• Journal of the Microelectronics and Packaging Society
• /
• v.26 no.1
• /
• pp.29-33
• /
• 2019

With shrinking form factor and improving performance of electronic packages, high input/output (I/O) density is considered as an important factor. Fan out wafer-level packaging (FO-WLP) has been paid great attention as an alternative. However, FO-WLP is vulnerable to warpage during its manufacturing process. Minimizing warpage is essential for controlling production yield, and in turn, package reliability. While many studies investigated the effect of process and design parameters on warpage using finite element analysis, they did not take uncertainty into consideration. As parameters, including material properties, chip positions, have uncertainty from the point of manufacturing view, the uncertainty should be considered to reduce the gap between the results from the field and the finite element analysis. This paper focuses on the effect of uncertainty of Young's modulus of chip on fan-out wafer level packaging warpage using finite element analysis. It is assumed that Young's modulus of each chip follows the normal distribution. Simulation results show that the uncertainty of Young's modulus affects the maximum von Mises stress. As a result, it is necessary to control the uncertainty of Young's modulus of silicon chip since the maximum von Mises stress is a parameter related to the package reliability.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.22 no.1
• /
• pp.168-172
• /
• 2013

In 3D wafer-stacking technology, one of the major issues is wafer warpage. Especially, The important reason of warpage has been known due to CTE(Coefficient of Thermal Expansion) mismatch between materials. It was too hard to choose how to make the FE model for blanket structured wafer level 3D packaging, because the thickness of each layer in wafer level 3D packaging was too small (micro meter or nano meter scale) comparing with diameter of wafer (6 or 8 inches). In this study, the FE model using the shell element was selected and simulated by the ANSYS WorkBench to investigate effects of the CTE on the warpage. To verify the FE model, it was compared by experimental results.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2012.10a
• /
• pp.343-344
• /
• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2011.06a
• /
• pp.909-910
• /
• 2011

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.41 no.6
• /
• pp.443-453
• /
• 2017

In flip chip technology, the conventional solder bump has been replaced with a copper (Cu) pillar bump owing to its higher input/output (I/O) density, finer pitch, and higher reliability. However, Cu pillar bump technology faces several issues, such as interconnect shorting and higher low-k stress due to stiffer Cu pillar structure when the conventional reflow process is used. Therefore, the thermal compression bonding (TCB) process has been adopted in the flip chip attachment process in order to reduce the package warpage and stress. In this study, we investigated the package warpage induced during the TCB process using a numerical analysis. The warpage of the TCB process was compared with that of the reflow process.

• Transactions of Materials Processing
• /
• v.32 no.6
• /
• pp.367-375
• /
• 2023

Composite materials, known for their excellent mechanical properties and lightweight characteristics, are applied in various engineering fields. Recently, efforts have been made to develop an automotive battery protection panel using a plain-woven composite composed of glass fiber and polypropylene to reduce the weight of automobiles. However, excessive warpage occurs during the GF/PP compression molding process, which makes car assembly challenging. This study aims to develop a model that predicts the warpage during the compression molding process. Obtaining out-of-plane properties such as elastic or shear modulus, essential for predicting warpages, is tricky. Existing mechanical methods also have limitations in calculating these properties for woven composite materials. To address this issue, finite element analysis is conducted using representative volume elements (RVE) for woven composite materials. A warpage prediction model is developed based on the estimated physical properties of GF/PP composite materials obtained through representative volume elements. This model is expected to be used for reducing warpages in the compression molding process.

• Journal of the Microelectronics and Packaging Society
• /
• v.19 no.2
• /
• pp.7-15
• /
• 2012

Semiconductor packages are increasingly moving toward miniaturization, lighter and multi-functions for mobile application, which requires highly integrated multi-stack package. To meet the industrial demand, the package and silicon chip become thinner, and ultra-thin packages will show serious reliability problems such as warpage, crack and other failures. These problems are mainly caused by the mismatch of various package materials and geometric dimensions. In this study we perform the numerical analysis of the warpage deformation and thermal stress of 4-layer stacked FBGA package after EMC molding and reflow process, respectively. After EMC molding and reflow process, the package exhibits the different warpage characteristics due to the temperature-dependent material properties. Key material properties which affect the warpage of package are investigated such as the elastic moduli and CTEs of EMC and PCB. It is found that CTE of EMC material is the dominant factor which controls the warpage. The results of RSM optimization of the material properties demonstrate that warpage can be reduced by $28{\mu}m$. As the silicon die becomes thinner, the maximum stress of each die is increased. In particular, the stress of the top die is substantially increased at the outer edge of the die. This stress concentration will lead to the failure of the package. Therefore, proper selection of package material and structural design are essential for the ultra-thin die packages.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.21 no.1
• /
• pp.154-163
• /
• 1997

Thermally-induced deformation in SMC(Sheet Molding Compound) products is analyzed using three dimensional finite element method. Planar fiber orientation, which causes the anisotropic material properties, is calculated through the flow analysis during the compression stage of the mold. Also curing process is analyzed to predict temperature profile which has significant effects on warpage of SMC products. Through the developed procedure, effects of various process conditions such as charge location, mold temperature, fiber contents, and fiber orientations on deformation of final products are studied. and processing strategies are proposed to reduce the warpage and the shrinkage.

• Journal of the Korean Society of Industry Convergence
• /
• v.10 no.4
• /
• pp.285-289
• /
• 2007

This study presents the preform injection molding of the injection stretch-blow molding process for PET bottles. The numerical analysis of the injection molding of a preform is considered in this paper using CAE with a view to minimize the warpage. In order to determine the design parameters and processing conditions in injection molding, it is very important to establish the numerical model with physical phenomenon. In this study, a three dimensional model has been introduced for the purpose and flow simulations of filling, post-filling and cooling process are carried out. The simulations resulted in the warpage in good agreement with the measurements. Also, from the result of numerical analysis, we appropriate -ly predicted the warpage, deformation and thickness distribution along the preform wall.

• Journal of the Microelectronics and Packaging Society
• /
• v.30 no.3
• /
• pp.40-50
• /
• 2023

Recently, the number of components of smartphones increases rapidly, while the PCB size continuously decreases. Therefore, 3D technology with a stacked PCB has been developed to improve component density in smartphone. For the s tacked PCB, it i s very important to obtain solder bonding quality between PCBs. We investigated the effects of the properties, thickness, and number of layers of interposer PCB and sub PCB on warpage of PCB through experimental and numerical analysis to improve the reliability of the stacked PCB. The warpage of the interposer PCB decreased as the thermal expansion coefficient (CTE) of the prepreg decreased, and decreased as the glass transition temperature (Tg) increased. However, if temperature is 240℃ or higher, the reduction of warpage is not large. As FR-5 was applied, the warpage decreased more compared to FR-4, and the higher the number and thickness of the prepreg, the lower the warpage. For sub PCB, the CTE was more important for warpage than Tg of the prepreg, and increase in prepreg thickness was more effective in reducing the warpage. The shear tests indicated that the dummy pad design increased bonding strength. The tumble tests indicated that crack occurrence rate was greatly reduced with the dummy pad.