• Clean Technology
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• v.10 no.2
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• pp.73-87
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• 2004

In most of industrial fields, cleaning is employed for removing soils on their products or parts. Halogenated cleaning agents such as CFC-113, 1,1,1-TCE(1,1,1-trichloroethane), MC(methylene chloride) and TCE (trichloroethylene) have been used as cleaning ones in most of companies in the world since their excellent performance of cleaning ability and good material compatibility. However, CFC-113 and 1,1,1-TCE which are ozone destruction substances are not used any more in the advanced countries because of the which are ozone destruction substances are not used any more in the advanced countries because of the Montreal protocol. MC and TCE are now used restrictively at small part of industrial fields in most of countries since they are known to be hazardous or carcinogenic materials. Thus, it is indispensible that the alternative cleaning agents which are environmental-friendly and safe, and show good cleaning ability should be developed or utilized for replacement of the halogenated cleaning agents. Aqueous/semi-aqueous cleaning agents are evaluated to be promising alternative ones among various alternatives in environmental and economical view point. In this study, commercially available 12 aqueous and 6 semi-aqueous cleaning agents were selected and their physical properties, cleaning abilities, rinsing abilities and recycling of contaminated rinse water were measured and analyzed. Aqueous cleaning agents with higher wetting index showed better cleaning ability compared with those with lower wetting index. However wetting index did not have any correlation with cleaning ability in semi-aqueous cleaning agents. It was observed that soil concentration in aqueous and semi-aqueous cleaning agents should be maintained below the certain concentrations which depend on types of clearing agents. More than 70% soils in contaminated rinse water by some of aqueous and semi-aqueous clearing agents could be separated by simple settling method. This means that some cleaning agents with high oil-water separation efficiency will be effiective for recycling oil-contaminated rinse water. It was found that contaminated rinse water with aqueous agents was purified easiy by ultrafiltration method with PAN membrane of 30 kDa.

• Journal of the Korean Society of Marine Environment & Safety
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• v.24 no.6
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• pp.785-795
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• 2018

The International Maritime Organization (IMO) has recognized the risk of hull fouling and announced '2011 Guidelines for the control and management of ship's biofouling to minimize the transfer of invasive aquatic species'and is planning international regulations to enforce them in the future. In this study, to effectively respond to future international regulation, we introduce the case of leading countries related to management of hull fouling and also investigate environmental risk assessment techniques for in-water cleaning. Australia and New Zealand, the leading countries in hull fouling management, have established hull fouling regulations through biological and chemical risk assessment based on in-water cleaning scenarios. Most European countries without their government regulation have been found to perform in-water cleaning in accordance with the IMO's hull fouling regulations. In the Republic of Korea, there is no domestic law for hull fouling organisms, and only approximately 17 species of marine ecological disturbance organisms, are designated and managed under the Marine Ecosystem Law. Since in-water cleaning is accompanied by diffusion of alien species and release of chemical substances into aquatic environments, results from biological as well as chemical risk assessment are performed separately, and then evaluation of in-water cleaning permission is judged by combining these two results. Biological risk assessment created 40 codes of in-water cleaning scenarios, and calculated Risk Priority Number (RPN) scores based on key factors that affect intrusion of alien species during in-water cleaning. Chemical risk assessment was performed using the MAMPEC (Marine Antifoulant Model to Predict Environmental Concentrations), to determine PEC and PNEC values based on copper concentration released during in-water cleaning. Finally, if the PEC/PNEC ratio is >1, it means that chemical risk is high. Based on the assumption that the R/V EARDO ship performs in-water cleaning at Busan's Gamcheon Port, biological risk was estimated to be low due to the RPN value was <10,000, but the PEC/PNEC ratio was higher than 1, it was evaluated as impossible for in-water cleaning. Therefore, it will be necessary for the Republic of Korea to develop the in-water cleaning technology by referring to the case of leading countries and to establish domestic law of ship's hull fouling management, suitable for domestic harbors.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.11
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• pp.99-104
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• 1993

