• Title/Summary/Keyword: Wet cleaning

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A comparison of detergency and dimensional stability between wet cleaning and dry cleaning (물세탁과 드라이클리닝의 세탁성능과 형태안정성 비교)

  • Kwak, Soo-Kyung;Kim, Ah-Ri;Oh, Hwawon;Park, Myung-Ja
    • Journal of the Korea Fashion and Costume Design Association
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    • v.21 no.1
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    • pp.181-189
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    • 2019
  • The washability, redeposition, fill power, and fabric damage of wet cleaning and dry cleaning solvents were measured to identify the optimal type of washing that would increase washability while maintaining dimensional stability. The soiled fabric is a polyester cotton blend and the types of soil were wine, blood, make-up and sebum with carbon black. Petroleum and silicone solvents were used in dry cleaning. Results from this study are as follows. First, detergency is significantly influenced by the type of washing and type of soil. Wet cleaning is superior to dry cleaning. Wet cleaning shows a strong washing performance against hydrophilic soils, whereas, dry cleaning is stronger against hydrophobic soils. Second, redeposition is significantly affected by the type of washing, fabrics, and soils. Redeposition occurred little on cotton during wet cleaning, but showed a high rate for nylon. However, when the two types of fabric were dry cleaned, redeposition occurred on both types. Third, the fill power of duck-down is very affected by the type of washing. Resilience is the best in wet cleaning; and in dry cleaning, petroleum solvents showed a higher resilience when as compared to silicone solvents. Last, the level of fabric damage to cotton fabrics is highly influenced by the type of washing. Wet cleaning damages cotton fabrics significantly more than dry cleaning. For dry cleaning, petroleum solvents damage these fabrics slightly more than silicone solvents. In conclusion, the type of soil must initially be identified to determine the optimal type of washing. Special caution is required when textiles with particulate soil and nylon are washed. When considering the resilience of duck-down clothing, wet cleaning is more appropriate than dry cleaning. Dry cleaning, especially when using silicone-based solvents, is more suitable than wet cleaning for maintaining the shape of clothing.

A Study on the Cleaning Method of Excavated Textiles (의영 전의이씨 출토복식의 세척방법에 관한 연구)

  • 박윤미;황은경;정복남
    • The Research Journal of the Costume Culture
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    • v.11 no.6
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    • pp.956-966
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    • 2003
  • The purpose of study is to find out a suitable cleaning method for excavated textiles of Jeon-ui Lee(1570∼1647). The textiles were excavated from her tomb in 1997, and her descendents put them in a box without any treatment and kept them in the warehouse since then. We used two kinds of silk as samples, non-dyed and dyed textile. The experiment was performed by 8 kinds of wet cleaning and dry cleaning methods, an ultrasonic cleaner was used in the wet cleaning, decane and perchloroethylene were used as solvents in the dry cleaning. The use of the ultrasonic cleaner in the wet cleaning method did not show any damage to the fibers of the textiles and it not only cleaned well but also was safe for the fugitive dyes. It resulted in more effective cleaning when the detergent was used together. Therefore, it is effective to use the ultrasonic cleaning on the delicate historical textiles and helpful to the operator's safety and environment.

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A Study of Cleaning Method of Excavated Gold Brocade (출토 직금직물의 세척방법에 관한 연구)

  • Hong, Moon-Kyung;Lee, Mee-Sik
    • Journal of the Korean Society of Clothing and Textiles
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    • v.34 no.7
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    • pp.1162-1174
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    • 2010
  • Excavated gold brocade, often shows signs of serious damage and contamination from environmental factors such as exposure to soil or human remains. Therefore, most of the conservation procedures are focused on the consolidation of the gold thread and on cleaning with water or organic solvents. Indiscreet cleaning using solvents could damage the gold leaf, which identifies the features of fabric. There is a need to develop cleaning protocols appropriate for relics through the careful analysis of the condition of the relics. This study finds the appropriate cleaning method for the excavated gold brocade. Four different cleaning methods, vacuum cleaning, kneaded rubber eraser cleaning, immersion wet cleaning, and absorption wet cleaning were applied to the excavated gold brocade. The degree of cleaning and damage were examined depending on the cleaning methods, changes to the physical condition (before and after cleaning) were also analyzed through the surface observation. Although immersion cleaning showed the best cleaning result, this method had a risk of damage to the gold thread. Absorption wet cleaning safely eliminated the various soluble contaminants and the rotten smell of relics. Kneaded rubber eraser was suitable for the excavated gold brocade fabric because it can be applied to selective parts, intentionally excluding some sensitive parts such as the gold thread. The vacuum cleaning method required special attention because of a possibility of suctioning off loosely attached gold leaf. Dual cleaning, the kneaded rubber eraser cleaning, followed by the absorption cleaning was the most effective method to preserve and clean excavated gold brocade.

ITO Wet Etch Properties in an In-line Wet Etch/Cleaning System by using an Alternating Movement of Substrate (기판의 왕복 운동을 이용한 인라인 식각세정장치 내 ITO 식각특성)

  • Hong, Sung-Jae;Kwon, Sang-Jik;Cho, Eou-Sik
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.8
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    • pp.715-718
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    • 2008
  • An in-line wet etch/cleaning system was established for the research and development in wet etch process. The system was equipped with a reverse moving system for the reduction in the size of the in-line wet etch/cleaning system and it was possible for the glass substrate to be moved back and forth and alternated in a wet etch bath. For the comparison of the effect of the normal motion and that of the alternating motion on the in-line wet etch process, indium tin oxide(ITO) pattern was obtained through both wet etch process conditions. The results showed that the alternating motion is not inferior to the normal motion in etch rate and in etch uniformity. It is concluded that the alternating motion is possible to be applied to the in-line etch process.

