• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.3
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• pp.576-583
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• 2018

Silicon carbide is considered to be a potentially useful material for high-temperature electronic devices, as its band gap is larger than that of silicon and the p-type and/or n-type conduction can be controlled by impurity doping. Particularly, porous n-type SiC ceramics fabricated from ${\beta}-SiC$ powder have been found to show a high thermoelectric conversion efficiency in the temperature region of $800^{\circ}C$ to $1000^{\circ}C$. For the application of SiC thermoelectric semiconductors, their figure of merit is an essential parameter, and high temperature (above $800^{\circ}C$) electrodes constitute an essential element. Generally, ceramics are not wetted by most conventional braze metals,. but alloying them with reactive additives can change their interfacial chemistries and promote both wetting and bonding. If a liquid is to wet a solid surface, the energy of the liquid-solid interface must be less than that of the solid, in which case there will be a driving force for the liquid to spread over the solid surface and to enter the capillary gaps. Consequently, using Ag with a relatively low melting point, the junction of the porous SiC semiconductor-Ag and/or its alloy-SiC and/or alumina substrate was studied. Ag-20Ti-20Cu filler metal showed promise as the high temperature electrode for SiC semiconductors.

• The korean journal of orthodontics
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• v.23 no.1 s.40
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• pp.75-88
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• 1993

Recent reports indicate that shorter etching times than 60 seconds can be adopted without affecting the bond strength and clinical disadvantages. The purpose of this in vitro study was to compare the shear bone strength and to measure depth of etch at different etching time length. One hundred and eight extracted bovine lower central incisors were embedded each in a tooth cup with cold-cure acrylic resin. The facial surfaces of the teeth were ground wet with 600-, 800-, 1000-, and 1200-grit Sic papers, and finally polished with a water slurry of extrafine silicon carbide powder, washed with tap water, and dried with hot air. Nine groups of nine prepared teeth were etched with a commercial($38\%$ phosphoric acid solution) for 0, 5, 10, 15, 20, 30, 60, 90, and 120 seconds, respectively, rinsed with tap water, and dried with hot air. One conditioned teeth from every group was selected randomly for the scanning electron microscopic examination, and the remaining eight teeth of the groups were used for measuring the push shear bond strength after bonding brackets and immensing them in the $36.5^{\circ}C$ water for 24 hours. Another nine groups of three teeth were used for measuring the depth of etch and surface roughness with a surface profilometer. after pieces of adhesive tape of 3mm inner diameter positioned on the ground enamel surfaces, and etched with the above mentioned. The data obtained form the above expeiments were analysed statistically with one way ANOVA and Dunkan's multiple range test with the $95\%$ confidence level. The results and conclusion of the study were as follows; 1. The results of shear bond strength for the given experimental etching times were not statistically different, but showed the tendency of decreasing shear bone strength after over 60 seconds etching times. 2. On the scanning election microscopic examination, it was observed that the morphological patterns of etched enamel surface for 5 to 20 seconds were similar and consitent, and those for 30 to 120 seconds showed increasing over-etched patterns depending on the length of etching times. 3. The depth of etch was increased almost proportionally by the length of etching times, but it was not associated with the shear bond strength. 4. The surface roughness increased depending on the length of etching times, but it was not associated with the shear bond strength. 5. This experiment indicated that proper etching time with $38\%$ phosphoric acid solution is in the range of 5 to 30 seconds.

• International Journal of Highway Engineering
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• v.3 no.4 s.10
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• pp.117-126
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• 2001

In this research, evaluation of adhesion in tension property of SBR-modified concrete to ordinary portland cement concrete was conducted with uniaxial direct tensile bond test which was proposed by Kuhlmann. A test set-up was fabricated in order to minimize the eccentric force by introducing a joint which might fully rotate. The main experimental variables were cement-latex ratios, surface preparations and moisture levels. The results obtained were as follows: The LMC specimen at 15% latex-cement ratio increased the adhesion in tension by range of 37% compared to that of conventional cement concrete. This might be due to latex film formed between cement paste and aggregate. The effects of surface preparation on bond of latex modified concrete to conventional concrete were significant at the conditions by sand paper and wire brush. A better bond could be achieved by rough surface rather than smooth. The saturated and surface dry (SSD) condition were considered to be the most appropriate moisture level followed by wet, finally by dry. Thus, a proper surface preparation and moisture level are quite necessity in order to obtain better bonding at LMC overlay.

