• 제목/요약/키워드: Wet bonding

검색결과 141건 처리시간 0.025초

핫 엠보싱 공정을 이용한 플라스틱 CE(capillary electrophoresis) 마이크로 칩의 제작 (Fabrication of plastic CE (capillary electrophoresis) microchip by hot embossing process)

  • 차남구;박창화;임현우;박진구
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 춘계학술대회 논문집
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    • pp.1140-1144
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    • 2005
  • A plastic-based CE (capillary electrophoresis) microchip was fabricated by hot embossing process. A Si mold was made by wet etching process and a PMMA wafer was cut off from 1mm thick PMMA sheet. A micro-channel structure on PMMA substrate was produced by hot embossing process using the Si mold and the PMMA wafer. A vacuum assisted thermal bonding procedure was employed to seal an imprinted PMMA wafer and a blank PMMA wafer. The results of microscopic cross sectional images showed dimensions of channels were well preserved during thermal bonding process. In our procedure, the deformation amount of bonding process was below 1%. The entire fabrication process may be very useful for plastic based microchip systems.

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Characterization of SOI Wafers Fabricated by a Modified Direct Bonding Technology

  • Kim, E.D.;Kim, S.C.;Park, J.M.;Kim, N.K.;Kostina, L.S.
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2000년도 춘계학술대회 논문집 전자세라믹스 센서 및 박막재료 반도체재료 일렉트렛트 및 응용기술
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    • pp.47-51
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    • 2000
  • A modified direct bonding technique employing a wet chemical deposition of $SiO_2$ film on a wafer surface to be bonded is proposed for the fabrication of Si-$SiO_2$-Si structures. Structural and electrical quality of the bonded wafers is studied. Satisfied insulating properties of interfacial $SiO_2$ layers are demonstrated. Elastic strain caused by surface morphology is investigated. The diminution of strain in the grooved structures is semi-quantitatively interpreted by a model considering the virtual defects distributed over the interfacial region.

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Carboxylic acid와 nano zinc oxide를 도입한 열가소성 폴리우레탄 탄성체의 슬립특성 및 기계적 물성에 관한 연구 (Studies on Slip and Mechanical Properties of Thermoplastic Polyurethane Elastomer with Carboxylic acid and Nano zinc oxide)

  • 신현등;김동호;김구니
    • Elastomers and Composites
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    • 제49권3호
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    • pp.191-198
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    • 2014
  • 산성기를 도입한 폴리우레탄에 나노산화아연을 첨가하여 열가소성 폴리우레탄 탄성체를 합성하였으며, 합성된 폴리우레탄 탄성체의 기계적물성, 열적특성, 접촉각, 그립특성을 평가하였다. 그리고 산화아연의 함량과 입자 크기가 폴리우레탄 탄성체에 미치는 영향에 대해서 연구하였다. 나노산화아연을 도입한 경우 이온결합이 형성되어 산성기에 의한 수소결합과 동시에 작용하기 때문에 인장강도, 마모 등 기계적 물성 및 그립특성이 향상되는 것이 확인되었다. 폴리우레탄내의 산화아연 함량에 따른 물성평가 결과 나노산화아연 함량이 증가할수록 이온결합 도입에 의한 친수성이 커져서 wet slip이 지속적으로 상승되었으며, 기계적 물성은 산화아연에 의한 이온화율 50%까지 향상되다가 그 이후에는 감소되는 현상을 나타내었다.

수소 플라즈마 처리를 이용한 구리-구리 저온 본딩 (H2 Plasma Pre-treatment for Low Temperature Cu-Cu Bonding)

  • 최동훈;한승은;추혁진;김인주;김성동
    • 마이크로전자및패키징학회지
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    • 제28권4호
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    • pp.109-114
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    • 2021
  • 상압 수소 플라즈마 전처리가 구리-구리 직접 본딩에 미치는 영향에 대해서 조사하였다. 상압 수소 플라즈마 처리를 통해 구리 박막의 표면 산화층을 환원시킬 수 있었음을 GIXRD 분석을 통해 확인하였다. 플라즈마 파워가 크고 플라즈마 처리 시간이 길수록 환원력 및 표면 거칠기 관점에서 효과적이었다. DCB를 이용한 계면 결합 에너지 측정에서 상압 수소 플라즈마 전처리 후 300℃에서 본딩한 경우 양호한 계면 결합 에너지를 나타내었으나, 본딩 온도가 낮아질수록 계면 결합 에너지가 낮아져 200℃에서는 본딩이 이루어지지 않았다. 습식 전처리의 경우 250℃ 이상에서 본딩한 경우 강한 결합력을 보였으며, 200℃에서는 낮은 계면 결합 에너지를 나타내었다.