Wet Cleaning Process for Cobalt Salicide (코발트살리사이드를 위한 습식세정 공정)

  • 정성희;송오성
    • Journal of the Korean institute of surface engineering
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    • v.35 no.6
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    • pp.377-382
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    • 2002
  • We investigated the appropriate wet cleaning process for Co-Ti-Si compounds formed on top of cobalt disilicide made from Co/Ti deposition and two rapid thermal annealing (RTA). We employed three wet cleaning processes, WP1 ($H_2$SO$_4$ etchant), WP2 ($NH_4$OH etchant), and WP3 which execute sequentially WP1 and WP2 after the first RTA. All samples were cleaned with BOE etchant after the second RTA. We characterized the sheet resistance with process steps by a four-point probe, the microstructure evolution by a cross detail sectional transmission electron microscope, a Auger depth profiler, and a X-ray diffractometer (XRD). We confirmed WP3 wet cleaning process were the most suitable to remove CoTiSi layer selectively.

The Study of WET Cleaning Effect on Deep Trench Structure for Trench MOSFET Technology (Trench MOSFET Technology의 Deep Trench 구조에서 WET Cleaning 영향에 대한 연구)

  • Kim, Sang-Yong;Jeong, Woo-Yang;Yi, Keun-Man;Kim, Chang-Il
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.88-89
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    • 2009
  • In this paper, we investigated about wet cleaning effect as deep trench formation methods for Power chip devices. Deep trench structure was classified by two methods, PSU (Poly Stick Up) and Non-PSU structure. In this paper, we could remove residue defect during wet. cleaning after deep trench etch process for non-PSU structure device as to change wet cleaning process condition. V-SEM result showed void image at the trench bottom site due to residue defect and residue component was oxide by EDS analysis. In order to find the reason of happening residue defect, we experimented about various process conditions. So, defect source was that oxide film was re-deposited at trench bottom by changed to hydrophobic property at substrate during hard mask removal process. Therefore, in order to removal residue defect, we added in-situ SCI during hard mask removal process, and defect was removed perfectly. And WLR (Wafer Level Reliability) test result was no difference between normal and optimized process condition.

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Effect of Wet Cleaning on the Property of Aged Duplicated Beeswax-Treated Paper (열화된 밀랍지 시제품의 습식크리닝 처리효과 분석)

  • Choi, Kyoung-Hwa;Park, Ji-Hee
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.42 no.4
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    • pp.25-32
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    • 2010
  • The beeswax-treated volumes of the Annals of Joseon Dynasty, designated as a UNESCO's Memories of the World, have been more seriously damaged than the untreated ones. As a continuous effort to develop the optimal conservation techniques for the damaged beeswax-treated volumes of the Annals, this study examines the effectiveness of wet cleaning on the conservation of the beeswax-treated paper. To do this, wet cleaning is performed on the duplicated beeswax-treated paper and the Hanji that are aged at $105^{\circ}C$ for 30 days using distilled water of $24^{\circ}C$ and $50^{\circ}C$. As results, it is observed that pH of the both the beeswax-treated paper and the Hanji increase, indicating the removal of the acid of the aged paper samples through wet cleaning. After the wet cleaning, however, the physical properties and viscosity of the Hanji decrease, while those of the beeswax-treated paper increase. It is also found that wet cleaning contributes to enhancement of most optical properties of the Hanji, but not for those of the beeswax-treated paper except for the $b^*$ value. Analyses of UV absorbance of cleaning water demonstrate that both the beeswax-treated paper and the Hanji have typical spectra of chromophore compounds of cellulose.

A Compacted In-line Wet Etch/Cleaning System With a Reverse Moving Control System

  • Im, Seung-Hyeok;Cho, Eou-Sik;Kwon, Sang-Jik
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.863-866
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    • 2008
  • For the cost reduction in the fabrication of display panels, a reverse moving system was equipped to a compacted in-line wet etch/cleaning system. For the effect of the alternating movement of substrate on the wet etch process, ITO layers were etched in various moving modes of substrates and the results were compared and analyzed.

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ITO Patterning of an In-line Wet Etch/Cleaning System by using a Reverse Moving Control System (반송제어모드를 이용한 인라인 식각/세정장치의 ITO 전극형성기술)

  • Hong, Sung-Jae;Im, Seoung-Hyeok;Han, Hyung-Seok;Kwon, Sang-Jik;Cho, Eou-Sik
    • Journal of Institute of Control, Robotics and Systems
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    • v.14 no.4
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    • pp.327-331
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    • 2008
  • An in-line wet etch/cleaning system was established for the research and development in wet etch process as a formation of electrode such as metal or transparent conductive oxide layer. A reverse moving system was equipped in the in-line wet etch/cleaning system for the alternating motion of glass substrate in a wet etch bath of the system. Therefore, it was possible for the glass substrate to be moved back and forth and it was possible to reduce the size of the system by using the reversing moving system. For the effect of the alternating motion of substrate on the etch rate in the in-line wet etch bath, indium tin oxide(ITO) patterns were obtained through wet etch process in the in-line system in which the substrate was moved back and forth. From the CD(critical dimension) skews resulted from the ADI CD and ACI CD of the ITO patterns, it was concluded that the alternating motion of glass substrate are possible to be applied to the mass production of wet etch process.