• Title/Summary/Keyword: Via-Filling

Search Result 149, Processing Time 0.025 seconds

Seed layer deposition using sputtering for high aspect ratio via (고종횡비 비아상의 스퍼터링을 이용한 씨드층 형성)

  • Song, Yeong-Sik;Im, Tae-Hong;Lee, Jae-Ho;Kim, Jong-Ryeol
    • Proceedings of the Korean Institute of Surface Engineering Conference
    • /
    • 2013.05a
    • /
    • pp.68-69
    • /
    • 2013
  • 금속 씨드 층(seed layer)을 직경 $10{\mu}m$, 깊이 $100{\mu}m$, 고종횡비 10:1 비아에 스퍼터링하였다. 금속 씨드 층의 두께는 스퍼터링 시간, 압력, 및 타겟파워를 변화하여 조절하였다. 금속 씨드층 스퍼터링 후 전기도금에 의해 구리 충전을 시도하였다. 비아의 고종횡비가 증가하면 비아 폭이 좁아져 비아의 하부층과 하단 측면 두께는 비아 상부 측면 두께만큼 충분하지 않아 문제가 될 수 있다. 스퍼터링 조건을 최적화 함으로써 씨드층의 특성을 높이고, 비아 홀 지름의 감소 속도를 줄일 수 있었다. 종래의 스퍼터링 방식을 이용하여 비아 입구의 opening percentage를 약 64%로 하고, 하부 씨드층 두께가 46.7 nm 인 금속 씨드층을 형성할 수 있었다. 이 씨드층 상에 전기도금으로 Cu filling을 성공적으로 할 수 있었다.

  • PDF

Determining Canopy Growth Conditions of Paddy Rice via Ground-based Remote Sensing

  • Jo, Seunghyun;Yeom, Jongmin;Ko, Jonghan
    • Korean Journal of Remote Sensing
    • /
    • v.31 no.1
    • /
    • pp.11-20
    • /
    • 2015
  • This study aimed to investigate the canopy growth conditions and the accuracy of phenological stages of paddy rice using ground-based remote sensing data. Plant growth variables including Leaf Area Index (LAI) and canopy reflectance of paddy rice were measured at the experimental fields of Chonnam National University, Gwangju, Republic of Korea during the crop seasons of 2011, 2012, and 2013. LAI values were also determined based on correlations with Vegetation Indices (VIs) obtained from the canopy reflectance. Three phenological stages (tillering, booting, and grain filling) of paddy rice could be identified using VIs and a spatial index (NIR versus red). We found that exponential relationships could be applied between LAI and the VIs of interest. This information, as well as the relationships between LAI and VIs obtained in the present study, could be used to estimate and monitor the relative growth and development of rice canopies during the growing season.

TSV(Through-Silicon-Via) copper filling by Electrochemical deposition with additives (도금 첨가제에 의한 구리의 TSV(실리콘 관통 비아) 필링)

  • Jin, Sang-Hyeon;Jang, Eun-Yong;Park, Chan-Ung;Yu, Bong-Yeong
    • Proceedings of the Korean Institute of Surface Engineering Conference
    • /
    • 2011.05a
    • /
    • pp.175-177
    • /
    • 2011
  • 오늘날 반도체 소자의 성능을 좌우하는 배선폭은 수십 나노미터급으로 배선폭 감소에 의한 소자의 집적은 한계에 다다르고 있다. 또한 2차원 회로 소자의 문제점으로 지적되는 과도한 전력소모, RC Delay, 열 발생 문제등도 쟁점사항이 되고 있다. 이런 2차원 회로를 3차원으로 쌓아올린다면 보다 효율적인 회로구성이 가능할 것이고 이에 따른 성능향상이 클 것이다. 3차원 회로 구성의 핵심기술은 기판을 관통하여 다른 층의 회로를 연결하는 실리콘 관통 전극을 형성하는 것이다.

  • PDF

INVARIANTS OF DEFORMATIONS OF QUOTIENT SURFACE SINGULARITIES

  • Han, Byoungcheon;Jeon, Jaekwan;Shin, Dongsoo
    • Journal of the Korean Mathematical Society
    • /
    • v.56 no.5
    • /
    • pp.1173-1246
    • /
    • 2019
  • We find all P-resolutions of quotient surface singularities (especially, tetrahedral, octahedral, and icosahedral singularities) together with their dual graphs, which reproduces (a corrected version of) Jan Steven's list [Manuscripta Math. 1993] of the numbers of P-resolutions of each singularities. We then compute the dimensions and Milnor numbers of the corresponding irreducible components of the reduced base spaces of versal deformations of each singularities. Furthermore we realize Milnor fibers as complements of certain divisors (depending only on the singularities) in rational surfaces via the semi-stable minimal model program for 3-folds. Then we compare Milnor fibers with minimal symplectic fillings, where the latter are classified by Bhupal and Ono [Nagoya Math. J. 2012]. As an application, we show that there are 6 pairs of entries in the list of Bhupal and Ono [Nagoya Math. J. 2012] such that two entries in each pairs represent diffeomorphic minimal symplectic fillings.

