• 한국분말재료학회지
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• 제20권2호
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• pp.138-141
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• 2013

The microstructure evolution during sintering of the W-5 wt.%Cu nanocomposite powders was investigated for the purpose of developing a high density W-Cu alloy. The W-5 wt.%Cu nanopowder compact, fully-densified during sintering at 1623 K, revealed a homogeneous microstructure that consists of high contiguity structures of W-W grains and an interconnected Cu phase located along the edges of the W grains. The Vickers hardness of the sintered W-5 wt.%Cu specimen was $427{\pm}22$ Hv much higher than that ($276{\pm}19$ Hv) of the conventional heavy alloy. This result is mostly due to the higher contiguity microstructure of the W grains compared to the conventional W heavy alloy.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1988년도 춘계학술대회 논문집
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• pp.43-45
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• 1988

Four W/Cu system(60wt%W-40wt%Cu, -0.lwt%Ni, -0.5wt%Ni, -0.lwt%C) and four WC/Cu system(60wt%WC-40wt%Cu, -0.lwt%Ni, -0.5wt%Ni, 0.lwt%C) electrical contacts were prepared by a press-sinter-infiltration process to compare with their properties. Hardness and electrical conductivity are proportional to the refractory metal(W or WC) properties and showed the effect of additives. Arc erosion trend of switch test is changed by current level. High currant test at 1kA showed a different crack formation pattern and erosion mode between W/Cu system and WC/Cu system contacts.

• 한국분말재료학회지
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• 제8권4호
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• pp.245-252
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• 2001

Recent remarkable progress in the semiconductor industry has promoted smaller size of semiconductor chips and increased amounts of heat generation. So, the demand for a substrate material to meet both the characteristics of thermal expansion coefficient and heat radiation has been on the increase. Under such conditions, tungsten(W)-copper(Cu) has been proposed as materials to meet both of the above characteristics. In the present study, the W-10wt.%Cu powders were synthesised by the mixing and hydrogen reduction of the starting mixture materials such as W-Cu, $W-CuCl_2$and $WO_3-CuCl_2$ in order to obtain the full densification. The W-10wt.%Cu produced by hydrogen reduction showed the higher interparticle friction than the simple mixed W-10wt%Cu because of the W agglomerates. In the dilatometric analysis the W-10wt.%Cu prepared from the $W-CuCl_2$was largely shrank by heating up $1400^{\circ}C$ at the constant heating rate of $5^{\circ}C$/min. The possibility of application of metal injection molding (MIM) was also investigated for mass production of the complex shaped W-Cu parts in semiconductor devices. The relationship between the temperature of molding die and the pressure of injection molding was analyzed and the heating up stage of 120-$290^{\circ}C$ in the debinding process was controlled for the most suitable MIM condition.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2002년도 추계학술강연 및 발표대회
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• pp.34-35
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• 2002

• 한국분말재료학회지
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• 제4권4호
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• pp.304-309
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• 1997

The synthesis of W-l5wt%Cu nanocomposite powder by hydrogen reduction of ball milled W-Cu oxide mixture was investigated in terms of powder characteristics such as particle size, mixing homogeneity and micropore structure. It is found that the micropores in the ball milled oxide (2-50 nm in size) act as an effective removal path of water vapor, followed by the formation of dry atmosphere at reaction zone. Such thermodynamic condition enhances the nucleation of W phase but suppresses the growth process, being in favor of the formation of W nanoparticles (about 21 nm in size). In addition, the superior mixing homogeneity of starting oxide mixture turned out to Play a significant role for forming extraordinary chemical homogeneity of W-l5wt%Cu nanocomposite powder.