• Journal of the Korean Vacuum Society
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• v.6 no.1
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• pp.9-19
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• 1997

The reaction mechanisms of dry cleaning with UV-excited chlorine radical for Zn, Fe and Ti trace contaminants on the Si wafer have been studied by SEM, AFM and XPS analyses in this work. The patterned Zn, Fe and Ti films were deposited on the Si wafer surface by thermal evaporation and changes in the surface morphology after dry cleaning with $Cl_2$and UV/$Cl_2$at $200^{\circ}C$ were studied by optical microscopy and SEM. In addition, changes in the surface roughness of Si wafer with the cleaning was observed by AFM. The chemical bonding states of the Zn, Fe and Ti deposited silicon surface were observed with in-line XPS analysis. Zn and Fe were easily cleaned in the form of volatile zinc-chloride and iron-chloride as verified by the surface morphology changes. Ti which forms involatile oxides was not easily removed at room temperature but was slightly removed by UV/$Cl_2$at elevated temperature of $200^{\circ}C$. It was also found that the surface roughness of the Si wafer increased after $Cl_2$and UV/$Cl_2$cleaning. Therefore, the metallic contaminants on the Si wafer can be easily removed at lower temperature without surface damage by a continuous process using wet cleaning followed by UV/$Cl_2$dry cleaning.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• Restorative Dentistry and Endodontics
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• v.27 no.3
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• pp.299-309
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• 2002

The purposes of this study were to evaluate the microtensile bond strength of one-step adhesives accord ing to various dentin surface treatments and to observe the interface between resin(Z-100$^{TM}$) and dentin under SEM. In this study forty-five non-caries extracted human molars and three adhesive systems were used ; AlI-Bond 2(AB), One-Up Bond F(OU), AQ-Bond(AQ). ; In Group 1, 2, 3, AB was used and tooth surfaces were treated by smearing(S), ultrasonic cleansing(US), etching(E) respectively. In Group 4. 5, 6, One-Up Bond F was used and tooth surfaces were also treated as the same way above. In Groups 7, 8, 9, AQ Bond was used and tooth surfaces wet$.$e treated as the same way. Each specimen was prepared for microtensile bond testing, and were stored for 24hrs in 37$^{\circ}C$ distilled water. After that, microtensile bond strength for each specimen was measured. Specimens were fabricated to examine the failure patterns of interface between resin and dentin and observed under the SEM. The results were as follows ; 1. The results(mean$\pm$SD) of microtensile test were group 1, 25.69$\pm$4.31MPa; group 2, 40.93$\pm$10.94MPa; group 3, 47.65$\pm$8.85MPa； group 4, 35.98$\pm$9.14MPa； group 5, 39.66$\pm$8.45MPa; group 6, 43.26$\pm$13.01MPa; group 7, 25.07$\pm$4.2MPa；group 8, 30.4$\pm$4.74MPa；group 9, 33.61$\pm$7.88MPa. 2. One-Up Bond F was showed the highest value of 36.98$\pm$9.14MPa in dentin surface treatment with smearing, and there were significant differences to the other groups (p<0.05). 3. All-Bond 2 was showed the highest value of 40.93$\pm$10.94MPa in dentin surface treatment with ultra-sonic cleansing, but was no significant difference to One-Up Bond F(p>0.05) 4. All-Bond 2 was showed the highest value of 47.65$\pm$8.85MPa in dentin surface treatment with etch ing(10%phosphoric acid), and there were significant differences to the other groups(p<0.05). 5. All-Bond 2 was showed the highest value of 47.65$\pm$8.85MPa in dentin surface treatment according to manufacture's directions. but was no significant difference to One-Up Bond F(p>0.05). 6. AQ Bond was skewed the lowest microtensile bond strength with various dentin surface treatment, and the were significant differences to the other groups(p<0.05).

• Restorative Dentistry and Endodontics
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• v.32 no.4
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• pp.313-326
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• 2007

The purpose of this study was to prove that an intermediate resin layer (IRL) oan increase the bond strength to dentin by reducing the permeability of single-step adhesives. Flat dentin surfaces were created on buccal and lingual side of freshly extracted third molar using a low-speed diamond saw under copious water flow. Approximately 2.0 mm thick axially sectioned dentin slice was abraded with wet #600 SiC paper. Three single-step self-etch adhesives; Adper Prompt L-Pop (3M ESPE, St Paul, MN, USA), One-Up Bond F (Tokuyama Corp, Tokyo, Japan) and Xeno III (Dentsply, Konstanz, Germany) were used in this study. Each adhesive groups were again subdivided into ten groups by; whether IRL was used or not; whether adhesives were cured with light before application or IRL or not; the mode of composite application. The results of this study were as follows; 1. Bond strength of single-step adhesives increased by an additional coating of intermediate resin layer, and this increasement was statistically signigicant when self-cured composite was used (p < 0.001). 2. When using IRL, there were no difference on bond strengths regardless the curing procedure of single-step adhesives. 3. There were no significant difference on bond strengths between usage of AB2 or SM as an IRL. 4. The thickness of Hybrid layer was correlated with the acidity of adhesive used, and the nanoleakage represented by silver deposits and grains was examined within hybrid and adhesive layer in most of single-step adhesives. 5. Neither thickness of hybrid layer nor nanoleakage were related to bond strength.

