• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.1
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• pp.35-42
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• 2015

Injection molding is a high efficient manufacturing technology for producing plastic parts. On the other hand, the warpage of molded plastic parts is an ubiquitous problem in the injection molding process. The main objective of this study was to minimize the amount of warpage occurring in the injection molding process of a hopper of ATDPS made of crystalline polymer (PP) instead of amorphous polymer (ABS). The moldflow CAE simulation was conducted for the molding process of the hopper to clarify the injection moldability, shear rate, shear stress, warpage by changing the gate shape and the number of ribs installed on the top of the hopper flange. The wide gate shape of runner system and multiple rib installation were found to be useful for minimizing the warpage of the hopper. The validity of the CAE simulations was supported by the injection molding experiment for the optimized design case.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.1
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• pp.29-33
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• 2019

With shrinking form factor and improving performance of electronic packages, high input/output (I/O) density is considered as an important factor. Fan out wafer-level packaging (FO-WLP) has been paid great attention as an alternative. However, FO-WLP is vulnerable to warpage during its manufacturing process. Minimizing warpage is essential for controlling production yield, and in turn, package reliability. While many studies investigated the effect of process and design parameters on warpage using finite element analysis, they did not take uncertainty into consideration. As parameters, including material properties, chip positions, have uncertainty from the point of manufacturing view, the uncertainty should be considered to reduce the gap between the results from the field and the finite element analysis. This paper focuses on the effect of uncertainty of Young's modulus of chip on fan-out wafer level packaging warpage using finite element analysis. It is assumed that Young's modulus of each chip follows the normal distribution. Simulation results show that the uncertainty of Young's modulus affects the maximum von Mises stress. As a result, it is necessary to control the uncertainty of Young's modulus of silicon chip since the maximum von Mises stress is a parameter related to the package reliability.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.2
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• pp.93-98
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• 2015

This study focuses on simulation technology in the injection molding process for plastic optic lenses. The CAE program 3D TIMON was used to predict retardation, flow patterns and warpage deformation. The results were compared to the results of optic lenses as measured using the WPA-100 retardation measurement device with injection molding CAE for retardation predictions. According to the analysis and measured results, the distributions of retardation between the CAE results and the measurement results were similar. It was also confirmed that varying the injection speed had an effect on the injection pressure, warpage deformation and retardation distribution. As the injection speed increases, the injection pressure also increases and warpage deformation decreases. However, as the injection speed increases, the retardation distribution deteriorates.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.5
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• pp.121-128
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• 2012

The optimization of cooling system parameters for designing injection mold is very important to acquire the highest part quality. In this paper, the integration of computer simulations of injection molding and Analysis of Variance(ANOVA) with orthogonal array was used as a design tool to optimize the cooling system parameters aimed at minimizing the part warpage. The design optimizer was applied to find the optimum levels of cooling system parameters for a dustpan. This optimization resulted in more uniform temperature distribution over the part and significant reduction of a part warpage, showing the capability of present method as an effective design tool. The whole optimization process was performed systematically in a proper number of cooling simulations. The design optimizer can be utilized effectively in the industry practice for designing mold cooling system with less cost and time.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.3
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• pp.230-236
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• 2014

Wafer level package technology is added to the surface of wafer circuit packages to create a semiconductor technology that can minimize the size of the package. However, in conventional packaging, warpage and fracture are major concerns for semiconductor manufacturing. We optimized the wafer dam design using a finite element method according to the dam height and heat distribution thermal properties. The dam design influences the uniform deposition of the image sensor and prevents the filling material from overflowing. In this study, finite element analysis was employed to determine the key factors that may affect the reliability performance of the dam package. Three-dimensional finite element models were constructed using the simulation software ANSYS to perform the dam thermo-mechanical simulation and analysis.

• Polymer(Korea)
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• v.38 no.6
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• pp.708-713
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• 2014

Most plastics products are being produced by injection molding process. However, mold shrinkage is inevitable in injection molding process and it deteriorates dimensional quality through deflections and warpages. Mold shrinkage depends upon the material property of resin as well as injection molding condition. In this study, material property of resin has been predicted for glass fiber reinforced polycarbonate to control the warpage, and computer simulation of injection molding has been performed using predicted property. It was observed that the deflection of part decreased by the glass fiber reinforced resin. In order to verify the validity of this method and confidence of results, experiments of injection molding were performed. The results of experiments and computer simulations showed good agreement in their tendency of deflections. Consequently, it was concluded that the method of designing the material property of resin conducted in this study can be utilized to control the dimensional accuracy of injection molded products.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.12
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• pp.5709-5715
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• 2012

Injection molding product is commonly used for reducing the weight of automotive vehicle, and door regulator guide rail with plastic material is also made by injection molding process. In order to improve the injection molding performance of plastic regulator guide rail, optimal molding condition is suggested by numerical simulation and DOE after obtaining the sensitivity of parameters for regulator rail manufacturing on warpage and fill time. Furthermore, multi direct gate method and optimal cooling circuit are introduced to get the uniform temperature distribution and better cooling efficiency in molding product. The effect of the proposed design on the injection molding performance is verified by the test of prototype of plastic regulator guide rail.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.11
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• pp.1-8
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• 2019

In this study, we design the feed system and process conditions for a lamp garnish lens of an automobile. For this purpose, four design alternatives are presented and injection molding simulation analyses are performed. The optimal feed system is selected by considering the formability of the product and the cost of mold manufacture. The product formability is assessed by the weld line, warpage, sink mark and the maximum injection pressure, whereas the mold-making cost is estimated by the number of valve gates in the hot runner system. To improve the product formability, process conditions are optimized using an experimental design approach named one-factor-at-a-time. No weld line is generated as a result of the optimization. In addition, it is found the warpage and sink mark are reduced while the maximum injection pressure is increased, compared with those before the optimization.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.7 no.3
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• pp.271-277
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• 2006

Injection molding process is the manufacturing process that can obtain a high quality products in large quantity to a low cost. Since there are many input factors in every situation that can influence part's quality, the method is difficult to save the exact simulation data. Latest, it deals with the CAE method that supports the experiment, it is applied to the Design of Experiment for the optimum injection molding process. If there are many factors, the interaction among those factors must be considered by applying Design of Experiment which is taken from the technique of minimizing the number of experiment. Without a real test, it is taken the simulation data using $Moldflow^(R)$ software. $Moldflow^(R)$ is used for the analysis of injection molding process, it is analyzed the factors that affect a warpage using the Taguchi method and then the optimal injection molding process is obtained.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.10a
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• pp.323-327
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• 2009

Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for both curing and cooling process during silicone molding. For analysis of curing process, a cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the curing as well as the cooling process should be designed carefully so as to reduce the residual stress although the cooling process plays the bigger role than curing process in determining the final residual stress state.