• 한국분말재료학회지
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• 제5권4호
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• pp.258-264
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• 1998

The initial sintering behaviour of the powder injection molded (PIMed) W-l5wt%Cu nanocomposite powder was investigated. The W-Cu nanocomposite powder was produced by the mechanochemical process consisting of high energy ball-milling and hydrogen reduction of W blue powder-CuO mixture. Solid state sintering of the powder compacts was conducted at $1050^{\circ}C$ for 2~10 hours in hydrogen at mosphere. The sintering behaviour was examined and discussed in terms of microstructural developments such as W-Cu aggregate formation, pore size distribution and W grain growth. The volume shrinkage of PIM specimen was slightly larger than that of PM(conventional PM specimen), being due to fast local densification in the PIM. Remarkable decrease of carbon and oxygen in the PIM enhanced local densification in the early stage of solid state sintering process with eliminating very fine pores less than 10 nm. In addition, such local densiflcation in the PIM is presumably responsible for mitigating of W-grain growth in the initial stage.

• 마이크로전자및패키징학회지
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• 제17권1호
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• pp.25-31
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• 2010

본 연구에서는 무연 솔더 중 우수한 특성을 보여 실용화된 Sn-3.0Ag-0.5Cu 조성의 솔더를 사용하여 2주 동안의 시효조건에서 W의 함량이 무전해 Ni-W-P 도금층과 솔더와의 계면에서의 IMC 생성에 미치는 영향에 대해서 조사하였다. 도금층내 인의 함량은 8 wt.%로 고정하였고, 텅스텐의 함량은 각각 0, 3, 6 및 9 wt.%로 변화시켰으며, 모든 시료는 $255^{\circ}C$에서 리플로우한 후, $200^{\circ}C$에서 2주 동안 시효처리하였다. 각각의 시료에서 $(Cu,Ni)_6Sn_5$와 $(Ni,Cu)_3Sn_4$의 IMC가 관찰되었으며, 시효처리시간의 증가에 따라 UBM과 무연납의 계면에서 생성된 IMC가 증가함을 보였고, W의 함량이 높을수록 열적 안정성이 증가하여 $Ni(W)_3P$의 생성 속도를 늦춰 그에 따른 영향으로 IMC의 두께가 증가함을 보였다.

• 한국분말재료학회지
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• 제5권3호
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• pp.220-226
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• 1998

W-12.8wt%Cu-7.2%Pb powders were milled at room temperature and $-100^{\circ}C$ to investigate the mechanical alloying behavior of immiscible W-Cu-Pb system and the effect of milling temperature on the extent of alloying and microstructural refinement. W-Cu-Pb powder reached steady state after further extended milling due to Pb addition, compared to the W-Cu system. The cryomilling at $-100^{\circ}C$ caused the more refinement of powder particle size, and enhanced the solubility of Cu or Pb in W, compared with milling at room temperature. In W-12.8wt%Cu-7.2%Pb powder cryomilled at $-100^{\circ}C$, the monotectic temperature of Cu-Pb as well as the melting temperature of Cu was decreased by refinement of Cu crystalline size, and the most amorphization was occurred after milling for 150 h.

• 한국재료학회지
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• 제15권2호
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• pp.85-88
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• 2005

[ $W-15wt.\%$ ] Cu nanocomposite powders are fabricated by ball-milling and subsequent hydrogen-reduction. The compacted parts of $W-15wt.\%Cu$ nanocomposite powders were sintered at $1200^{\circ}C$ for 1 h with various heating rates of 5 and $20^{\circ}C/min$. The homogeneity of the sintered microstructures was evaluated through homogeneity index by the standard deviation of Victor's hardness test. The W-W contiguities were calculated by using Voronoi diagrams. The sintered microstructure with the heating rate of $20^{\circ}C/min$ was more homogeneous and had lower W-W contiguity than that of $5^{\circ}C/min$. The microstructural homogeneity was directly related to the W-W contiguity. Thermal conductivity of the sintered parts with the heating rate of $20^{\circ}C/min$ was higher than that with heating rate of $5^{\circ}C/min$. This phenomenon indicates that the thermal conductivity is affected by the W-W contiguity resulting from the homogeneity of the sintered microstructure.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2002년도 춘계학술강연 및 발표대회
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• pp.14-15
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• 2002