• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.57-62
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• 2012

In this paper, numerical analysis by finite element method, parameter design by the Taguchi method and ANOVA method were used to analyze about effect of design deviations and thickness variations on warpage of FCCSP substrate. Based on the computed results, it was known that core material in substrate was the most determining deviation for reducing warpage. Solder resist, prepreg and circuit layer were insignificant effect on warpage relatively. But these results meant not thickness effect was little importance but mechanical properties of core material were very effective. Warpage decreased as Solder resist and circuit layer thickness decreased but effect of prepreg thickness was conversely. Also, these results showed substrate warpage would be increased to maximum 40% as thickness deviation combination. It meant warpage was affected by thickness tolerance under manufacturing process even if it were met quality requirements. Threfore, it was strongly recommended that substrate thickness deviation should be optimized and controlled precisely to reduce warpage in manufacturing process.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.12
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• pp.36-43
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• 2021

In this study, the optimal feed system and process conditions that can simultaneously minimize each warpage occurring in the two shape features of the 2P Header HSG, a connector part for automobiles, were determined through injection molding simulation analysis. First, we defined each warping deformation of the two features geometrically and quantified them approximately using the injection molding simulation data. For design optimization, a full factorial experiment was conducted considering the feed system, resin temperature, and packing pressure as design variables, and a follow-up experiment was conducted based on the analysis of the average warpage. In this study, an optimal design was generated considering both the warpage result and resin-saving effect. In the optimal design, the warpages of the two shape features were predicted to be 0.18 and 0.29 mm, and these warpages were found to meet the allowable limit of warpage, which is 0.3 mm, for part assembly.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.41-45
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• 2018

As the size of semiconductor chip shrinks, the electronic industry has been paying close attention to fan-out wafer level packaging (FO-WLP) as an emerging solution to accommodate high input and output density. FO-WLP also has several advantages, such as thin thickness and good thermal resistance, compared to conventional packaging technologies. However, one major challenge in current FO-WLP manufacturing process is to control wafer warpage, caused by the difference of coefficient of thermal expansion and Young's modulus among the materials. Wafer warpage induces misalignment of chips and interconnects, which eventually reduces product quality and reliability in high volume manufacturing. In order to control wafer warpage, it is necessary to understand the effect of material properties and design parameters, such as chip size, chip to mold ratio, and carrier thickness, during packaging processes. This paper focuses on the effects of thickness of chip and molding compound on 12" wafer warpage after PMC of EMC using finite element analysis. As a result, the largest warpage was observed at specific thickness ratio of chip and EMC.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.811-814
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• 2001

Warpage analysis of bobbin, molded by injection molding process was performed. Concerned with a mold design, cooling system was designed based on Taguchi method, the distance between cavity wall and cooling channel was most influent factor amongst four design variables like an inlet temperature of coolant, a coolant flow rate, a diameter of cooling channel, and the distance between cavity wall and cooling channel. Optimal packing processes to reduce the warpage of molded part was analyzed based on the response surface method by considering holding pressure. Their optimal processing conditions were 9.4 seconds, 5.3 seconds, 15.2 seconds, and 85MPa, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.31-39
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• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.8 no.3
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• pp.90-97
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• 2009

In the study, a design methodology for robust minimization of a warpage in injection-molded part is presented. Taguchi's parameter design method is integrated with a computer simulation tool for injection molding to search for best design with robustness against the process variability by noises. The proposed methodology is based on a two-stage process: (1) reducing a warpage in the part by optimizing the part geometry including the layout and size of ribs, and (2) additionally minimizing the warpage by optimizing process conditions. An example is used to illustrate the usefulness of the design methodology.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.7
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• pp.84-90
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• 2022

The purpose of the cover housing component of a car door is to protect the terminals of the plug housing that connects the electric control unit on the door side to the car body. Therefore, for a smooth assembly with the plug housing and to prevent contaminants from penetrating into the gaps that occur after assembly, the warpage of the cover housing should be minimized. In this study, to minimize the warpage of the cover housing, optimization was performed for design factors related to the mold and processes based on the injection molding simulation. These design factors include gate location, gate diameter, injection time, resin temperature, mold temperature, and packing pressure. To optimize the design factors, Taguchi's approach to the design of experiments was adopted. The optimal combination of the design factors and levels that minimize warpage was predicted through L₁₈-orthogonal array experiments and main effects analysis. Moreover, the warpage under the optimal design was estimated by the additive model, and it was confirmed through the simulation experiment that the estimated result was quite consistent with the experimental result. Additionally, it was found that the warpage under the optimal design was significantly improved compared to both the warpage under the initial design and the best warpage among the orthogonal array experimental results, which numerically decreased by 36.9% and 23.4%, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.1
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• pp.17-22
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• 2016

Flexible organic light-emitting diode (OLED) devices consist of multi-stacked thin films or layers comprising organic and inorganic materials. Due to thermal coefficient mismatch of the multi-layer films, warpage of the flexible OLED is generated during high temperature process of each layer. This warpage will create the critical issues for next production process, consequently lowering the production yield and reliability of the flexible OLED. In this study, we investigate the warpage behavior of the flexible OLED for each bonding process step of the multi-layer films using the experimental and numerical analysis. It is found that the polarizer film and barrier film show significant impact on warpage of flexible OLED, while the impact of the OCA film on warpage is negligible. The material that has the most dominant impact on the warpage is a plastic cover. In order to minimize the warpage of the flexible OLED, we estimate the optimal material properties of the plastic cover using design of experiment. It is found that the warpage of the flexible OLED is reduced to less than 1 mm using a cover plastic of optimized properties which are the elastic modulus of 4.2 GPa and thermal expansion coefficient of $20ppm/^{\circ}C$.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.5
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• pp.563-571
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• 2012

In 3D integration package using TSV technology, bonding is the core technology for stacking and interconnecting the chips or wafers. During bonding process, however, warpage and high stress are introduced, and will lead to the misalignment problem between two chips being bonded and failure of the chips. In this paper, a finite element approach is used to predict the warpages and stresses during the bonding process. In particular, in-plane deformation which directly affects the bonding misalignment is closely analyzed. Three types of bonding technology, which are Sn-Ag solder bonding, Cu-Cu direct bonding and SiO2 direct bonding, are compared. Numerical analysis indicates that warpage and stress are accumulated and become larger for each bonding step. In-plane deformation is much larger than out-of-plane deformation during bonding process. Cu-Cu bonding shows the largest warpage, while SiO2 direct bonding shows the smallest warpage. For stress, Sn-Ag solder bonding shows the largest stress, while Cu-Cu bonding shows the smallest. The stress is mainly concentrated at the interface between the via hole and silicon chip or via hole and bonding area. Misalignment induced during Cu-Cu and Sn-Ag solder bonding is equal to or larger than the size of via diameter, therefore should be reduced by lowering bonding temperature and proper selection of package materials.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.2
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• pp.60-65
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• 2012

This paper deals with an CAE analysis and optimization of injection molding for a mobile phone cover. Two design goals are established in the optimization; one is to switch over the feed system from cold runner to hot runner for the purpose of reducing material costs, and the other is to minimize the warpage in order to improve product quality. By the full-factorial experiments for design parameters, we showed that the cold runner design could be changed to the hot runner design by replacing the current resin with a new resin of higher fluidity. In addition, we could significantly reduce the warpage of the cover product under the hot runner system by optimizing packing pressure and packing time.