Interconnection Processes Using Cu Vias for MEMS Sensor Packages (Cu 비아를 이용한 MEMS 센서의 스택 패키지용 Interconnection 공정)

  • Park, S.H.;Oh, T.S.;Eum, Y.S.;Moon, J.T.
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.14 no.4
    • /
    • pp.63-69
    • /
    • 2007
  • We investigated interconnection processes using Cu vias for MEMS sensor packages. Ag paste layer was formed on a glass substrate and used as a seed layer for electrodeposition of Cu vias after bonding a Si substrate with through-via holes. With applying electrodeposition current densities of $20mA/cm^2\;and\;30mA/cm^2$ at direct current mode to the Ag paste seed-layer, Cu vias of $200{\mu}m$ diameter and $350{\mu}m$ depth were formed successfully without electrodeposition defects. Interconnection processes for MEMS sensor packages could be accomplished with Ti/Cu/Ti line formation, Au pad electrodeposition, Sn solder electrodeposition and reflow process on the Si substrate where Cu vias were formed by Cu electrodeposition into through-via holes.

  • PDF

Data Stream Allocation for Fair Performance in Multiuser MIMO Systems (다중 사용자 MIMO 환경에서 균등한 성능을 보장하는 데이터 스트림 할당 기법)

  • Lim, Dong-Ho;Choi, Kwon-Hue
    • The Journal of Korean Institute of Communications and Information Sciences
    • /
    • v.34 no.12A
    • /
    • pp.1006-1013
    • /
    • 2009
  • This paper proposes a data stream allocation technique for fair capacity performance in multiuser multiple-input multiple-output (MIMO) systems using block diagonalization (BD) algorithm. Conventional studies have been focused on maximum sum capacity. Thus, there is a very large difference of capacity among users, since user capacity unfairly distributed according to each user channel environment. In additional, poor channel user has very small capacity, since base station allocates the power by using water-filling technique. Also, almost studies limited itself to obtain the additional gain by using the same number of data streams for all users. In this paper, we propose the technique for maximizing sum capacity under the fair performance constraint by allocating data stream according to user channel environment. Also, proposed algorithm has more gain of sum capacity and transmit power than conventional equal allocation via computer simulation.

ULTRASTRUCTURAL STUDY ON THE EFFECTS OF RETROGRADE INFUSION OF WATER-SOLUBLE CONTRAST MEDIA ON THE RABBIT SUBMANDIBULAR GLAND (수용성조영제의 주입이 가토악하선조직에 미치는 영향에 관한 전자현미경적 연구)

  • Kim Eun-Kyung;Park Tae-Won
    • Journal of Korean Academy of Oral and Maxillofacial Radiology
    • /
    • v.17 no.1
    • /
    • pp.123-135
    • /
    • 1987
  • The author observed the effects of retrograde infusion of water soluble contrast media (Tele- brix 30) on the rabbit submandibular glands and compared the effects of different degrees of filling. 26 rabbits were divided into 2 groups of 12 each as experimentals and I group of 2 as normal controls. One experimental group was filled with 0.2㎖ and the other with 0.4㎖. Right submandibular gland of each rabbit was infused with contrast media and left one with physiologic saline as a experimental control, at a constant rate of 0.12㎖/min. using an infusion pump via the main excretory duct. Immediately after the infusion of contrast media, oblique lateral radiographs of the glands were made with occlusal film in order to confirm the glandular filling. The rabbits were sacrificed after varying periods (1, 8, 24 hours and 3, 6, 10 days) and the tissues were prepared for light and electron microscopic examination. The results were as follows: 1. In glands filled with 0.2㎖ contrast media, the initial changes were a few vacuole formation in the acini and slight dilation of the intralobular duct. The moderately severe changes such as vacuole formation in the acini, the abnormal substructure within the secretory granule, dilation of acinar and intercalated duct lumen, scalloping of striated duct lumen and inflammatory cell infiltrate were observed at 3 days. The general appearance was successively recovered, so the tissue had a normal appearance at 10 days. 2. In glands filled with 0.4㎖ contrast media, the most prominent alterations such as severe acinar atrophy, decreased number of secretory granules, proliferation of connective tissue stroma and pronounced inflammatory cell infiltrates appeared at 6 days. Although the general appearance returned to be almost normal at 10 days, acinar cells showed some atrophy and decreased secretory granules. 3. In glands subjected to 0.4㎖ infusion, the alterations were more severe and the recovery was slower than those seen in the glands to 0.2㎖ infusion.

