails at the other, The orientation of the columns was successfully controlled by surface anchoring: Columns were aligned perpendicularly to an evaporated carbon surface, and the planar alignment do asymmetric compounds was induced by a water surface. TEM images show that there is a high degree of perfection in the packing do the cylinders. The hexagonal columnar mesophase (F(sub)h) was confirmed by direct images and the corresponding electron diffractions, where ordered cylindrical moieties are packed on a hexagonal lattice. The column of 12F8-ABG-15C5 was much straighter, compared with that of 12F8-AG-B15C5, resulting from the degrees of regular stacking. Elementary edge dislocation, grain boundary and +1/2 disclination have been observed, although the defects are generally rare.

• Korean Journal of Materials Research
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• v.21 no.1
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• pp.1-7
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• 2011

Methods of producing hydrogen include steam reforming, electrochemical decomposition of water, and the SI process. Among these methods, the Sulfur iodine process is one of the most promising processes for hydrogen production. The thermochemical sulfur-iodine (SI) process uses heat from a high-temperature-gas nuclear reactor to produce $H_2$ gas; this process is known for its production of clean energy as it does not emit $CO_2$ from water. But the SI-process takes place in an extremely corrosive environment for the materials. To endure SI environments, the materials for the SI environment will have to have strong corrosion resistance. This work studies the corrosion resistances of the Fe-Si, Ni-Ti and Ni Alloys, which are tested in SI-process environments. Among the SI-process environments, the conditions of boiling sulfuric acid and decomposed sulfuric acid are selected in this study. Before testing in boiling sulfuric acid environments, the specimens of Fe-4.5Si, Fe-6Si, Ni-4.5Si, Ni-Ti-Si-Nb and Ni-Ti-Si-Nb-B are previously given heat treatment at $1000^{\circ}C$ for 48 hrs. The reason for this heat treatment is that those specimens have a passive film on the surface. The specimens are immersed for 3~14 days in 98wt% boiling sulfuric acid. Corrosion rates are measured by using the weight change after immersion. The corrosion rates of the Fe-6Si and Ni-Ti-Si-Nb-B are found to decrease as the time passes. The corrosion rates of Fe-6si and Ni-Ti-Si-Nb-B are measured at 0.056 mm/yr and 0.16 mm/yr, respectively. Hastelloy-X, Alloy 617, Alloy 800H and Haynes 230 are tested in the decomposed sulfuric acid for one day. Alloy 800H was found to show the best corrosion resistance among the materials. The corrosion rate of Alloy 800H is measured at -0.35 mm/yr. In these results, the corrosion resistance of materials depends on the stability of the oxide film formed on the surface. After testing in boiling sulfuric acid and in decomposed sulfuric acid environments, the surfaces and compositions of specimens are analyzed by SEM and EDX.

• Journal of Welding and Joining
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• v.20 no.6
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• pp.72-72
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• 2002

Corrosion and tensile properties of zircaloy-4 cladding tube having a laser welding part in elevated temperature are studied to present the criterion of quality evaluation in nuclear reactor and find the scientific basis of SCC, with laser welding method using by coupling up cladding tube to end cap. In the result of tensile test(400℃), the fracture is not happened in the welding part but base metal and the result of corrosion test(400℃ 1500psi steam), corrosion rate of the molten zone and PMZ is a little higher than the other zone.

• Journal of the Korean Magnetics Society
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• v.4 no.1
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• pp.25-31
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• 1994