코로나 처리를 이용한 신발용 나일론 직물의 접착력 향상 (Improvement of Adhesion of Footwear Nylon Fabric by Corona Treatment)

  • 이재호
    • 접착 및 계면
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    • 제7권3호
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    • pp.26-33
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    • 2006
  • 나일론 직물들이 전류세기 5, 10, 15, 20 A, 공급속도 5, 10, 15 m/min로 코로나 처리되었다. 나일론 직물의 표면변화를 X-ray 회절장치, 주사전자현미경(SEM)과 X-ray 광전자분석기(ESCALAB)로 확인하였다. 또한 물리적 성질의 변화를 인장 인열강도, 접착 및 습윤강도를 통하여 측정하였다. 접착에 사용된 접착제는 열경화성 반응형 폴리우레탄 핫 멜트 접착제이다. 대기압에서 코로나 방전처리에 의해 나일론 직물에 관능기들이 도입되어졌고, 그 결과 접착력은 향상되었다. 코로나 처리된 나일론 직물의 접착강도는 전류 세기가 증가할수록, 공급속도가 감소할수록 증가하였다.

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SDB와 etch-back 기술에 의한 MEMS용 SiCOI 구조 제조 (Fabrication of SiCOI Structures Using SDB and Etch-back Technology for MEMS Applications)

  • 정수용;우형순;정귀상
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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    • pp.830-833
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    • 2003
  • This paper describes the fabrication and characteristics of 3C-SiCOI sotctures by SDB and etch-back technology for high-temperature MEMS applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si(001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The wafer bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR. The strength of the bond was measured by tensile strengthmeter. The bonded interface was also analyzed by SEM. The properties of fabricated 3C-SiCOI structures using etch-back technology in TMAH solution were analyzed by XRD and SEM. These results indicate that the 3C-SiCOI structure will offers significant advantages in the high-temperature MEMS applications.

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N-Methylmorpholine N-Oxide 수용액을 이용한 셀룰로오스 섬유들간의 용제접착에 의한 종이의 물성 변화 (Changes in Physical Properties of Paper by Solvent-Bonding between Cellulose Fibers Using Aqueous Solution of N-Methylmorpholine N-Oxide)

  • 이양헌;박찬헌;이현진;이선희
    • 한국염색가공학회지
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    • 제11권1호
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    • pp.34-41
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    • 1999
  • To examine the increase of paper strength by solvent-bonding using N-methylmorpholine N-oxide (NMMO), a paper was treated with aqueous solutions of NMMO, concentrated at $90^\circ{C}$ for selected periods of time, and pressed for 5 seconds followed by washing and drying. The effect of the increasing NMMO concentration on bonding state and some important properties of samples were mainly investigated. With increasing concentration of NMMO, the degree of bonding between fibers was increased, the fiber cross-sectional shape was changed from 'thin ribbonlike' to 'round rodlike' by swelling with solvent, and the longitudinal waves (crimp) were introduced to fibers, hence the shrinkage, weight per unit area, and thickness of paper were increased. Consequently, the tensile strength and elongation, under standard and wet conditions, and the stiffness were increased, and the water absorption was decreased generally with increasing concentration of NMMO. The moisture regain of treated samples was lower than that of the untreated sample, because of the reduction of space between fibers. But the moisture regain was increased a little with increasing concentration of NMMO due to the fiber swelling with NMMO followed by structural relaxation.

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규소 기판 접합에 있어서 FT-IR을 이용한 수산화기의 영향에 관한 해석 (ANALYSIS OF THE EFFECT OF HYDROXYL GROUPS IN SILICON DIRECT BONDING USING FT-IR)

  • 박세광;권기진
    • 센서학회지
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    • 제3권2호
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    • pp.74-80
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    • 1994
  • Silicon direct bonding 기술은 잔류 응력이 없고, 안정한 특성을 가진 센서의 제작과 silicon-on-insulator 소자의 제조에 널리 이용되고 있다. SDB의 공정 절차는 크게 실리콘 웨이퍼의 수산화 공정 과정과 wet oxidation fumace에서 고온의 열처리 공정 과정을 거치게 된다. 수산화 공정을 행한 후, Fourier transformation-infrared spectroscopy를 사용하여 실리콘 웨이퍼 표면을 분석하여 보면, 실리콘 웨이퍼의 표면에서는 수산화기가 생성됨을 알 수 있다. 실험 결과, $H_{2}O_{2}\;:\; H_{2}SO_{4}$ 용액을 사용한 친수성 용액 처리의 경우에 있어서는 수산화기가 3474 $cm^{-1}$ 주위의 넓은 영역에서 관찰되었다. 그러나, diluted HF 용액의 경우에 있어서는 수산화기가 관찰되지 않았다. 접합된 실리콘웨이퍼를 tetramethylammonium hydroxide 식각 용액을 사용하여 식각 공정을 수행하였다. 식각 공정은 자동 식각 중지가 수행되었으며, 식각된 표면은 평탄하고 균일하였다. 그러므로, 이러한 SDB 기술은 우수한 특성을 가진 압력, 유속, 가속도 센서 등과 같은 센서의 제작 및 센서 응용 분야에 이용될 수 있을 것이다.