We analyzed the D.I. water used in wet cleaning process of semiconductor device manufacturing both at the D.I. water plant and at the wafer cleaning bath to detect the impurity source of D.I. water contamination. This shows that the quantity of impurity is related to the resistivity of D.I. water, and we found that the cleanliness of the wafer surface processed in D.I. water bath was affected by the degree of the ionic impurity contamination. So we evaluated the cleaning effect as different method for Fe ion, having the best adsoptivity on wafer surface. Moreover the temperature effect of the D.I. water is investigated in case of anion in order to remove the chemical residue after wet process. In addition to the control of D.I. water resistivity, chemical analysis of impurity control in D.I. water should be included and a suitable cleaning an drinsing method needs to be investigated for a high yielding semiconductor device.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.12
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• pp.579-585
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• 2003

Recently the utilization of the ozone dissolved de-ionized water(DI-O3 water) in semiconductor wet cleaning process to replace the conventional RCA methods has been studied. In this paper, we propose the water-electrode type ozone generator which has the ozone gas characteristics of the high concentration and high purity to produce the high concentration DI-O3 water for the silicon wafer surface cleaning process. The ozone generator has the dual dielectric tube structure of silent discharge type and the water is both used to electrode and cooling water. We investigate the performance of the proposed ozone generator which has the design goal of the concentration of 7[wt%] and ozone generation quantity of 6[g/hr] at flow rate of 1[$\ell$/min). The experiment results show that the water electrode type ozone generator has the characteristics of 8.48[wt%] of concentration, 8.08[g/hr] of generation quantity and 76.2[g/kWh] of yield and it's possible to use the proposed ozone generator for the DI-O3 water cleaning process of silicon wafer surface.

• Air Cleaning Technology
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• v.17 no.3 s.66
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• pp.60-61
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• 2004

• Journal of Korean Society of Water and Wastewater
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• v.13 no.1
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• pp.140-145
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• 1999

This study was carried out a investigate the effect of chemical cleaning of corrosion product in cooling system made of copper and copper alloy as basic material and used cooling water as pure water. We studied chemical cleaning condition that minimizes the influence on basic material by means of EDTA solution so as to eliminate the slurry in cooling system. As a result, we found that the main components of sludge in cooling system produced by corrosion of copper were $Cu_2O$, CuO, Cu, and Fe. The optimum condition of chemical cleaning was 400 ppm EDTA solution at $60^{\circ}C$.

• Membrane Journal
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• v.27 no.6
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• pp.519-527
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• 2017

Membrane fouling is the main issue hindering the expansion of low pressure membrane processes for surface water treatment. Therefore, applying periodic hydraulic cleaning for fouling control should be well optimized. Better understanding of membrane fouling associated with periodic hydraulic cleaning would be useful to optimize membrane cleaning strategies. By comparing experimental permeability data with the classical Hermia blocking laws, this study aims at analyzing membrane fouling and understanding dominant fouling mechanisms occurring when filtering a synthetic surface water solution with a pressurized membrane process during six filtration cycles of 30 min each, separated with cyclic cleaning of 1 min by backwashing and forward flushing separately and combined. When applying single cleaning technique, membrane fouling during the first cycles was controlled by complete blocking mechanism while the last cycles were dominated by cake formation. Nevertheless, when combining cleaning technique better membrane regeneration was obtained and fouling was mainly due to cake formation.

• Journal of Fisheries and Marine Sciences Education
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• v.26 no.1
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• pp.34-48
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• 2014

