• 전기학회논문지
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• 제66권10호
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• pp.1508-1515
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• 2017

This paper proposes the defect detection method for automatic inspection machines in printed circuit boards (PCBs) manufacturing system. The defects of PCB such as open, short, pin hole and scratch can be detected by comparing the standard image and the target image. The standard image is obtained from CAD file such as ODB++ format, and the target image is obtained by arranging, filtering and binarization of captured PCB image. Since the PCB size is too large and image resolution is too high, the image processing requires a lot of memory and computational time. The wavelet transform is applied to compress the standard and target images, which results in reducing the memory and computational time. To increase the inspection accuracy, we utilize the he HH-domain as well as LL-domain of the transformed images. Experimental results are finally presented to show the performance improvement of the proposed method.

• 대한기계학회논문집B
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• 제30권12호
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• pp.1147-1154
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• 2006

An experimental investigation was conducted to enhance the heat/mass transfer for impingement/effusion cooling system when the initial crossflow was formed. For the improvement of heat transfer, the circular guide is installed on the injection hole. At the fixed jet Reynolds number of 10,000, the measurements were carried out for blowing ratios ranging from 0.5 to 1.5. The local heat/mass transfer coefficients on the effusion plate are measured using a naphthalene sublimation method. The result presents that the circular guide protects the injected jet from the initial crossflow, increasing the heat/mass transfer. The heat transfer of stagnation region is hardly changed regardless of the blowing ratio. The secondary peak is obviously formed by flow transition to turbulent flow. At high blowing ratio of 1.5, the circular guide produces $26{\sim}30%$ augmentation on the averaged heat/mass transfer while the case without circular guide leads to the low and non-uniform heat/mass transfer. With the increased heat/mass transfer, the installation of circular guide is accompanied by the increase of pressure loss in the channel. However, the pressure drop caused by the circular guide is lower than that for other cooling technique with the circular pin fin.

• 마이크로전자및패키징학회지
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• 제11권1호
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• pp.43-47
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• 2004

We have been using Moisture Barrier Bags for dry packing of semiconductor packages to prevent moisture from absorbing during shipping. Moisture barrier bag material is required to be waterproof, vapor proof and offer superior ESD (Electro-static discharge) and EMI shielding. Also, the bag should be formed easily to the shape of products for vacuum packing while providing excellent puncture resistance and offer very low gas ＆ moisture permeation. There are some problems like pinholes and punctured bags after sealing and before the surface mount process. This failure may easily result in package pop corn crack during board mounting. The bags should be developed to meet the requirements of excellent electrical and physical properties by means of optimization of their raw material composition and their thickness. This study investigates the performance of moisture barrier bags by characterization of their mechanical endurance, tensile strength and through thermal analysis. By this study, we arrived at a robust material composition (polyester/Aluminate) for better packing.

• 한국공작기계학회논문집
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• 제16권5호
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• pp.151-156
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• 2007

In this paper, the creep characteristics of lead and lead-free solder joint were investigated using the QFP(Quad Flat Package) creep test. Two kind of solder pastes(Sn-3Ag-0.5Cu, Sn-0.2Sb-0.4Ag-37.4Pb) were applied to the QFP solder joints and each specimen was checked the external and internal failures(i.e., wetting failure, void, pin hole, poor-heel fillet) by digital microscope and X-ray inspection. The creep test was conducted at the temperatures of $100^{\circ}C$ and $130^{\circ}C$ under the load of 15$\sim$20% of average pull strength in solder joints. The creep characteristics of each solder joints were compared using the creep strain-time curve and creep strain rate-stress curves. Through the comparison, the Sn-3Ag-0.5Cu solder joints have higher creep resistance than that of Sn-0.3Sb-0.4Ag-37.4Pb. Also, the grain boundary sliding in the fracture surface and the necking of solder joint were observed by FE-SEM.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.401-402
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• 2007

The preparation and characteristics of ITO anode films grown using a linear facing target sputtering (FTS) technique for use in organic light emitting diodes (OLED) and flexible OLED is described. The electrical, optical, and work function of the ITO anode, which was prepared by linear FTS at room temperature, were comparable to those of commercial ITO anode films. In particular, linear FTS-grown ITO films shows very smooth surface without defects such as pin hole and cracks due to low substrate temperature. Furthermore OLED with the linear FTS-grown ITO anode film shows comparable electrical and optical properties to those of OLED with the commercial crystalline-ITO anode film. This suggested that linear FTS is promising thin film technology for preparing high quality anode film in OLEDs and flexible OLEDs.

• 한국광학회지
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• 제1권1호
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• pp.65-72
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• 1990

최대 10kJ의 에너지를 공급할 수 있는 Mather형 플라즈마 집속장치를 설계, 제작하였다. 이 DPF 장치의 전기 방전 특성을 알기 위해 Rogowski 코일을 제작하고 방전전류, 전압을 측정하여 본 system 의 저항과 인덕턴스는 각각 $20m\Omega과 0.2{\mu}H로 밝혀졌다. 플라즈마 전류 sheath의 이동속도는 충전개스 압력과 전압에 따라 $P^{-0.25}\timesV^{0.38}$의 함수로 비례하며 집속된 플라즈마의 크기는 직경 3mm, 길이 17mm로 밝혀졌다.

