• 반도체디스플레이기술학회지
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• 제2권3호
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• pp.7-11
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• 2003

In this research, the etching characteristics of via contact and deep contact hole have been studied using multi-pole inductively coupled plasma(MICP) etching system. We investigated Plasma density of MICP source using the Langmuir probe and etching characteristics with RF frequency, wall temperature, chamber gap, and gas chemistry containing Carbon and Fluorine. As the etching time increases, formation of the polymer increases. To improve the polymer formation, we controlled the temperature of the reacting chamber, and we found that temperature of the chamber was very effective to decrease the polymer thickness. The deep contact etch profile and high selectivity(oxide to photoresist) have been achieved with the optimum mixed gas ratio containing C and F and the temperature control of the etching chamber.

• 한국전기전자재료학회논문지
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• 제15권1호
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• pp.7-14
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• 2002

In this paper, neutral networks are used to build models of oxide film etched In CHF$_3$/CF$_4$ with a magnetically enhanced reactive ion etcher(MERIE). A statistical 2$\^$4-1/ experimental design plus one center point was used to characterize relationships between process factors and etch responses. The factors that were varied include radio frequence(rf) power, pressure, CHF$_3$ and CF$_4$ flow rates. Resultant 9 experiments were used to train neural networks and trained networks were subsequently tested on its appropriateness using additionally conducted 8 experiments. A total of 17 experiments were thus conducted for this modeling. The etch responses modeled are dc bias voltage, etch rate and etch uniformity A qualitative, good agreement was obtained between predicted and observed behaviors.

• 대한금속재료학회지
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• 제49권11호
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• pp.905-909
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• 2011

The formation of front metal contact silicon solar cells is required for low cost, low contact resistance to silicon surfaces. One of the available front metal contacts is Ni/Cu plating, which can be mass produced via asimple and inexpensive process. A selective emitter, meanwhile, involves two different doping levels, with higher doping (${\leq}30{\Omega}/sq$) underneath the grid to achieve good ohmic contact and low doping between the grid in order to minimize the heavy doping effect in the emitter. This study describes the formation of a selective emitter and a nickel silicide seed layer for the front metallization of silicon cells. The contacts were thickened by a plated Ni/Cu two-step metallization process on front contacts. The experimental results showed that the Ni layer via SEM (Scanning Electron Microscopy) and EDX (Energy dispersive X-ray spectroscopy) analyses. Finally, a plated Ni/Cu contact solar cell displayed efficiency of 18.10% on a $2{\times}2cm^2$, Cz wafer.

• ETRI Journal
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• 제35권4호
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• pp.571-577
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• 2013

The fabrication of a thin-film transistor backplane and a liquid-crystal display using printing processes can eliminate the need for photolithography and offers the potential to reduce the manufacturing costs. In this study, we prepare contact via structures through a poly(methyl methacrylate) polymer insulator layer using inkjet printing. When droplets of silver ink composed of a polymer solvent are placed onto the polymer insulator and annealed at high temperatures, the silver ink penetrates the interior of the polymer and generates conducting paths between the top and bottom metal lines through the partial dissolution and swelling of the polymer. The electrical property of various contact via-hole interconnections is investigated using a semiconductor characterization system.

• 마이크로전자및패키징학회지
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• 제12권2호
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• pp.111-119
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• 2005

직경 $75{\mu}m$ 높이 $90{\mu}m$및 $150{\mu}m$ 피치의 Cu via를 통한 삼차원 배선구조를 갖는 스택 시편을 deep RIE를 이용한 via hole 형성공정 , 펄스-역펄스 전기도금법에 의한 Cu via filling 공정, CMP를 이용한 Si thinning 공정, photholithography, 금속박막 스퍼터링, 전기도금법에 의한 Cu/Sn 범프 형성공정 및 플립칩 공정을 이용하여 제작하였다. Cu via를 갖는 daisy chain 시편에서 측정한 접속범프 개수에 따른 daisy chain의 저항 그래프의 기울기로부터 Cu/Sn 범프 접속저항과 Cu via 저항을 구하는 것이 가능하였다. $270^{\circ}C$에서 2분간 유지하여 플립칩 본딩시 $100{\times}100{\mu}m$크기의 Cu/Sn 범프 접속저항은 6.7 m$\Omega$이었으며, 직경 $75 {\mu}m$, 높이 $90{\mu}m$인 Cu via의 저항은 2.3m$\Omega$이었다.

