• Journal of Forest and Environmental Science
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• 제33권1호
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• pp.33-38
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• 2017

In this study, spray-drying yield and morphological characterization of spray-dried cellulose nanofibril (CNF) and TEMPO-oxidized nanocellulose (TONC) depending on spray-drying condition and surfactant addition was investigated. As spray-drying temperature increased, the yield of spray-dried CNF was increased. The highest spray-drying yields in both nanocelluloses were found at didecyl dimethyl ammonium chloride (DDAC) addition of 2.5 phr at all investigated temperatures. The spray-dried CNF was the sphere-like particle, but the spray-dried TONC showed both rod and sphere-like morphology. The average diameter of spray-dried CNF was decreased with increasing DDAC addition amount, resulting in the increase of specific surface area.

• JSTS:Journal of Semiconductor Technology and Science
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• 제8권2호
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• pp.121-127
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• 2008

This paper presents design and fabrication of optimized geometry structure of electrostatic inkjet head. In order to verify effect of geometry shape, we simulate electric field intensity according to the head structure. The electric field strength increases linearly with increasing height of the micro nozzle. As the nozzle diameter decreases, the electric field along the periphery of the meniscus can be more concentrated. We design and fabricate the electrostatic inkjet heads, hole type and pole type, with optimized structure. It was fabricated using thick-thermal oxidation and silicon micromachining technique such as the deep reactive ion etching (DRIE) and chemical wet etching process. It is verified experimentally that the use of the MEMS inkjet head allows a stable and sustainable micro-dripping mode of droplet ejection. A stable micro dripping mode of ejection is observed under the voltages 2.5 kV and droplet diameter is $10\;{\mu}m$.

• 한국결정성장학회지
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• 제8권1호
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• pp.117-123
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• 1998

초크랄스키 실리콘 기판의 뒷면에 형성된 기계적 손상이 미치는 효과에 대하여 고찰하였다. 기계적 손상의 정도는 레이저 여기/극초단파 반사 광전도 감쇠법에 의한 소수반송자 재결합 수명, 광열범위, X-선 단면 측정 및 습식산화/선택적 식각 방법으로 평가하였다. 그 결과, 웨이퍼 뒷면에 가해지는 기계적 손상의 세기가 강할수록 소수반송자 재결합 수명은 짧아지고, 광열 변위의 평균값은 비례적으로 증가하였으며, 손상된 웨이퍼에서 Grade 1의 과잉 광열 변위값을 1로 봤을 때 과잉 광열 변위의 정규화한 상대 정량 비는 Grade 1: Grade 2:Grade 3 = 1:19.6:41이다.

• 한국결정성장학회지
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• 제8권4호
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• pp.581-586
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• 1998

초크랄스키 실리콘 기판의 뒷면에 형성된 기계적 손상이 미치는 효과에 대하여 고찰하였다. 기계적 손상의 정도는 레이저 여기/극초단파 반사 광전도 감쇠법에 의한 소수반송자 재결합 수명, X-선 단면 측정 및 습식 산화/선택적 식긱 방법으로 평가하였다. 그 결과, 웨이퍼 뒷면에 가해지는 기계적 손상의 세기가 강할수록 소수반송자 재결합 수명은 짧아지고, 산만 산란 정도와 X-선 과잉 강도의 적분값은 비례적으로 증가하였으며, 그 값을 Grade 1의 손상된 웨이퍼에서의 과잉 강도로 정규화하면 과잉 강도의 상대 정량비는 Geade 1:Grade 2:Grade 3 = 1:7:18.4이다.

• 한국축산식품학회지
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• 제40권4호
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• pp.649-658
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• 2020

This study compared aroma compositions and sensory aroma attributes of raw and cooked Tenebrio molitor larvae (mealworms). Main sensory aroma attributes of raw mealworms were strong wet-soil-like, and less-intense oily, shrimp-like and sweet-corn-like. Quantitatively, the major aroma components of raw mealworms were hydrocarbons and aldehydes. As cooking proceeded, sweet-corn-like, roasted, and fried-oil-like sensory attributes were increasingly perceived with steaming, roasting, and frying, respectively. Some pyrazines, pyrrolidines, and carbonyls increased or appeared in roasted and fried mealworms. Partial least squares regression also showed differences in raw and cooked mealworms based on aroma components and their sensory attributes. Unlike raw mealworms, steamed mealworms had a relatively strong sweet-corn-like aroma attribute, which was related to 2,4,6-trimethyl-heptane, 2,4-dimethyl-dodecane, and 3,5-dihydroxy-6-methyl-2,3-dihydropyran-4-one. In comparison, roasted and fried mealworms exhibited roasted, shrimp-like, and fried-oil-like aroma attributes, which were associated with intermediates of the Maillard reaction and lipid oxidation, such as pyrazines, alcohols, and aldehydes. This result during thermal reactions was very similar to those of meat and/or seafood. The use of mealworms as a savory-type flavor enhancer can be expected.