• Restorative Dentistry and Endodontics
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• v.23 no.1
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• pp.197-212
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• 1998

The purpose of this study was to evaluate the effects of fluoride application on the aspect of shear bond strength of three aesthetic restorative materials to dentin. One light-cured composite resin(Palfique Esterite) and two light-cured glass ionomer cements(Fuji II LC and Compoglass)were used in this study. 120 permanent molars were used for this study. The teeth were extracted due to the origin of periodontal disease. The crowns of all teeth were removed, and the remaining roots were embedded in epoxy resin. The mesial or distal surfaces of roots were ground flat to expose dentin and polished on wet 320-, 400-, and 600 grit SIC papers for a total of 120 prepared flat root dentin surfaces. The prepared samples were divided into six groups. Group 1, 3, and 5 were control groups and group 2, 4, and 6 were experimental groups. Sixty samples for experimental groups were treated with 2% NaF solution for 5 minutes. Group 1 and 2 were bonded with Plafique Esterite, group 3 and 4 were bonded with Fuji II LC, and group 5 and 6 were bonded with Compoglass. After 24 hours water storage at $37{\pm}1^{\circ}C$, all samples were subjected to a shear to fracture with Instron universal testing machine(No.4467) at 1.0 mm/min displacement rate. Dentin surfaces treated with each conditioners before bonding and interfacial layers between dentin and aesthetic restorative materials were observed under Scanning Electron Microscope(Hitachi S-2300) at 20Kvp. The data were evaluated statistically at the 95% confidence level with ANOVA test. The result were as follows; 1. Among the control groups, group 1 showed strongest bond strength and group 3 showed weakest. 2. Among the experimental groups, group 2 showed strongest bond strength and group 6 showed weakest. 3. Statistical analysis of the data showed that pretreatment of dentin with 2% NaF solution significantly decreased the bond strength of three aesthetic restorative materials to dentin(P<0.05). 4. SEM findings of fluoride treated dentin surfaces (2, 4, 6 group) demonstrated dentin surfaces covered with fluoridated reaction products. 5. Except group 4 and 6, resin tags were formed in all groups.

• Journal of the Korean Wood Science and Technology
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• v.45 no.5
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• pp.559-571
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• 2017

This study was conducted to determine the adhesive performances of plywoods affected by layering direction and the amounts of thermoplastic films. The face and back layers of veneer were hardwood species (Mixed light hardwood) and core layer veneer was radiata pine (Pinus radiata D. Don). Thermoplastic film used as adhesive were polypropylene (PP) film and polyethylene (PE) film. Thermal analysis and tensile strength were investigated on each films. As a result, the melting temperature of PP and PE films were $163.4^{\circ}C$ and $109.7^{\circ}C$, respectively, and the crystallization temperature were $98.9^{\circ}C$ and $93.6^{\circ}C$, respectively. Tensile strength and elongation of each films appeared higher on the width direction than length direction. Considering the characteristics of the thermoplastic films, the test for the amount of film used was carried out by layering film to the target thickness on veneer. The effecting of layering direction of film on plywood manufacturing was conducted by laminating in the length and width directions of the film according to the grain direction of veneer. Tensile-shear strength of plywood in wet condition was satisfied with the quality standard (0.7 MPa) of KS F 3101 when the film was used over 0.05 mm of PP film and over 0.10 mm of PE film. Tensile-shear strength of plywood after cyclic boiling exceeded the KS standard when PP film was used 0.20 mm thickness. Furthermore, higher bonding strength was observed on a plywood made with width direction of film according to grain direction of veneer than that of length direction of film. Based on microscopic analysis of the surface and bonding line of plywood, interlocking between veneers by penetration of a thermoplastic film into inner and cracks were observed.

• The korean journal of orthodontics
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• v.34 no.5 s.106
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• pp.439-447
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• 2004

The purpose of this study was to investigate the influence of water, saliva and blood contamination on the bonding strength of metal brackets with a self-etching primer/adhesive to enamel. Ninety-six extracted human teeth were divided into four groups. The brackets were bonded to enamel with a self- etching primer (3M/Unitek Dental Products. Monorovia California) according to one of four protocols. The teeth were bonded in a dry condition (group D) or in contamination with distilled water (group W), artificial saliva (group S). or fresh human blood (group B) Shear bond strengths were tested using an Instron Universal testing machine. After debonding. bracket and tooth surfaces were examined with a stereomicroscope. In each group, four samples were selected and examined with a Scanning electron microscope of the prepared enamel surface and resin-enamel interlace. The results obtained were summarized as follows: Shear bond Strength if group D $(15.22{\pm}2.86MPa)$ and W $(15.20{\pm}3.85 MPa)$ Were higher than in group B$(12.56{\pm}2.94MPa)$ (p<0.05). There were no statistical differences in the shear bond strengths between groups D. W and S (p>0.05). There was a tendency to have less residual adhesive remaining on the enamel surfaces of group B than group D. The SEW morphology of group D and W showed a more roughened etching pattern than group S and B. Water or saliva contamination on bending of orthodontic brackets with Transbond plus self etching primer had almost no influence on bond strength In this study, the blood contaminated group showed the lowest bond strength, but it was above the clinically acceptable bond strength (5.9-7.8 MPa, Reynold, 1975). The results of this study suggest that acceptable clinical bond strengths can be obtained in wet conditions when self-etching adhesives are used.