• Journal of the Korean Society for Railway
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• v.3 no.3
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• pp.117-124
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• 2000

The rubber wheel-type AGT has two major kinds of bogie; one is the bogie type and the other steering one. Both are important vehicular structure to support the whole running vehicle and passenger loads. This paper deals with the static analysis for the two types of bogie frame subjected to combined external forces, as well as independent ones specified in UIC 515-4. Furthermore, the dynamic analysis is performed under vibrational loading conditions so as to compare dynamic characteristics, Numerical results by using commercial packages, I-DEAS and NASTRAN show that maximum stresses do not exceed the yield strength level of material used for both bogies. From an overall viewpoint of strength, the bogie type turns out to be superior to the steering type except for the case of a lateral loading. It is also observed that the steering type shows a characteristics of low frequency behavior during a course of searching for structurally weak areas to be stiffened. The vibrational fatigue analysis for each bogie frame depends on the loading time history conditions which is applied. Time History Central Database List in the NASTRAN package. Subsequent1y, the fatigue life of bogie type is longer than the steering type.

• Structural Engineering and Mechanics
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• v.67 no.6
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• pp.643-658
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• 2018

In this paper, we introduce a new framework for running the finite element (FE) packages inside an online Loop together with MATLAB. Contrary to the Hardware-in-the-Loop techniques (HiL), in the proposed Software-in-the-Loop framework (SiL), the FE package represents a simulation platform replicating the real system which can be out of access due to several strategic reasons, e.g., costs and accessibility. Practically, SiL for sophisticated structural design and multi-physical simulations provides a platform for preliminary tests before prototyping and mass production. This feature may reduce the new product's costs significantly and may add several flexibilities in implementing different instruments with the goal of shortlisting the most cost-effective ones before moving to real-time experiments for the civil and mechanical systems. The proposed SiL interconnection is not limited to ABAQUS as long as the host FE package is capable of executing user-defined commands in FORTRAN language. The focal point of this research is on using the compiled FORTRAN subroutine as a messenger between ABAQUS/CAE kernel and MATLAB Engine. In order to show the generality of the proposed scheme, the limitations of the available SiL schemes in the literature are addressed in this paper. Additionally, all technical details for establishing the connection between FEM and MATLAB are provided for the interested reader. Finally, two numerical sub-problems are defined for offline and online post-processing, i.e., offline optimization and closed-loop system performance analysis in control theory.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.63-72
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• 2006

Mobile products, such as cellular phones, PDA and notebook, are subjected to many different mechanical loads, which include bending, twisting, impact shock and vibration. In this study, a cyclic bending test of the BGA package was performed to evaluate the fatigue life. Special bending tester, which was suitable for electronic package, was developed using an electromagnetic actuator. A nonlinear finite element model was used to simulate the mechanical bending deformation of solder joint in BGA packages. The fatigue life of lead-free (95.5Sn4.0Ag0.5Cu) solder joints was compared with that of lead-contained (63Sn37Pb). When the applied load to the specimen is small, the lead-free solder has longer fatigue life than lead-contained solder. The fatigue crack is initialized at the exterior solder joints and is propagated into the inner solder joints.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.24 no.3
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• pp.171-179
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• 2014

Sunroof buffeting is one of the most critical issues in the vehicle wind noise phenomena. The experimental approach to solve this issue typically requires a lot of time and resources. To reduce time and cost, the numerical approach could be taken, which can also privide more insights into physical phenomena involved in sunroof buffeting, only if the accuracy in its predictions are guranteed. The benchmark test of various numerical solvers is carried out for the buffeting behavior of a simplified vehicle body, the Hyundai simplified model(HSM). The results of each solver are compared to the experimental measurements in a Hyundai aeroacoustic wind tunnel(HAWT) at various wind speeds. In particular, acoustic response tests were performed and the results were provided prior to all simulations in order to consider the real world effects that could introduce discrepancies between the numerical and experimental approaches. Through this study, most solvers can demonstrate an acceptable accuracy level for actual commercial development and high precision experimental data and computational prediction priories can be shared in order to promote the numerical accuracy level of each numerical solver.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.55-65
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• 2020

The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.