• 한국항행학회논문지
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• 제14권3호
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• pp.426-431
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• 2010

태양전지용 웨이퍼 제조공정에 있어 Slurry의 가격 비중은 약 68% 정도로 매우 큰 비중을 차지하고 있기 때문에, 제조비용 절감측면과 Wafering 원가혁신 및 산업폐기물 처리비용 절감효과, 환경오염 방지를 위해 Slurry의 순환 사용은 필수적이다. 기존 Slurry를 재생하는 방식은 물리적인 원심분리(데칸터) 방식을 이용한 방법을 사용하고 있으나 미분(微粉)이 남아 있어 재생품질에 한계가 있고, 대부분 액체, 100% 오일과 분리되지 않은 상태로 재생된다. 이 상태를 건조시키는 경우도 순도가 많이 떨어진다. 본 논문에서는 원심분리(데칸터) 방식과 케미컬 방식을 함께 사용하여, 태양전지 Wafering 공정에서 필수적인 Slurry를 재생함에 있어, 원심분리에 의한 재생품질의 한계를 극복할 수 있는 재생기술을 개발하였고, Slurry 재생에 대한 Total Solution을 제공하여 성능을 향상시키고 재생 회수율을 높였다.

• 한국정밀공학회지
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• 제19권6호
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• pp.145-154
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• 2002

CMP (Chemical mechanical polishing) process was used to control the fine grinding process induced mechanical damage of Cz Silicon wafer. Characterization of mechanical damage was carried out using Nomarski microscope, magic mirror and also using angle lapping and lifetime scanner evaluation after heat treatment. Magic mirror and lifetime scanner were very useful for the residual damage pattern characterization and CMP process was effective on the reduction of fine grinding induced mechanical damage.

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2000년도 추계총회,초청강연,특별강연,연구발표회
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• pp.59.2-59
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• 2000

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 추계학술대회 논문집
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• pp.31-32
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• 2012

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.980-986
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive, the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, Ist, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the effect of the wheel path density and relative velocity on the characteristic of ground wafer in in-feed grinding with cup-wheel. It seems that the variation of the parameters in radial direction of wafer results in the non-uniform surface quality over the wafer. So, in this paper, the geometric analysis on grinding process is carried out, and then, the effect of the parameters on wafer surface quality is evaluated

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.98-101
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive. the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, 1st, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the flatness of the ground wafer. Generally, the ground wafer has concave profile because of the difference of wheel path density, grinding temperature and elastic deformation of the equiptment. Tilting mathod is applied to avoid such non-uniform material removes. So, in this paper, the geometric analysis on grinding process is carried out, and then, we can predict the profile of th ground wafer by using profile simulation.

• 한국결정성장학회:학술대회논문집
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• 한국결정성장학회 1996년도 The 9th KACG Technical Annual Meeting and the 3rd Korea-Japan EMGS (Electronic Materials Growth Symposium)
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• pp.88-138
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• 1996

Electronics grew up to the largest industry in the world supported by Si wafer. In near future, the Si wafer may use 300mm in diameter for economic requirement. This size wafer may use to produce large logic chip, 256Mbit DRAM, and other large complex and high density chip. Then, the quality including flatness and crustal characters may be required very high performance. And, their price should be reasonable and high quantity may be required. These requirements should be solve lot of hard problems of crystal growth, wafering mechanical processing and their cost problems. In this presentation, I may discuss following items.

• 한국산학기술학회논문지
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• 제13권5호
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• pp.2002-2008
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• 2012

최근 들어 전자제품 소형화로 인한 방열의 중요성이 대두되고 있는 가운데 다양한 소재의 히트싱크가 사용되고 있다. 본 연구에서는 태양광에너지 소재산업에서 발생하는 슬러리로부터 SiC를 성공적으로 분리하여 다공성 세라믹 히트싱크를 개발하였고 알루미늄 히트싱크, 순수 SiC 히트싱크와 방열성능 비교실험을 통해 다공성 재생 SiC 세라믹 히트싱크의 방열성능을 검증하였다. 실험 결과, 다공성 재생 SiC는 알루미늄 히트싱크 대비 방열성능이 우수함을 확인하였는데 이는 미세기공으로 인한 전열면적 증가에 기인한다. 또한, 수치해석을 사용하여 미세기공이 방열성능에 미치는 영향을 대류열전달계수 증가로 정량화하였다.

• 한국정밀공학회지
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• 제19권2호
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• pp.187-194
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• 2002

For the fine grinding process development of semiconductor monocrystalline silicon, wheel rotational speed, chuck rotational speed, feed rate and hysteresis force were controlled. Magic mirror system was used for grinding wheel pattern analysis. Curvature of wheel pattern was measured by fitting equation. The modeling of surface wheel pattern was related to wheel and chuck rotational speed. The calculated curvature of the model was well matched with the measured curvature. The statistical analysis indicated wheel and chuck rotational speed were significantly effective on.

• 한국세라믹학회지
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• 제31권2호
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• pp.147-154
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• 1994

The imperfections of LiTaO3 crystals grown from the Pt-Rh and the Ir crucible were investigated with X-ray diffraction, optical and electron microscope. The growth direction was <100>h and the plane parallel to the plane connecting two main growth ridges was (012)h which would be the main cleavage plane. The dislocation density in the specimen cut parallel to (012)h plane increased with polishing time and the inverted ferroelectric microdomains were induced based on this dislocations. Such imperfections as 180$^{\circ}$ domains, microcracks, dislocations and stacking faults. could be found in the LiTaO3 crytals. The crystal contaminated with lots of Rh form Pt-Rh crucible during the crystal growing under air atmosphere contained more imperfections. The main cleavage plane and subgrain boundary parallel to its growing axis might be the main source of reducing the mechnical strength during the wafering process.