• Resources Recycling
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• v.12 no.3
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• pp.25-30
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• 2003

The synthesis of SiC used for the parts of the gas turbine and the heat exchanger, was carried out. In this study, wire cutting slurry of silicon wafer and the graphite rod of spent zinc-carbon battery were applied to the starting materials for the synthesis. The powders of Si or Si+SiC were obtained from the waste material by filtration, gravity separation and magnetic separation. Graphite powder was produced by dismantling, grinding and gravity separation from spent zinc-carbon battery. The synthesis of SiC could be completed from the mixture powders of Si and C or Si+SiC and C at the condition of equivalent ratio of Si and C, atmosphere of Ar or vacuum, temperature of above 1$600^{\circ}C$ and 2 hours reactions. The purity of synthesized Si-C was above 99%.

• Tribology and Lubricants
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• v.39 no.1
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• pp.28-34
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• 2023

Because of their cleanliness, low friction, and high stiffness, aerostatic bearings are used in numerous applications. Aerostic bearings that use porous materials as means of flow restriction have higher stiffness than other types of bearings and have been successfully applied as guide bearings, which have high motion accuracy requirements. However, the performances of porous bearings exhibit strong nonlinearity and can vary considerably depending on design parameters. Therefore, accurate prediction of the performance characteristics of porous bearings is necessary or their successful application. This study presents a porous bearing design and performance analysis for a spindle used in wafer polishing. The Reynolds and Darcy flow equations are solved to calculate the pressures in the lubrication film and porous busing, respectively. To verify the validity of the proposed analytical model, the calculated pressure distribution in the designed bearing is compared with that derived from previous research. Additional parametric studies are performed to determine the optimal design parameters. Analytical results show that optimal design parameters that obtain the maximum stiffness can be derived. In addition, the results show that cross-coupled stiffness increases with rotating speed. Thus, issues related to stability should be investigated at the design stage.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.84-88
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• 2013

These days embedded technology may be the most significant development in the electronics industry. The study focused on the development of active device embedding using flexible printed circuit in view of process and materials. The authors fabricated 30um thickness Si chip without any crack, chipping defects with a dicing before grinding process. In order to embed chips into flexible PCB, the chip pads on a chip are connected to bonding pad on flexible PCB using an ACF film. After packaging, all sample were tested by the O/S test and carried out the reliability test. All samples passed environmental reliability test. In the future, this technology will be applied to the wearable electronics and flexible display in the variety of electronics product.

• Korean Journal of Materials Research
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• v.19 no.5
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• pp.288-292
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• 2009

This article shows various factors that influence the thermal-cycling reliability of semiconductor devices utilizing the lead-on-chip (LOC) die attach technique. This work details how the modification of LOC package design as well as the back-grinding and dicing process of semiconductor wafers affect passivation reliability. This work shows that the design of an adhesion tape rather than a plastic package body can play a more important role in determining the passivation reliability. This is due to the fact that the thermal-expansion coefficient of the tape is larger than that of the plastic package body. Present tests also indicate that the ceramic fillers embedded in the plastic package body for mechanical strengthening are not helpful for the improvement of the passivation reliability. Even though the fillers can reduce the thermal-expansion of the plastic package body, microscopic examinations show that they can cause direct damage to the passivation layer. Furthermore, experimental results also illustrate that sawing-induced chipping resulting from the separation of a semiconductor wafer into individual devices might develop into passivation cracks during thermal-cycling. Thus, the proper design of the adhesion tape and the prevention of the sawing-induced chipping should be considered to enhance the passivation reliability in the semiconductor devices using the LOC die attach technique.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.121-122
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• 2008

Lithium Niobate (LN:LiNbO3) is a compound of niobium, lithium and oxygen. The characteristics of LN are piezoelectricity, ferroelectricity and photoelectricity, and which is widely used in surface acoustic wave (SAW). To manufacture LN device, the LN surface should be a smooth surface and defect-free because of optical property, but the LN material is processed difficult by traditional processes such as grinding and mechanical polishing (MP) because of its brittleness. To decrease defects, chemical mechanical polishing (CMP) was applied to the LN wafer. In this study, the suitable parameters scuh as pressure and relative velocity, were investigated for the LN CMP process. To improve roughness, the LN CMP was performed using the parameters that were the highest removal rate among process parameters. And, evaluation of optical property was performed by the optical reflectance and non-linear characteristic.

