• 한국표면공학회지
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• 제16권2호
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• pp.41-47
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• 1983

An investigation has been performed on the effects of temperature and Ni addition on the wetting behaviour of Cu on W substrate in hydrogen atmosphere. An sessile drop method was used to measure a wetting angle. The concentration profiles of W, Cu and Ni elements in W/Cu - 5 Ni specimen were made by EPMA. With increasing temperature, the wetting angle of Cu droplet on W plate decreases and the time to reach an equilibrium wetting angle is shortened in hydrogen atmosphere. The addition of Ni improves appreciably the wettability of Cu on W. With increasing Ni content in Cu liquid droplet(0, 1, 3, 5%), the wetting angle is decreased from 21$^{\circ}$to 0$^{\circ}$.

• 한국세라믹학회지
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• 제42권7호
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• pp.497-502
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• 2005

This study investigated the effects of the substrate and powder content on the fabrication of SiO$_{2}$ photonic crystals by evaporation method. Photonic crystals were self-assembled on quartz, Corning 1737 glass, slide glass, and ITa glass to verify the effects of the wetting angle and surface morphology. The powder contents of the solution were varied from 0.2 to 2.0 wt$\%$. The number of photonic crystal layers increased according to the decrease of wetting angle and surface roughness. The resultant photonic crystals showed the best optical characteristics when the number of photonic crystal layers was within 40 and 50. In addition, the intensity peak of Fabry¡?Perot fringes increased when the wetting angle was large and the particle size was small. Photonic crystals coated on ITO glass showed the highest reflectance peak of 63$\%$ relative intensity.

• 한국표면공학회지
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• 제35권2호
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• pp.129-137
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• 2002

The purpose of solderability assessment is to predict the effectiveness of soldering process. It is important for companies pursuing zero defects manufacturing because poor solderability is the major cause of two third of soldering failures. The most versatile solderability method is wetting balance method. However, there exist so many indices for wettability in the wetting balance test e.g. time to reach 2/3 values of maximum wetting force, tine to reach zero wetting force, maximum withdrawal force. In this study, three solderability assessment methods, which were the maximum withdrawal force, the wetting balance and the dynamic contact angle (DCA), were evaluated by comparing each other. The wetting balance technique measures the solderability by recording the forces exerted from the specimen after being dipped into the molten solder. Then the force at equilibrium state can be used to calculate a contact angle, which is known as static contact angles. The DCA measures contact angles occurred during advancing and withdrawing of the specimen and the contact angles are known as dynamic contact angles. The maximum withdrawal force uses the maximum force during withdrawal movement and then a contact angle can be calculated. In this study, the maximum withdrawal force method was found to be an objective index for measuring the solderability and the experiment results indicated good agreement between the maximum withdrawal force and the wetting balance method.

• Journal of Welding and Joining
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• 제18권6호
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• pp.74-82
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• 2000

The fluxless wetting properties of UBM-coated Si-wafer to the binary lead-free solders(Sn-Ag, Sn-Sb, Sjn-In, Sn0Bi) were estimated by wetting balance method. With the new wettability indices from the wetting curves of one side coated specimen, the wetting property estimation of UBM-coated Si-wafer was possible. For UBM of Si-chip, Au/Cu/Cr UBm was better than au/Ni/TI in the point of wetting time/ At general reflow process temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) was better than that of low melting point one(Sn-Bi, Sn-In). The contact angle of the one side coated Si-plate to the solder could be calculated from the force balance equation by measuring the static state force and the tilt angle.

• 마이크로전자및패키징학회지
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• 제7권2호
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• pp.47-53
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• 2000

TSM(Top Surface Metallurgy)이 증착된 유리기판의 Pb-free 솔더에 대한 젖음성을 무플럭스하에서 wetting balance법으로 평가하였다. TSM 층의 젖음성을 단면 증착시편의 wetting balance법으로부터 도출된 새로운 젖음성 지수들로 평가할 수 있었다. 유리기판의 TSM층으로는, Cu를 젖음층으로 하고 Au를 Cu의 산화 방지 층으로 사용하는 경우가 Au 자체를 젖음층으로 사용하는 경우보다 우수하였다. SnSb 솔더는 SnAg, SnBi, SnIn 솔더보다 TSM층에 대한 젖음특성이 우수하였다. 유리기판에 단면 증착된 TSM과 Pb-free솔더의 접촉각을 $F_{s}$와 기울어짐각을 측정하고, 메니스커스의 정적 상태에서 힘의 평형으로부터 유도된 식을 이용하여 계산할 수 있었다.

