• The Transactions of the Korean Institute of Power Electronics
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• v.9 no.2
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• pp.119-125
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• 2004

This paper is described the indirect induction heated boiler system and induction heated hot air producer using the voltage-fed series resonant high-frequency inverter which can operate in the frequency range from 20〔KHz〕 to 50〔KHz〕. A specially designed Induction heater, which is composed of laminated stainless assembly with many tiny holes and interconnected spot welding points between stainless plates, is inserted into the ceramic type vessel with external working coil. This working coil is connected to the resonant inverter. In the induction heater, it's primary heating section creates low-pressure saturated steam and secondary heating section generates heat distribution evaporating fluid from the turbulence fluid which is flowing through the vessel. The operating performances of this unique appliance in next generation and its effectiveness are evaluated and discussed from the practical point of view.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.13-19
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• 2018

The soldering property of Pb-containing solder(Sn-Pb) and Pb-free solders(Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In) for solar combiner box module was compared. The solar combiner box module was composed of voltage and current detecting modules, diode modules, and other modules. In this study, solder paste printability, printing shape inspection, solder joint property, X-ray inspection, and shear force measurements were conducted. For optimization of Pb-free soldering process, step 1 and 2 were divided. In the step 1 process, the printability of Pb-containing and Pb-free solder alloys were estimated by using printing inspector. Then, the relationship between void percentages and shear force has been estimated. Overall, the property of Pb-containing solder was better than two Pb-free solders. In the step 2 process, the property of reflow soldering for the Pb-free solders was evaluated with different reflow peak temperatures. As the peak temperature of the reflow process gradually increased, the void percentage decreased by 2 to 4%, but the shear force did not significantly depend on the reflow peak temperature by a deviation of about 0.5 kgf. Among different surface finishes on PCB, ENIG surface finish was better than OSP and Pb-free solder surface finishes in terms of shear force. In the thermal shock reliability test of the solar combiner box module with a Pb-free solder and OSP surface finish, the change rate of electrical property of the module was almost unchanged within a 0.3% range and the module had a relatively good electrical property after 500 thermal shock cycles.