  • PDF

Design and Development of the Simulated Die casting Process by using Rapid Prototyping (쾌속조형을 이용한 다이 캐스팅 제품의 시작 공정 설계 및 제작)

  • Kim, Ki-Don;Yang, Dong-Yol;Jeong, Jun-Ho;Park, Tae-Kwon
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.18 no.7
    • /
    • pp.167-173
    • /
    • 2001
  • The simulated die-casting process in which the traditional plaster casting process is combined with Rapid Prototyping technology is being used to produce AI, Mg, and Zn die-casting prototypes. Unlike in the die-casting process, molten metal in the conventional plaster casting process is fed via a gravity pour into a mold and the mold does not cool as quickly as a die-casting mold. The plaster castings have much larger and grosser grain structure as compared with the normal die-castings and the thin walls of the plaster mold cavity may not be completely filled. Because of lower mechanical properties induced by the large grain structure and incomplete filling, the conventional plaster casting process is not suitable for the trial die-casting process to obtain quality prototypes. In this work, an enhanced trial die-casting process has been developed in which molten metal in the plaster mold cavity is vibrated and pressurized simultaneously. Patterns for the casting are made by Rapid Prototyping technologies and then plaster molds, which have a runner system, are made using these patterns. Pressurized vibration to imparted molten metal has made grain structure of castings much finer and improved fluidity of the molten enough to obtain complete filling at thin walls which may not be filled in the conventional plaster casting process..

  • PDF

Preparation and Characterization of Sulfonated Poly(Arylene Ether Sulfone) Random Copolymer Reinforced Membranes for Fuel Cells (연료전지용 술폰화 폴리아릴렌에테르술폰 랜덤공중합체 강화복합막의 제조 및 특성)

  • Ahn, Juhee;Lee, Chang Hyun
    • Membrane Journal
    • /
    • v.26 no.2
    • /
    • pp.146-151
    • /
    • 2016
  • Sulfonated poly (arylene ether sulfone) (SPAES) random copolymers have merits such as high proton conductivity, relatively low production cost, and thermochemical resistance when applied as polymer electrolyte membranes for fuel cells. However, it is difficult to directly employ SPAES copolymers into practical fuel cell membrane applications owing to their low chemical stability and dimensional instability under harsh operation conditions. A plausible solution is to impregnate SPAES copolymers into support films (e.g., electrospun polyimide support) with interconnected pore structures and high thermochemical toughness. In this study, a SPAES copolymer with a swivel group, which induces high free volume for fast ion transport, is chosen as ionomers to prepare pore-filling membranes (PFMs). The feasibility of the resulting membranes is evaluated via membrane characterizations.

Experimental & Numerical Result of the filling of Micro Structures in Injection Molding (미세 구조물의 충전에 관한 실험 및 수치해석)

  • Lee J.G.;Lee B.K;Kwon T.H.
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 2005.10a
    • /
    • pp.111-114
    • /
    • 2005
  • Experimental and numerical studies were carried out in order to investigate the processability and the transcriptability of the injection molding of micro structures. For this purpose, we designed a mold insert having micro rib patterns on a relatively thick base part. Mold insert has a base of 2mm thickness, and has nine micro ribs on that base plate. Width and height of the rib are $300{\mu}m\;and\;1200{\mu}m$, respectively. We found a phenomenon similar to 'race tracking', due to 'hesitation' in the micro ribs. As the melt flows, it starts to cool down and melt front located in the ribs near the gate cannot penetrate further because the flow resistance is large in that almost frozen portion. When the base is totally filled, the melt front away from the gate is not frozen yet. Therefore, it flows back to the gate direction through the ribs. Consequently, transcriptability of the rib far from the gate is better. We also verified this phenomenon via numerical simulation. We further investigated the effects of processing conditions, such as flow rate, packing time, packing pressure, wall temperature and melt temperature, on the transcriptability. The most dominant factor that affects the flow pattern and the transcriptability of the micro rib is flow rate. High flow rate and high melt temperature enhance the transcriptability of micro rib structure. High packing time and high packing pressure result in insignificant dimensional variations of the rib. Numerical simulation also confirms that low flow rate causes a short shot of micro ribs and high wall temperature helps the filling of the micro ribs.

  • PDF