• Journal of the Semiconductor & Display Technology
• /
• v.19 no.3
• /
• pp.112-117
• /
• 2020

NAND flash memory is a non-volatile memory that retains stored data even without power supply. Internal memory used as a data storage device and solid-state drive (SSD) is used in portable devices such as smartphones and digital cameras. However, NAND flash memory carries the risk of electric shock, which can cause errors during read/write operations, so use error correction codes to ensure reliability. It efficiently recovers bad block information, which is a defect in NAND flash memory. BBT (Bad Block Table) is configured to manage data to increase stability, and as a result of experimenting with the error correction code algorithm, the bit error rate per page unit of 4Mbytes memory was on average 0ppm, and 100ppm without error correction code. Through the error correction code algorithm, data stability and reliability can be improved.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.11a
• /
• pp.7-8
• /
• 2008

The memory characteristics of charge trap flash (CTF) with $HfO_2$ charge trap layer were investigated. Especially, we focused on the effects of tunnel barrier engineering consisted of $SiO_2/Si_3N_4/SiO_2$ (ONO) stack or $Si_3N_4/SiO_2/Si_3N_4$ (NON) stack. The programming and erasing characteristics were significantly enhanced by using ONO or NON tunnel barrier. These improvement are due to the increase of tunneling current by using engineered tunnel barrier. As a result, the engineered tunnel barrier is a promising technique for non-volatile flash memory applications.

• Journal of Advanced Marine Engineering and Technology
• /
• v.29 no.6
• /
• pp.707-712
• /
• 2005

PRAM (Phase change random access memory) is one of the most promising candidates for next generation Non-volatile Memories. The Phase change materials have been researched in the field of optical data storage media. Among the phase change materials. $Ge_2Sb_2Te_5$ is very well known for its high optical contrast in the state of amorphous and crystalline. However the characteristics required in solid state memory are quite different from optical ones. In this study. the structural Properties of GeSbTe thin films with composition were investigated for PRAM. The 100-nm thick $Ge_2Sb_2Te_5$ and $Sb_2Te_3$ films were deposited on $SiO_2/Si$ substrates by RF sputtering system. In order to characterize the crystal structure and morphology of these films. x-ray diffraction (XRD). atomic force microscopy (AFM), differential scanning calorimetry (DSC) and 4-point measurement analysis were performed. XRD and DSC analysis result of GST thin films indicated that the crystallization of $Se_2Sb_2Te_5$ films start at about $180^{\circ}C$ and $Sb_2Te_3$ films Start at about $125^{\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.06a
• /
• pp.134-135
• /
• 2008

Ultra-thin $SiO_2/ZrO_2$ dielectrics were deposited by atomic layer chemical vapor deposition (ALCVD) method for non-volatile memory application. Metal-oxide-semiconductor (MOS) capacitors were fabricated by stacking ultra-thin $SiO_2$ and $ZrO_2$ dielectrics. It is found that the tunneling current through the stacked dielectric at the high voltage is lager than that through the conventional silicon oxide barrier. On the other hand, the tunneling leakage current at low voltages is suppressed. Therefore, the use of ultra-thin $SiO_2/ZrO_2$ dielectrics as a tunneling barrier is promising for the future high integrated non-volatile memory.

• Journal of Advanced Marine Engineering and Technology
• /
• v.31 no.4
• /
• pp.410-416
• /
• 2007

PRAM (Phase change random access memory) is one of the most promising candidates for next generation non-volatile memories. However, the high reset current is one major obstacle to develop a high density PRAM. One way of the reset current reduction is to change the heater electrode material. In this paper, to reduce the reset current for phase transition, we have investigated the effect of heater electrode material parameters using finite element analysis. From the simulation. the reset current of PRAM cell is reduced from 2.0 mA to 0.72 mA as the electrical conductivity of heater is decreased from $1.0{\times}10^6\;(1/{\Omega}{\cdot}m$) to $1.0{\times}10^4\;(1/{\Omega}{\cdot}m$). As the thermal conductivity of heater is decreased, the reset current is slightly reduced. But the reset current of PRAM cell is not changed as the specific heat of heater is changed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.30 no.8
• /
• pp.484-490
• /
• 2017