• 한국대기환경학회지
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• 제8권1호
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• pp.45-51
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• 1992

A study on acidity in fog, dew and frost was carried out. Samples were taken during May 1990-February 1991 at two sites in Chongwon, Choongbook. The acidity of dew and of fog collected from grass at site A was 4.89 and 5.46, respectively. Dew in summer showed very strong acidity. The volume of dew deposited on grass was much less than the volume of rain, but dew is effective to diffuse acid predursors and acid materials. Dew and fog can remove more effectively atmospheric acid materiasl deoposited on grass by diurnal turbulent motion rather than direct absorption of acid predursors and materials in the atmosphere. In a polluted area, acidic dew and fog can be occurred by the direct absorption and oxidation of acidic predursors in the atmosphere as well as the role of wet removal on grass surface. Acidity of frost collected on teflon surface showed little difference to acidity of dew and fog on teflon surface. This suggests a similar absorption mechanism of atmospheric precursors and materials into dew and frost in the atmosphere. Strong acidity in dew, fog and frost appeared to occur from local pollution sources of several ten kilometres. In particular, strong acidity in dew, fog, and frost together with acid rain can accelerate a damage in ecosystems. Discussion is made on scientific analyses and seasonal variations of acidity of fog, dew and frost. A mechanism on acidification of fog, dew and frost is also discussed.

• 한국표면공학회지
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• 제28권1호
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• pp.55-63
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• 1995

Alkaline solutions such as $NH_4$OH, choline and TMAH (($CH_3$)$_4$NOH) have been introduced in semiconductor wet processing of silicon wafers to control ionic and particulate impurities following etching in acidic solutions. These chemicals usually mixed with hydrogen peroxide and/or surfactants to control the etch rate of silicon. The highest etch rate was observed in $NH_4$OH solutions at a pH in alkaline solutions. It indicates that the etch rate depends on the content of $OH^{-}$ as well as cations of alkaline solutions. STM/AFM techniques were used to characterize the effect of alkaline solutions on silicon surface roughness. In SC1 (mixture of $NH_4$OH : $H_2$$O_2$ : $H_2$O) solutions, the reduction of the ammonium hydroxide proportion from 1 to 0.1 decreased the surface roughness ($R_{rms}$) from 6.4 to $0.8\AA$. The addition of $H_2$$O_2$ and surfactants to choline and TMAH reduced the values of $R_{p-v}$ and $R_{rms}$ significantly. $H_2$$_O2$ and surfactants added in alkaline solutions passivate bare silicon surfaces by the oxidation and adsorption, respectively. The passivation of surfaces in alkaline solutions resulted in lower etch rate of silicon thereby provided smoother surfaces.s.ces.s.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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• pp.830-833
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• 2003

This paper describes the fabrication and characteristics of 3C-SiCOI sotctures by SDB and etch-back technology for high-temperature MEMS applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si(001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The wafer bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR. The strength of the bond was measured by tensile strengthmeter. The bonded interface was also analyzed by SEM. The properties of fabricated 3C-SiCOI structures using etch-back technology in TMAH solution were analyzed by XRD and SEM. These results indicate that the 3C-SiCOI structure will offers significant advantages in the high-temperature MEMS applications.

• 한국전기전자재료학회논문지
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• 제20권3호
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• pp.234-239
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• 2007

This paper describes the TiW ohmic contact characteristics under the surface treatment of the polycrystalline 3C-SiC thin film grown on $SiO_2/Si(100)$ wafers by APCVD. The poly 3C-SiC surface was polished by using CMP(chemical mechanical polishing) process and then oxidized by wet-oxidation process, and finally removed SiC oxide layers. A TiW thin film as a metalization process was deposited on the surface treated poly 3C-SiC layer and was annealed through a RTA(rapid thermal annealing) process. TiW/poly 3C-SiC was investigated to get mechanical, physical, and electrical characteristics using SEM, XRD, XPS, AFM, optical microscope, I-V characteristic, and four-point probe, respectively. Contact resistivity of the surface treated 3C-SiC was measured as the lowest $1.2{\times}10^{-5}{\Omega}cm^2$ at $900^{\circ}C$ for 45 sec. Therefore, the surface treatments of poly 3C-SiC are necessary to get better contact resistance for extreme environment MEMS applications.

• 한국재료학회지
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• 제13권12호
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• pp.779-784
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• 2003

Nickel powders were obtained by various preparation methods, and their sintering characteristics were investigated. Nickel powders made by wet chemical process (WCP) had a higher surface area and more narrow size distribution than that of chemical vapor deposition (CVD) method. Nickel-oxide powders by the WCP method were prepared at $200^{\circ}C$ for 3 hr. The oxidation behaviour of nickel-oxide powder is similar with that of the CVD method. Nickel powders made by the WCP method showed a higher shrinkage in the range of $600^{\circ}C$∼$900^{\circ}C$ than that of commercial powder made by the CVD method. The similar results were observed on the surface microstructure of sintered bodies by SEM measurements.