• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.755-756
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• 2009

• Proceedings of the KIEE Conference
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• 2002.04a
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• pp.123-125
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• 2002

To simulate the characteristics of an High-Intensity Discharge Lamp, this paper uses PSpice circuit model which have been developed from modification of the classical Cassie and Mayr equations. The model is for an High-Intensity Discharge Lamp and compatible to adopt high-frequency electric ballast. This model is correspond to some conditions between the simulated and experimental results.

• Proceedings of the Korean Vacuum Society Conference
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• 2001.07a
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• pp.130-131
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• 2001

• 한국전기화학회:학술대회논문집
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• 2004.10a
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• pp.39-39
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• 2004

• Proceedings of the PSK Conference
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• 2000.04a
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• pp.208.1-208.1
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• 2000

• Proceedings of the Korean Vacuum Society Conference
• /
• 1997.02a
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• pp.168-168
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• 1997

• Journal of Welding and Joining
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• v.8 no.3
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• pp.53-59
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• 1990

Temperature distribution of thick plate during welding was investigated. Applied weldng process was shielded metal arc welding which was known as one of the most utilized processes in fabrication fields. Heating and cooling cycles were recorded by imploying high fidelity recorded and K-type thermocouple of 0.3mm in diameter. Both analytical and numerical calculations were preformed so as to verify the thermal cycle measurement. Results showed that the temperature of a welded points at given time could be predicted by the theoretical calculations. It was considered that methods could be applied to real structural components with slight modification.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1544-1546
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• 2003

In this study, composite materials were put to dry interfacial treatment by use of plasma technology. It has been presented that the optimum parameters for the best wettability of the samples at the time of generation of plasma were oxygen atmosphere, 0.1 torr of system Pressure, 100 W of discharge power, and 3 minutes of discharge time. The decrease in surface potential of charged samples by corona discharge indicates that the amount of accumulated electrical charges reduces and the charges that have been injected lessen rapidly when the duration of UV irradiation increases. The surface resistivity and the tensile strength of plasma treated samples, a longer UV irradiation time resulted in decreased insulation.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.923-924
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• 2007

due to the modification of ventilation system for variable speed high efficiency PMSM, the ventilation structure is analyzed in this part. First, a cooling structure was proposed for the variable speed PMSM. Through the contrast result of whole stress and speed distribution in the cooling channel by fluid field, the fans setting fashion is confirmed. By the studying of cooling structure for improved PMSM, the position of the cooling hole in the rotor is optimized by the finite element method. At last, the thermal field distribution of the motor is calculated by FEM. The calculated thermal rise is in accord with measured value, which provides effective basement for the design and safety operation of PMSM.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.46-49
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• 2003

Chemical mechanical polishing (CMP) is an essential dielectric planarization in multilayer microelectronic device fabrication. In the CMP process it is necessary to minimize the extent of surface defect formation while maintaining good planarity and optimal material removal rates. The polishing mechanism of W-CMP process has been reported as the repeated process of passive layer formation by oxidizer and abrasion action by slurry abrasives. Thus, it is important to understand the effect of oxidizer on W passivation layer, in order to obtain higher removal rate (RR) and very low non-uniformity (NU%) during W-CMP process. In this paper, we compared the effects of oxidizer or W-CMP process with three different kind of oxidizers with 5% hydrogen peroxide such as $Fe(NO_3)_3$, $H_2O_2$, and $KIO_3$. The difference in removal rate and roughness of W in stable and unstable slurries are believed to caused by modification in the mechanical behavior of $Al_3O_3$ particles in presence of surfactant stabilizing the slurry.