• 비파괴검사학회지
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• 제36권3호
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• pp.181-187
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• 2016

화력발전용 보일러 내부에는 연소열을 고온 고압의 스팀으로 변환하기 위한 열교환 튜브가 복잡한 형태로 배치되어 있다. 이 튜브에서 누설이 발생할 경우 고압의 스팀에 의해 치명적인 고장과 발전 정지를 초래하며, 누설 발생 여부를 조기에 검출하지 못할 경우 인근 튜브의 손상까지 연쇄적으로 발생하여 조기에 튜브 누설을 검출할 수 있는 기술 확립이 필요하다. 본 논문에서는 기존 보일러 튜브 누설 감시 설비(BTLD)에 음향방출(AE) 기술을 적용하여 기존 시스템 대비 미세누설을 검출하고 조기에 경보를 발생시킬 수 있는 시스템에 대해 개발을 하였다. 또한 이 시스템을 검증하기 위해 실제 운전 중인 560 MW급 화력발전소 보일러에서 다양한 크기(ⵁ2, ⵁ5, ⵁ10 mm)의 모의 누설시험을 실시하였으며, 그 결과 기존 시스템에서는 검출하지 못하였던 미세누설(ⵁ2 mm, ⵁ5 mm)에 대해 개발된 시스템은 조기에 경보를 발생(18 dB 이상 신호 상승)시킬 수 있음을 확인하였다.

• 제어로봇시스템학회논문지
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• 제6권3호
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• pp.298-308
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• 2000

In this paper a new two-arm cooperative assembly(or insertion) algorithm is proposed. As a force-guided control method for the cooperative assembly the adaptive accommodation controller is adopted since it does not require any complicated contact state analysis nor depends of the geometrical complexity of the assembly parts. Also the RMRC(resolved motion rate control) method using a relative jacobian is used to solve inverse kinematics for two manipulators. By using the relative jacobian the two cooperative redundant manipulators can be formed as a new single redundant manipulator. Two arms can perform a variety of insertion tasks by using a relative motion between their end effectors. A force/torque sensing model using an approximated penetration depth calculation a, is developed and used to compute a contact force/torque in the graphic assembly simulation . By using the adaptive accommodation controller and the force/torque sensing model both planar and a spatial cooperative assembly tasks have been successfully executed in the graphic simulation. Finally through a cooperative assembly task experiment using a humanoid robot CENTAUR which inserts a spatially bent pin into a hole its feasibility and applicability of the proposed algorithm verified.

• 천문학회지
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• 제29권spc1호
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• pp.429-432
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• 1996

An x-ray astronomy experiment consisting of three collimated proportional counters and an X-ray Sky Monitor (XSM) was flown aboard the Indian Satellite IRS-P3 launched on March 21, 1996 from SHAR range in India. The Satellite is in a circular orbit of 830 km altitude with an orbital inclination of $98^{\circ}$ and has three axis stabilized pointing capability. Each pointed-mode Proportional Counter (PPC) is a multilayer, multianode unit filled with P-10 gas ($90\%$ Ar + $10\%\;CH_4$) at 800 torr and having an aluminized mylar window of 25 micron thickness. The three PPCs are identical and have a field of view of $2^{\circ}{\times}2^{\circ}$ defined by silver coated aluminium honeycomb collimators. The total effective area of the three PPCs is about 1200 $cm^2$. The PPCs are sensitive in 2-20 keV band. The XSM consists of a pin-hole of 1 $cm^2$ area placed 16 cm above the anode plane of a 32 cm$\times$32 cm position sensitive proportional counter sensitive in 3-8 keV interval. The position of the x-ray events is determined by charge division technique using nichrome wires as anodes. The principal objective of this experiment is to carry out timing studies of x-ray pulsars, x-ray binaries and other rapidly varying x-ray sources. The XSM will be used to detect transient x-ray sources and monitor intensity of bright x-ray binaries. Observations of black-hole binary Cyg X-1 and few other binary sources were carried out in early May and July-August 1996 period. Details of the x-ray detector characteristics are presented and preliminary results from the observations are discussed.

• 제어로봇시스템학회논문지
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• 제21권12호
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• pp.1130-1135
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• 2015

The bond pull test is the most widely used technique for the evaluation and control of wire bond quality. The wire being tested is pulled upward until the wire or bond to the die or substrate breaks. The inspector test strength of wire by manually and it takes around 3 minutes to perform the test. In this paper, we develop a 3D vision system to measure 3D position of wire. It gives 3D position data of wire to move a hook into wires. The 3D measurement method to use here is a confocal imaging system. The conventional confocal imaging system is a spot scanning method which has a high resolution and good illumination efficiency. However, a conventional confocal systems has a disadvantage to perform XY axis scanning in order to achieve 3D data in given FOV (Field of View) through spot scanning. We propose a method to improve a parallel mode confocal system using a micro-lens and pin-hole array to remove XY scan. 2D imaging system can detect 2D location of wire and it can reduce time to measure 3D position of wire. In the experimental results, the proposed system can measure 3D position of wire with reasonable accuracy.