• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.1075-1076
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• 2010

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.1033-1034
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• 2011

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 추계학술대회 논문집
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• pp.31-32
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• 2012

• 반도체디스플레이기술학회지
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• 제17권3호
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• pp.59-64
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• 2018

In recent years, the solar cell market has steadily grown with the demand for new energies. And wire sawing is one of the most critical processes in manufacturing solar cell wafer which is supposed to affect the breakage of wafers most during the process and afterwards. Generally, the defects of the wafers are generated from the structural vibrations of the machine. In the sawing process, the vibrations cause unnecessary normal stress on the cut surface of wafers, and eventually create the surface damage or leave the residual stress. In this study, the dynamic properties of a wire saw have been analyzed through the frequency response test and the computer simulation. And the effects of the design alterations have been investigated to stabilize the machine structure and further to reduce the vibrations. The result shows that relatively simple design alterations of supporting structure without any change of major parts of the machine can suppress the vibrations of the machine effectively.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 춘계학술대회 논문집
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• pp.13-14
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• 2012

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 추계학술대회 논문집
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• pp.621-622
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• 2012

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 춘계학술대회 논문집
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• pp.837-838
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• 2012

• 한국기계가공학회지
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• 제15권3호
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• pp.66-71
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• 2016

Reducing the wafer breakage rate and sawing thinner wafers will decrease the cost of solar cells. This study was carried out in order to identify ways to achieve this goal. In this study, the cutting force characteristics using an ingot tilting-type diamond multi wire-sawing machine were analyzed. The cutting force was analyzed while varying the tilting angles and wire speed. The obtained data were analyzed by classifying the tangential cutting force and the normal cutting force. In this cutting force experiment, the difference between the forces was confirmed; it was found that it rises with increasing the tilting angles and decreases when the wire speed elevates. The resulting value can be utilized as basic data for the determination of an ideal cutting recipe.

• 한국산업융합학회 논문집
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• 제23권4_2호
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• pp.675-682
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• 2020

Multi-wire sawing is the prominent technology employed to cut hard material ingots into wafers. This paper aimed to research the effect of diamond toughness index on the cutting performance of electroplated diamond wire. Three different toughness index of diamond abrasives were used to manufacture electroplated diamond wires. The cutting performance of electroplated diamond wire is verified through experiments, in which sapphire ingot are cut using single wire sawing machine. A single wire saw for constant load slicing is developed for the cutting performance evaluation of electroplated diamond wire. Choosing the cutting depth, total cutting depth, cutting force and wear of electroplated diamond wires as evaluation parameters, the performance of electroplated diamond wire is evaluated. The results of this study showed that there was a significant direct relationship between the toughness index of diamond abrasives and the cutting performance. Results demonstrated that diamond abrasive with a high toughness index showed higher cutting performance. However, all diamond abrasives showed similar cutting performance under low load conditions. The results of this paper are useful for the development of cutting large diameter ingots and cutting high hardness ingots at high speed.

• 한국가스학회지
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• 제18권2호
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• pp.10-15
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• 2014

본 연구에서는 원통형 중공롤러를 갖는 와이어 소 머신에 대한 변위와 응력강도 안전성 해석결과를 제시하고 있다. 유한요소법을 사용하여 세 개의 튜브 사이에 Y형상의 편위형 컬럼과 수직형 컬럼을 설치한 중공롤러에서 변형거동과 응력강도 안전성을 높인 중공롤러를 개발하고자 한다. 동일한 직경과 길이를 갖지만, 중량을 달리하는 중공롤러 모델에서 Y 형상의 편위형 및 수직형 중공롤러에 작용하는 변위거동 안전성은 중공롤러의 전체길이에 의해 더 많은 영향을 받는 것으로 나타는데, 이것은 중공롤러의 굽힘 모멘트와 밀접한 관련이 있다. 그러나, 중공롤러의 응력강도는 중량 차이가 크지 않을 경우 절단면의 형상에 의해 더 큰 영향을 받는 것으로 나타났다. 따라서, 중공롤러의 강도안전성을 높이고, 총중량을 낮추기 위해서는 Y형상을 갖는 중공롤러를 사용하는 것이 바람직함을 알 수 있다.