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In vivo에서 습윤접착과 상아질 교원섬유용해가 변연누출에 미치는 영향 (IN VIVO EFFECT OF WET BONDING AND COLLAGEN DISSOLUTION IN ACID CONDITIONED DENTIN ON MARGINAL LEAKAGE)

  • 황수진;김명수;이광원;손호현
    • Restorative Dentistry and Endodontics
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    • 제21권1호
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    • pp.254-266
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    • 1996
  • The purpose of this study was to evaluate the degree of marginal leakage that is made by wet bonding to dentin and dissolution of dentinal collagen layer in vivo and in vitro. Class V cavities were prepared to 32 cat's canine teeth and they were randomly assigned into the following 4 groups : Group 1 (not acid conditioned) ; Group 2 (acid-conditioned and blot-dried) ; Group 3 (acid-conditioned and air-dried for 30 seconds) ; Group 4 (acid-conditioned and retreated with 10% NaOCl solution). The acetone-based primer and bonding agent of All Bond 2(Bisco Inc., U.S.A.) and composite resin(Z-100, 3M. Dent. Prod., U.S.A.) were then applied. The resin collar and cap attached to each specimen and 50% silver nitrate solution was placed inside the resin cap for 3 hours. After the canine tooth was resected in level of cervical third, specimens were highly polished and observed the degree of the dye penetration on incisal and gingival margins. The results were as follows ; 1. There was no significant difference of marginal leakage in all the groups between in vivo and in vitro. 2. In vivo, the degree of leakage on the gingival margin showed the lowerest in group 4 and followed by group 2, 3 and group 1 with ascending order. However, there was no statistical difference among all the groups(p>0.05). 3. In vitro, the degree of leakage on the gingival margin showed the lowerest in group 2 and followed by group 4, 3 and group 1 with ascending order. However, there was no significant difference among the experimental groups(p>0.05). 4. The marginal leakage of the incisal margin in vitro was significantly higher in group 1 than the remaining groups(p<0.05).

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수종 상아질 접착제의 제 V급 와동에서의 미세 변연누출에 관한 비교연구 (AN EXPERIMENTAL STUDY FOR THE EFFECT OF ALL-BOND 2, GLUMA, SCOTCH BOND MULTI-PURPOSE)

  • 강창성;박성호;이정석
    • Restorative Dentistry and Endodontics
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    • 제20권1호
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    • pp.261-274
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    • 1995
  • This study aimed to evaluate the marginal microleakage of Class V cavities of All-bond 2 (Wet - bonding system), Gluma (Adhesion of resin to exposed collagen fibers), and Scotchbond Multi-purpose(Mild Etching System). Hundred extracted human teeth divided into a control and three experimental groups consisting of eight teeth. The experimental group was further subdivided into All- bond2, Gluma and Scotchbond MP groups, Vitrebond served as the control. The positive control group consisted of specimens filled with resin and with no etching, primer and bonding procesure. Polished specimens underwent temperature changed from $5^{\circ}C$ to $55^{\circ}C$ a thousand times. After thermocycling, speciemens were placed in 2 % methylene blue dye solution for 24 hours in an incubator set at $37^{\circ}C$. The teeth were sectioned buccolingually and the degree of dye penetration was observed with a stereomicroscoped(*20). The following results were obtained. 1. Both the control and the experimental group showed a lower degree of dye penetration on enamel than on dentin margins(p<0.05) 2. Gluma exhibited a statistically significant lower degree of dye penetration than All-bond 2 on enamel margins(p<0.05) Scotchbond MP also exhibited a lower degree of dye penetration than All-bone 2 but was no statistically significant. Gluma and Scotchbond MP exhibited a similar degree of dye penetration. 3. The degree of dye penetration of All-bond 2, Gluma and Scotch bond MP showed no statistically singnificance on enamel margins but was significantly lower than in the control using Vitrebond. 4. All-bond 2 exhibited a statistically significant lower degree of dye penetration than Gluma on dentin margins. All- bond 2 and Scotchbond MP showed a similar degree of dye penetration. 5. The degree of dye penetration of All-bond 2, Gluma and Scotchbond MP showed no statistically significance on dentin margins. There was neither a statistical significance with the control.

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