• 한국재료학회지
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• 제31권1호
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• pp.38-42
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• 2021

In this study, high temperature wetting analysis and AZ80/Ti interfacial structure observation are performed for the mixture of AZ80 and Ti, and the effect of Al on wetting in Mg alloy is examined. Both molten AZ80 and pure Mg have excellent wettability because the wet angle between molten droplets and the Ti substrate is about 10° from initial contact. Wetting angle decreases with time, and wetting phenomenon continues between droplets and substrate; the change in wetting angle does not show a significant difference when comparing AZ80-Ti and Mg-Ti. As a result of XRD of the lower surface of the AZ80-Ti sample, in addition to the Ti peak of the substrate, the peak of TiAl3, which is a Ti-Al intermetallic compound, is confirmed, and TiAl3 is generated in the Al enrichment region of the Ti substrate surface. EDS analysis is performed on the droplet tip portion of the sample section in which pure Mg droplets are dropped on the Ti substrate. Concentration of oxygen by the natural oxide film is not confirmed on the Ti surface, but oxygen is distributed at the tip of the droplet on the Mg side. Molten AZ80 and Ti-based compound phases are produced by thickening of Al in the vicinity of Ti after wetting is completed, and Al in the Mg alloy does not affect the wetting. The driving force of wetting progression is a thermite reaction that occurs between Mg and TiO2, and then Al in AZ80 thickens on the Ti substrate interface to form an intermetallic compound.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.74-79
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• 2000

In an attempt to estimate the wetting properties of wettable metal layers by wetting balance method, an analysis of wetting curves of the coating layer was performed. Based on the analysis, wetting properties of UBM-coated Si-plate were estimated by the new wettability indices. The wetting curves of the one and both sides-coated UBM layers have the similar shape and show the similar tendency to the temperature. So the wetting property estimation of one side coating is possible with wetting balance method. For UBM of Si-chip, Cr/Cu/Au UBM is better than Ti/Ni/Au in the point of wetting time. At general reflow temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) is better than that of few melting point ones(Sn-Bi, Sn-In).The contact angle of the one side coated plate to the solder can be calculated from the farce balance equation by measuring the static state force and the tilt angle.

• 한국산학기술학회논문지
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• 제11권3호
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• pp.815-820
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• 2010

본 연구에서는 자동차용 가솔린엔진에 장착되는 인젝터의 연료공급 특성을 실험적으로 분석하였다. 4홀과 12홀 인젝터의 장착각 변화와 포트 마스킹의 형상변화에 따른 벽유량을 측정하고 분석하였다. 분무가시화 실험을 통하여 분무성장과정과 분사각, 연료미립화 및 분무도달거리를 분석하였다. 벽류측정 실험 결과, 벽유량은 흡기유동과 인젝터 장착각에 큰 영향을 받으며, 인젝터 장착각이 감소할수록 벽유량은 감소하였다. 마스킹의 경우 유동 면적이 감소하여 국소 유속이 증가할때 벽유량 감소에 효과를 보였다. 분무 가시화를 통하여 12홀 인젝터가 압력 변화에 대한 미립화의 강건성 측면에서 우수한 분무특성을 보였다.

• 마이크로전자및패키징학회지
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• 제24권2호
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• pp.1-9
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• 2017

Recently, there has been a continuous researches on solders having sophisticated and improved performance due to demand for high-density and miniaturization of electronics, and development of solder for automotive electronics which can be used in harsh environment. When developing a new solder alloy, there is a wettability of solder on substrate for things to consider, and the wetting balance test is one of the methods for measuring that one. In this paper, the wetting balance test is introduced, and the calculus of the surface tension of solder and the contact angle between solder and substrate using wetting curve obtained is introduced too. In detail, the principle and test method of the wetting balance test, the introduction of the parameters with important meaning in the wetting curve, the method of calculating the contact angle as well as the surface tension of the solder using the shape of the solder meniscus.

• 대한금속재료학회지
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• 제47권6호
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• pp.383-390
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• 2009

The effects that processing atmospheres and alloy composition have on the wetting characteristics of Al-Mg alloys on the $SiO_{2}$ substrate were investigated by measuring the wetting angles. It was observed that the wetting behavior of the Al-Mg alloys on the $SiO_{2}$ substrate vary depending on the Mg content of the alloys and atmospheres. The results showed that the contact angle decreases with increasing Mg content, angle is generally larger in the $N_{2}$ atmosphere than in the Ar atmosphere. We discussed the validity of the results obtained from the wetting test on the basis of recent theories and the results observed from the actual penetration tests.