Marine algal assemblages on the artificial reefs at three stations (Haengwon, Geumneung, Pyoseon in Jeju-do) and the growth pattern of Ecklonia cava with water depth were studied before and after rocky cleaning. Nine algal species occurred at three artificial reefs before rocky cleaning in July 2012, however, 19 algal species were found at three artificial reefs after rocky cleaning in July 2013. In particular, 13 of 19 species in 2013 were replaced by different species which were not found in July 2012. Algal biomass rapidly increased in July 2013 after rocky cleaning. The nMDS plot based on the presence and absence data of macro-algal assemblages on the artificial reefs showed that the species compositions between artificial reefs were similar to each other before rocky cleaning operations in July of 2012. However, after rocky cleaning, the species composition of macro-algal assemblages in Haengwon region was similar to that in Pyoseon region while that in Geumneung region was different to those in Haengwon and Pyseon regions in July 2013. It is needed to clarify the suitable water depth for transplantation of perennial Phaeophyta E. cava. According to the data on seasonal changes in total length, total weight, blade length, blade width, blade weight of E. cava, it began to grow rapidly from April and reached to the maximum value in June, and then degeneration of the blade occurred in July and continued to early August. Although the total length of E. cava at 10m water depth was larger than those at 5 m and 15 m water depths, there was no significant difference statistically among water depths by ANOVA test. However, in the values of total weight, blade length, blade width, and blade weight, the growth patterns at 5 m water depth were larger than those at 10 m and 15 m. Thus, it is assumed that the most suitable water depth for transplantation and its maximum growth and effective release of zoospores of E. cava will be 7~10 m water depth.

• Journal of Korean Society of Water Science and Technology
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• v.26 no.6
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• pp.99-107
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• 2018

This research has developed a high temperature steam cleaning technology using a ceramic membrane with durability against temperature and pressure conditions. In steam cleaning, steam of $120^{\circ}C$ is injected into the ceramic membrane to induce pyrolysis by the endothermic reaction to remove fouling from the membrane. The water quality of raw water was adjusted to turbidity 10, 25 NTU and DOC 2.5 mg/L, and the membrane was uniformly fouled by constant pressure operation at 100, 200, and 300 kPa. Physical backwashing was performed with water and air at a pressure of 500 kPa and steam at $120^{\circ}C$ was injected for 0 to 5 minutes. As the turbidity concentration and the operating pressure increased, the flux decreased by 0.7 to 14.4%. It is confirmed that 10.7 to 53.8% recovery is possible than physical cleaning at the injection of steam for 3 minutes, so it is considered that the steam cleaning of the ceramic membrane is effective. Compared with CEB after NaOCl (300 mg/L) filtration at 25 NTU and 300 kPa of turbidity, the steam cleaning result for 3 minutes was similar to 46.7% of CEB for 3 hours. It has been confirmed that steam cleaning is suitable for a ceramic membrane having excellent heat resistance against high temperature. It was considered to have better cleaning efficiency as compared with general physical backwashing.

• Clean Technology
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• v.7 no.3
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• pp.215-223
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• 2001

A present semiconductor cleaning technology is based upon RCA cleaning technology which consumes vast amounts of chemicals and ultra pure water(UPW) and is the high temperature process. Therefore, this technology gives rise to the many environmental issues, and some alternatives such as electrolyzed water(EW) are being studied. In this work, intentionally contaminated Si wafers were cleaned using the electrolyzed water. The electrolyzed water was generated by an electrolysis system which consists of three anode, cathode, and middle chambers. Oxidative water and reductive water were obtained in anode and cathode chambers, respectively. In case of NH4Cl electrolyte, the oxidation-reduction potential and pH for anode water(AW) and cathode water(CW) were measured to be +1050mV and 4.8, and -750mV and 10.0, respectively. AW and CW were deteriorated after electrolyzed, but maintained their characteristics for more than 40 minutes sufficiently enough for cleaning. Their deterioration was correlated with CO2 concentration changes dissolved from air. Contact angles of UPW, AW, and CW on DHF treated Si wafer surfaces were measured to be $65.9^{\circ}$, $66.5^{\circ}$ and $56.8^{\circ}$, respectively, which characterizes clearly the eletrolyzed water. To analyze the amount of metallic impurities on Si wafer surface, ICP-MS was introduced. It was known that AW was effective for Cu removal, while CW was more effective for Fe removal. To analyze the number of particles on Si wafer surfaces, Tencor 6220 were introduced. The particle distributions after various particle removal processes maintained the same pattern. In this work, RCA consumed about $9{\ell}$ chemicals, while EW did only $400m{\ell}$ HCl electrolyte or $600m{\ell}$ NH4Cl electrolyte. It was hence concluded that EW cleaning technology would be very effective for promoting environment, safety, and health(ESH) issues in the next generation semiconductor manufacturing.