The magnetic properties of aluminum anodized film in which Co-Fe alloy electrodeposited are investigated with regard to the alloy composition of magnetic films. The electrodeposited Co-Fe particles are confirmed to be single phase Co-Fe alloys by X-ray diffractions. At 34 at% Co, the sample with small pore diameter(particle diameter $150\;{\AA}$) has a large magnetic energy product($B_{max}$) of about 1.44 MGOe due to the large saturation magnetization, the high coercive force and good squareness of the M-H curve. However, for the samples with particle diameter larger than $450\;{\AA}$, the bottom of each particle forms abnormal particle claaed branch-shaped unlike the sample of the particle diameter $150\;{\AA}$. In this case, the magnetic anisotropy energy was about zero at the compositions of 45 and 75 at% Co. Moreover, at the compositions from 50 to 70 at% Co, the anisotropy became negative value. This means that an easy axis of magnetization of the film is in plane in plane in spite of the perpendicular shape anisotropy of the particle. It was found that the bottom extremity of the particle contains FeC from the X-ray diffraction. Thus the effect of the bottom extremity, that is, an unusal magnetic property was removed by electrodepositing Cu at the bottom extremity of the particle. Itis clear that the magnetic properties of the ilms are influenced by he branch-shaped bottom extremity filled with FeC.

• Journal of the Korean Society for Heat Treatment
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• v.24 no.6
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• pp.307-310
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• 2011

We have investigated the structural, electrical and optical properties of $In_2O_3$ thin films deposited by RF magnetron sputtering and then annealed at $150^{\circ}C$ and $300^{\circ}C$ in vacuum. The structural and electrical properties are strongly related to annealing temperature. All the annealed $In_2O_3$ films are grown as a hexagonal wurtzite phase and the largest grain size is observed in the films annealed at $300^{\circ}C$. The sheet resistance decreases with a increase in annealing temperature and $In_2O_3$ film annealed at $300^{\circ}C$ shows the lowest sheet resistance of $174{\Omega}/{\Box}$. The optical transmittance of $In_2O_3$ films in a visible wavelength region also depends on the annealing temperature. The films annealed at $300^{\circ}C$ show higher transmittance of 76% than those of the films prepared in this study.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.321-322
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• 2006

The electrical properties of PZT thin film capacitor on TiN/W plug structure were investigated for high density ferroelectric memory devices. In order to enhance the ferroelectric properties of PZT capacitor, the process conditions of bottom electrodes were optimized. The fabricated PZT capacitor on TiN/W plug showed good remanent polarization, leakage current, and contact resistance of TiN/W plug, which were $33\;{\mu}C/cm^2$, $1.2{\times}10^{-6}\;A/cm^2$, and 5.3 ohm/contact, respectively.

• Journal of the Korea Furniture Society
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• v.19 no.5
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• pp.307-318
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• 2008

Scientific methods for grading urushi lacquer includes general properties (viscosity, pH etc), and quantitative analysis of moisture, urushiol, gum, laccase content etc, and properties of coating layer such as set to touch drying time, gloss, color difference, delamination strength, tensile strength of film. The grading results evaluated by scientific method showed n order with chinese urushi lacquer (E) > domestic urushi lacquer (A) > japanese urushi lacquer (C) > chinese urushi lacquer (D) > domestic urushi lacquer (B). It is different from hose of traditional methods. Therefore, a more accurate grading of urushi lacquer should be ade by combining traditional method with scientific method.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.213-213
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• 2010

Magnetic random access memory (MRAM), based on magnetic tunnel junction (MTJ) and CMOS, is one of the best semiconductor memories because it can provide nonvolatility, fast access time, unlimited read/write endurance, low operating voltage and high storage density. For the realization of high density MRAM, the etching of MTJ stack with good properties is one of a key process. Recently, there has been great interest in the MTJ stack using MgO as barrier layer for its huge room temperature MR ratio. The use of MgO barrier layer will undoubtedly accelerate the development of MTJ stack for MRAM. In this study, high-density plasma reactive ion etching of MgO films was investigated in an inductively coupled plasma of $Cl_2$/Ar gas mixes. The etch rate, etch selectivity and etch profile of this magnetic film were examined on vary gas concentration. As the $Cl_2$ gas concentration increased, the etch rate of MgO monotonously decreased and etch slop was slanted. The effective of etch parameters including coil rf power, dc-bais voltage, and gas pressure on the etch profile of MgO thin film was explored, At high coil rf power, high dc-bais voltage, low gas pressure, the etching of MgO displayed better etch profiles. Finally, the clean and vertical etch sidewall of MgO films was achieved using $Cl_2$/Ar plasma at the optimized etch conditions.