• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 춘계학술대회 논문집
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• pp.63-64
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• 2007

• Journal of the Optical Society of Korea
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• 제18권5호
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• pp.531-537
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• 2014

Through-silicon vias (TSVs) are fine, deep holes fabricated for connecting vertically stacked wafers during three-dimensional packaging of semiconductors. Measurement of the TSV geometry is very important because TSVs that are not manufactured as designed can cause many problems, and measuring the critical dimension (CD) of TSVs becomes more and more important, along with depth measurement. Applying white-light scanning interferometry to TSV measurement, especially the bottom CD measurement, is difficult due to the attenuation of light around the edge of the bottom of the hole when using a low numerical aperture. In this paper we propose and demonstrate four bottom CD measurement methods for TSVs: the cross section method, profile analysis method, tomographic image analysis method, and the two-dimensional Gaussian fitting method. To verify and demonstrate these methods, a practical TSV sample with a high aspect ratio of 11.2 is prepared and tested. The results from the proposed measurement methods using white-light scanning interferometry are compared to results from scanning electron microscope (SEM) measurements. The accuracy is highest for the cross section method, with an error of 3.5%, while a relative repeatability of 3.2% is achieved by the two-dimensional Gaussian fitting method.

• 한국정밀공학회지
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• 제31권7호
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• pp.605-613
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• 2014

Scanning white-light interferometry is an important measurement option for many surfaces. However, serious profile measurement errors can be present when measuring free-form surfaces being highly curved or tilted. When the object surface slope is not zero, the object and reference rays are no longer common path and optical aberrations impact the measurement. Aberrations mainly occur at the beam splitter in the interference objective and from misalignment in the optical system. Both effects distort the white-light interference signal when the surface slope is not zero. In this paper, we describe a modified version of white-light interferometry for eliminating these measurement errors and improving the accuracy of white-light interferometry. Moreover, we report systematic errors that are caused by optical aberrations when the object is not flat, and compare our proposed method with the conventional processing algorithm using the random ball test.

• Current Optics and Photonics
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• 제3권5호
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• pp.408-414
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• 2019

In this paper we propose a method to generate a true color image in scanning white-light interferometry (SWLI). Previously, a true color image was obtained by using a color camera, or an RGB multichannel light source. Here we focused on acquiring a true color image without any hardware changes in basic SWLI, in which a monochrome camera is utilized. A Fourier transform method was used to obtain the spectral intensity distributions of the light reflected from the sample. RGB filtering was applied to the intensity distributions, to determine RGB values from the spectral intensity. Through color corrections, a true color image was generated from the RGB values. The image generated by the proposed method was verified on the basis of the RGB distance and peak signal-to-noise ratio analysis for its effectiveness.

• 한국정밀공학회지
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• 제31권11호
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• pp.999-1006
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• 2014

In this investigation, we explain the sub-sampling technique of white light scanning interferometry (WLSI) to improve the measurement speed. In addition to the previous work using Fourier domain analysis, several methods to extract the height from the correlogram of WLSI are described with the sub-sampling technique. Especially, Fourier-inverse Fourier transformation method adopting sub-sampling technique is proposed and the phase compensation technique is verified with simulation and experiments. The main advantage of sub-sampling is to speed up the measurements of WLSI but the precision such as repeatability is slightly poor. In case of measuring the sample which has high height step or difference, the proposed technique can be widely used to reduce the measurement time.

• 한국정밀공학회지
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• 제24권4호
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• pp.21-28
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• 2007

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.110-113
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• 2001

We present an interferometer system, which is able to perform both the phase shifting interferometry and white light interferometry. The interferometer system uses a d.c. motor to control the probe position with an accuracy of 10nm, which shows an outstanding performance on white light interferometry. However, the moving mechanism of d.c. motor is not accurate enough for the phase shifting interferometry that requires a moving precision less than 1 nm. We therefore propose a Fourier transform technique to calculate the phase of interferograms, which is strongly resistant to calibration errors and external vibration. Experimental results show that the Fourier transform technique is capable of reducing the measurement error caused by inaccurate movement within 0.1nm.

• Applied Microscopy
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• 제41권4호
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• pp.223-228
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• 2011

백색광 주사간섭계는 다양한 시료의 표면 특성을 분석하기 위하여 널리 활용되고 있다. 이 기법은 재료공학 분야에서 오래 전부터 이용되었으며 정성적인 형상 이미지 이외에도 정량적인 3차원 결과를 제공한다. 이 기법에서는 백색광을 광원으로 이용하는데, 기준면과 측정면에서의 반사광을 합쳐서 형성되는 간섭신호를 형태 정보로 활용한다. z축 결과인 고도는 회색수준으로 구분되어 제시된다. 이 기법을 통하여 대영역으로 생물 시료를 신속하고 비파괴적으로 형태를 계측할 수 있다. 연골세포, 치아 법랑질, 식물 잎을 대상으로 적용한 사례가 있다. 특히 표면 구조물의 폭, 길이, 경사각과 같은 특성도 이 기법을 통하여 정량화할 수 있다. 이 기법을 적용하기 위하여 일정 수준의 반사도가 필요한데, 식물 잎에서의 반사도는 그 요건을 충족하였다. 전도성 금속의 코팅 등 부가적인 시료 전처리가 필요 없으므로 이 기법을 통한 생물 시료의 정량적 측정이 더욱 증가할 것으로 예상한다.

• Journal of the Optical Society of Korea
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• 제18권3호
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• pp.236-243
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• 2014

Surface profiling and film thickness measurement play an important role for inspection. White light interferometry is widely used for engineering surfaces profiling, but its applications are limited primarily to opaque surfaces with relatively simple optical reflection behavior. The conventional bucket algorithm had given inaccurate surface profiles because of the phase error that occurs when a thin-film exists on the top of the surface. Recently, reflectometry and white light scanning interferometry were combined to measure the film thickness and surface profile. These techniques, however, have found that many local minima exist, so it is necessary to make proper initial guesses to reach the global minimum quickly. In this paper we propose combing reflectometry and white light scanning interferometry to measure the thin-film thickness and surface profile. The key idea is to divide the measurement into two states; reflectometry mode and interferometry mode to obtain the thickness and profile separately. Interferogram modeling, which considers transparent thin-film, was proposed to determine parameters such as height and thickness. With the proposed method, the ambiguity in determining the thickness and the surface has been eliminated. Standard thickness specimens were measured using the proposed method. Multi-layered film measurement results were compared with AFM measurement results. The comparison showed that surface profile and thin-film thickness can be measured successfully through the proposed method.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 추계학술대회 논문집
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• pp.5-6
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• 2006