We investigated the rewritable operation of a non-volatile memory device composed of Al (top)/$TiO_2$/indium-zinc-oxide (IZO)/Al (bottom). The oxygen-deficient IZO layer of the device was spin-coated with 0.1 M indium nitrate hydrate and 0.1 M zinc acetate dehydrate as precursor solutions, and the $TiO_2$ layer was fabricated by atomic layer deposition. The oxygen vacancies IZO layer of an active component annealed at $400^{\circ}C$ using thermal annealing and it was proven to be in oxygen vacancies and oxygen binding environments with OH species and heavy metal ions investigated by X-ray photoelectron spectroscopy. The device, which operates at low voltages (less than 3.5 V), exhibits non-volatile memory behavior consistent with resistive-switching properties and an ON/OFF ratio of approximately $3.6{\times}10^3$ at 2.5 V.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 1998.08a
• /
• pp.39.1-39
• /
• 1998

• Journal of KIISE
• /
• v.42 no.1
• /
• pp.107-113
• /
• 2015

In a database system, updates on pages that are made by a transaction should be stored in a secondary storage before the commit is complete. Generic secondary storages have volatile DRAM caches to hide long latency for non-volatile media. However, as logs that are only written to the volatile DRAM cache don't ensure durability, logging latency cannot be hidden. Recently, a flash SSD with capacitor-backed DRAM cache was developed to overcome the shortcoming. Storage devices, like those with a non-volatile cache, will increase transaction throughput because transactions can commit as soon as the logs reach the cache. In this paper, we analyzed performance in terms of transaction throughput when the SSD with capacitor-backed DRAM cache was used as log storage. The transaction throughput can be improved over three times, by committing right after storing the logs to the DRAM cache, rather than to a secondary storage device. Also, we showed that it could acquire over 73% of the ideal logging performance with proper tuning.

• The Journal of the Institute of Internet, Broadcasting and Communication
• /
• v.19 no.6
• /
• pp.139-144
• /
• 2019

For recent decades, Non-volatile Memory (NVM) technologies have been drawing a high attention both in industry and academia due to its high density and short latency comparable to that of DRAM. However, NVM devices has write endurance problem and thus the current data structures that have been built around DRAM-specific features including unlimited program cycles is inadequate for NVM, reducing the device lifetime significantly. In this paper, we revisit a red-black tree extensively adopted for data indexing across a wide range of applications, and make it to better fit for NVM. Specifically, we observe that the conventional red-black tree wears out the specific location of memory because of its rebalancing operation to ensure fast access time over a whole dataset. However, this rebalancing operation frequently updates the long-lived nodes, which leads to the skewed wear out across the NVM cells. To resolve this problem, we present a new swapping wear-leveling red-black tree that periodically moves data in the worn-out node into the young node. The performance study with real-world traces demonstrates the proposed red-black tree reduces the standard deviation of the write count across nodes by up to 12.5%.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.13 no.6
• /
• pp.1123-1127
• /
• 2009

This paper expands the scope of application of the thin film transistor (TFT) in which it is used as the switching element by making the amorphous silicon TFT with the non-volatile memory device,. It is the thing about the amorphous silicon non-volatile memory device which is suitable to an enlargement and in which this uses the additionally cheap substrate according to the amorphous silicon use. As to, the amorphous silicon TFT non-volatile memory device is comprised of the glass substrates and the gate, which evaporates on the glass substrates and in which it patterns the first insulation layer, in which it charges the gate the floating gate which evaporates on the first insulation layer and in which it patterns and the second insulation layer in which it charges the floating gate, and the active layer, in which it evaporates the amorphous silicon on the second insulation layer the source / drain layer which evaporates the n+ amorphous silicon on the active layer and in which it patterns and the source / drain layer electrode in which it evaporates on the source / drain layer.