• 한국신재생에너지학회:학술대회논문집
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• 2011.05a
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• pp.187.2-187.2
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• 2011

태양광산업의 value chain중 up-stream쪽인 고순도 실리콘산업은 셀, 모듈, 시스템 쪽에 비하여 영업 이익률이나 부가가치 측면에서 매우 높은 성장성을 현재 보여주고 있으며 최근 원자력산업의 안전성 문제가 대두됨으로 인하여 태양광수요가 전 세계적으로 증대되는 경향을 나타내어 태양광용 실리콘의 수요가 확대됨과 아울러 spot시장에서의 가격 또한 상승하고 있다. 이런 관점에서 잉곳 및 웨이퍼 가공 중에 발생하는 고순도 실리콘 폐기물의 재활용 이 다시 주목받고 있다. 태양전지 웨이퍼(wafer)용 소재는 6N급 이상의 결정질 실리콘 잉곳(ingot)이 주를 이루며, 고효율의 셀을 제조하기 위해서 단결정 실리콘 잉곳이 많이 사용된다. 실리콘 단결정을 육성하는 방법에는 Floating zone 법, Czochralski 법, Bridgeman 법, CVD 등 매우 다양하다. 이 중 Czochralski 법은 전체 생산량의 대부분을 차지하고 있는 방법으로, 용융액에서 결정을 인상하여 ingot을 제작하는 방법이다. 그러나 대량의 전기에너지를 소비하여 제작되는 고순도의 실리콘 단결정 잉곳은 후 가공공정에서 그 절반 이상이 분말(powder) 및 슬러지(sludge)로 폐기되므로, 자원의 재활용 및 환경오염 측면에서 주요과제가 되고 있다. Czochralski 법으로 제작된 ingot의 경우 그 표면이 매끄럽지 못하여, 웨이퍼 단위의 가공 시 형태가 진원이 될 수 있도록 표면을 미리 연마(grinding)하는데, 이때에도 미세 분말이 다량 발생하게 된다. 본 연구에서는 이러한 고순도 단결정 실리콘 ingot의 연마 가공공정에서 발생한 미세 분말을 용해하여 보았다. 진공 챔버(chamber) 내부에 유도가열 코일과 냉도가니로 구성된 장비를 통해 전자기유도가열을 이용하여 실리콘 분말 폐기물을 용해하고, 그 시편을 ICP-MS 및 비저항 측정을 통해 분말 의 특성을 조사하여 재활용 가능성을 검토해 보았다.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.3
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• pp.9-15
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• 2021

Miniaturization of semiconductor devices has recently faced a physical limitation. To overcome this, 3D packaging in which semiconductor devices are vertically stacked has been actively developed. 3D packaging requires three unit processes of TSV, wafer grinding, and bonding, and among these, copper bonding is becoming very important for high performance and fine-pitch in 3D packaging. In this study, the effects of Ti nanolayer on the antioxidation of copper surface and low-temperature Cu bonding was investigated. The diffusion rate of Ti into Cu is faster than Cu into Ti in the temperature ranging from room temperature to 200℃, which shows that the titanium nanolayer can be effective for low-temperature copper bonding. The 12nm-thick titanium layer was uniformly deposited on the copper surface, and the surface roughness (R_q) was lowered from 4.1 nm to 3.2 nm. Cu bonding using Ti nanolayer was carried out at 200℃ for 1 hour, and then annealing at the same temperature and time. The average shear strength measured after bonding was 13.2 MPa.

• Journal of Oral Medicine and Pain
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• v.30 no.1
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• pp.69-77
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• 2005

The purposes of this study were to develop and introduce a novel intraoral appliance for bruxism composed of power switch and biofeedback device and further to examine inter- and intra-reliability of the appliance prior to clinical tests. The newly-developed appliance consisted of detection sensors, a central processing unit (CPU), a reactor and a storage unit and a displayer. Compact-sized, waterproof switches were selected as bruxism detection sensor and any sensor activation by clenching or grinding event was processed at the CPU and transmitted, by radio wave, to the reactor and storage unit and triggered auditory or vibratory signal, subsequently producing biofeedback to the patient with bruxism. The data on bruxing event in the storage unit can be displayed on the computer, making it possible analyzing frequency, duration and nature of bruxism. Cast models were obtained from ten volunteers with normal occlusion to evaluate reliability of the appliances. For inter-operator reliability on the intraoral appliances, each operator of the two fabricated the appliance for the same subject and compared the minimal contact forces provoking auditory biofeedback reaction in vertical, lateral and central directions. Intra-operator reliability was also investigated on the appliances made by a single operator at two separate times with an interval of two days. Conclusively, the newly-developed appliance is compact and safe to use in oral circumstance and easy to make. Furthermore, it had to be proven reliability excellent enough to apply in clinical settings. Thus, it is assumed that this appliance with the processor and the storage of data and auditory or vibratory biofeedback function is available and useful to analyze and control bruxism.