• Proceedings of the KWS Conference
• /
• 2005.06a
• /
• pp.362-366
• /
• 2005

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.14 no.2
• /
• pp.93-98
• /
• 2015

This study focuses on simulation technology in the injection molding process for plastic optic lenses. The CAE program 3D TIMON was used to predict retardation, flow patterns and warpage deformation. The results were compared to the results of optic lenses as measured using the WPA-100 retardation measurement device with injection molding CAE for retardation predictions. According to the analysis and measured results, the distributions of retardation between the CAE results and the measurement results were similar. It was also confirmed that varying the injection speed had an effect on the injection pressure, warpage deformation and retardation distribution. As the injection speed increases, the injection pressure also increases and warpage deformation decreases. However, as the injection speed increases, the retardation distribution deteriorates.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2004.11a
• /
• pp.15-15
• /
• 2004

• Journal of the Microelectronics and Packaging Society
• /
• v.26 no.4
• /
• pp.101-105
• /
• 2019

The adhesion reliability of the epoxy molding compound (EMC) and the printed circuit board (PCB) interface is critical to the quality and lifetime of the chip package since the EMC protects PCB from the external environment during the manufacturing, storage, and shipping processes. It is necessary to measure adhesion energy accurately to ensure product reliability by optimizing the manufacturing process during the development phase. This research deals with the measurement of EMC/PCB interfacial adhesion energy of chip package that has warpage induced by the coefficient of thermal expansion (CTE) mismatch. The double cantilever beam (DCB) test was conducted to measure adhesion energy, and the spring back force of specimens with warpage was compensated to calculate adhesion energy since the DCB test requires flat substrates. The result was verified by comparing the adhesion energy of flat chip packages come from the same manufacturing process.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.38 no.10
• /
• pp.1049-1056
• /
• 2014

Microelectronics components contain various materials with different coefficients of thermal expansion (CTE). Although a large amount of published data on the CTE of standard materials is available, it occasionally becomes necessary to measure this property for a specific actual material over a particular temperature range. A change in the temperature of a material causes a corresponding change in the output of the strain gage installed on the specimen because of not only the mechanical load but also the temperature change. In this paper, a detailed technique for CTE measurement based on these thermal characteristics of strain gages is proposed and its reliability is evaluated. A steel specimen, aluminum specimen, and copper specimen, whose CTE values are well known, were used in this evaluation. The proposed technique was successfully applied to the measurement of the CTE of a coreless package substrate composing of electronics packages.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.17 no.6
• /
• pp.708-714
• /
• 2016

In today's semiconductor industry, manufacturing technology is being developed for the purpose of processing large amounts of data and improving the speed of data processing. The packaging process in semiconductor manufacturing is utilized for the purpose of protecting the chips from the external environment and supplying electric power between the terminals. Nowadays, the WLP (Wafer-Level Packaging) process is mainly used in semiconductor manufacturing because of its high productivity. All of the silicon dies on the wafer are subjected to a high pressure and temperature during the molding process, so that die shift and warpage inevitably occur. This phenomenon deteriorates the positioning accuracy in the subsequent re-distribution layer (RDL) process. In this study, in order to minimize the die shift, a vision inspection system is developed to collect the die shift measurement data.

• Design & Manufacturing
• /
• v.14 no.3
• /
• pp.31-36
• /
• 2020

In injection molding processes, the property of molten resin should be characterized accurately. Among several properties, the PvT state is the most important one, since it affects the shrinkage, warpage, molded weight, and the part density. Thus, the PvT data is crucial to the simulation of the injection molding process. This work shows how such a measurement can be performed for a semi-crystalline and amorphous polymers. The PvT measurement has been conducted using a capillary rheometer using a suitable accessory that blocks the capillary. The results have shown that the PvT data can be obtained using such a rheometer and then the PvT coefficients of the Tait equation can be reached.

• Journal of the Korean Society of Safety
• /
• v.19 no.1
• /
• pp.117-123
• /
• 2004

The prediction to the hydroscopic moisture warping behaviors is analyzed for cellulose-based laminates using a numerical method base on a modified classical laminate(MCL) theory for hygroscopic moisture deformations with cycling testing data. The experimental measurement of the interferometric hygroscopic warping effects, moisture generator, and curvature of cellulose reinforced epoxy laminates is studied under cyclic environmental conditions using a Moire interferometer coupled. Accurate determination of curvatures provides a description of dimensional stability evolution; the tools for validation of computational internal stress and for the warpage prediction in model safety.

• Korean Journal of Optics and Photonics
• /
• v.14 no.5
• /
• pp.504-508
• /
• 2003

We present a new point-diffraction interferometer, which has been devised for the three-dimensional profile measurement of light scattering rough surfaces. The interferometer system has multiple sources of two-point-diffraction and a CCD camera composed of an array of two-dimensional photodetectors. Each diffraction source is an independent two-point-diffraction interferometer made of a pair of single-mode optical fibers, which are housed in a ceramic ferrule to emit two spherical wave fronts by means of diffraction at their free ends. The two spherical wave fronts then interfere with each other and subsequently generate a unique fringe pattern on the test surface. A He-Ne source provides coherent light to the two fibers through a 2${\times}$l optical coupler, and one of the fibers is elongated by use of a piezoelectric tube to produce phase shifting. The xyz coordinates of the target surface are determined by fitting the measured phase data into a global model of multilateration. Measurement has been performed for the warpage inspection of chip scale packages (CSPs) that are tape-mounted on ball grid arrays (BGAs) and backside profile of a silicon wafer in the middle of integrated-circuit fabrication process. When a diagonal profile is measured across the wafer, the maximum discrepancy turns out to be 5.6 ${\mu}{\textrm}{m}$ with a standard deviation of 1.5 ${\mu}{\textrm}{m}$.

• Korean Journal of Optics and Photonics
• /
• v.16 no.4
• /
• pp.361-365
• /
• 2005

An absolute interferometer system with multiple point-sources is devised for tile 3-D measurement of rough surface profiles. The positions of the point sources are determined to be the system parameters that influence the measurement accuracy, so they are calibrated precisely prior to performing actual measurements. For the calibration, a CCD camera composed of a two-dimensional array of photo-detectors was used. Performing optimization of the cost function constructed with phase values measured at each pixel on the CCD camera, the position coordinates of each point source is precisely determined. Measurement results after calibration performed for the warpage inspection of chip scale packages (CSPs) demonstrate that the maximum discrepancy is 9.8 mm with a standard deviation o( 1.5 mm in comparison with the test results obtained by using a Form Taly Surf instrument.