• 대한전자공학회논문지SD
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• 제39권10호
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• pp.25-34
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• 2002

본 논문에서는 코발트 실리사이드가 형성된 얕은 p+-n과 n+-p 접합의 전류-전압 특성을 분석하여 silicidation에 의해 형성된 Schottky contact 면적을 구하였다. 역방향 바이어스 영역에서는 Poole-Frenkel barrier lowering 효과가 지배적으로 나타나서 Schottky contact 효과를 파악하기가 어려웠다. 그러나 Schottky contact의 형성은 순방향 바이어스 영역에서 n+-p 접합의 전류-전압 (I-V) 동작에 영향을 미치는 것으로 확인되었다. 실리사이드가 형성된 n+-p 다이오드의 누설전류 증가는 실리사이드가 형성될 때 p-substrate또는 depletion area로 코발트가 침투퇴어 Schottky contact을 형성하거나 trap들을 발생시켰기 때문이다. 분석결과 perimeter intensive diode인 경우에는 silicide가 junction area까지 침투하였으며, area intensive junction인 경우에는 silicide가 비록 공핍층이나 p-substrate까지 침투하지는 않았더라도 공핍층 근처까지 침투하여 trap들을 발생시켜 누설전류를 증가시킴을 확인하였다. 반면 p+-n 다이오드의 경우 Schottky contact이발생하지 않았고 따라서 누설전류도 증가하지 않았다. n+-p 다이오드에서 실리사이드에 의해 형성된 Schottky contact 면적은 순방향 바이어스와 역방향 바이어스의 전류 전압특성을 동시에 제시하여 유도할 수 있었고 전체 접합면적의 0.01%보다 작게 분석되었다.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 1991년도 제13회 학술강연회초록집
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• pp.1-30
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• 1991

The lubrication state between contacting bodies with rolling and sliding under loaded condition is generally understood by the conception shown in Figure 1. When the lubricating oil film formation between facing bodies is good enough to separate these bodies by the hydrodynamic pressure, this state is called by the expression of "hydrodynamic lubrication". The thickness of oil film is so large that the lubricating oil between facing bodies behaves as fluid and metal-to-metal contact between surface roughness asperities on facing bodies does not occur. When the oil film thickness becomes thinner or when the surface roughness height becomes larger, top of surface roughness asperities on facing bodies reaches very near to each other and there the oil or absorbed oil molecules on the surface of facing bodies behave no more as fluid. Partly metal-to-metal contact of surface roughness asperities occurs. Such lubrication state is called by the expression "mixed-lubrication". When the oil film thickness becomes more thinner or surface roughness height becomes larger, metal-tometal contact or contact via absorbed oil molecules dominate at most of the part in contact zone. Such state is called by the expression "boundary lubrication". Schematic representation of these three regimes of lubrication is shown in Figure 1.rication is shown in Figure 1.

• Asia pacific journal of information systems
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• 제11권4호
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• pp.27-41
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• 2001

CRM is at the core of any customer-focused business strategy and includes the people, processes, and technology questions associated with marketing, sales, and service. In today's hyper-competitive world, organizations looking to implement successful CRM strategies need to focus on a common view of the customer using integrated information systems and contact center implementations that allow the customer to communicate via any desired communication channel. A CRM solution contains a number of sophisticated tools that enable to extract detailed information about customers. This information can be used to gain a better understanding of customers. From this we can determine trends, and so refine business toward customers' needs and target new products to particular customer groups. This paper presents an approach for forming the product-customer groups using neural networks for customer relationship management. The Carpenter-Grossberg's neural network, which has been used for manufacturing cell formation in group technology, is modified and applied for product-customer group formation. As a result of numerical experiments, it is also useful for more complex problems in which customers have different preferences for each product.

• Bulletin of the Korean Chemical Society
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• 제34권12호
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• pp.3805-3810
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• 2013

The surface modification of silica particles (SPs) was systemically conducted by the treatment of 0.1-10 wt % phenylsilanetriol (PST) on the basis of SPs used through two step processes: 1) the PST coating of SPs via evaporation under reduced pressure and 2) their thermal condensation leading to Si-O-Si bond formation via heating at $130^{\circ}C$. The evaluation of the modified SPs was conducted by the simple floating test on water and the measurement of the contact angle (CA) of water droplet on the 2-dimensional layer of modified SPs on slide glass. When PST was used about 2 wt % or above on the basis of SPs (about average size: 50 nm) used, the modified SPs were fully floated on the water and all dispersed into upper organic solvent layer after a shaking with the mixture of the water and benzene, indicating that the modified SPs have hydrophobic properties. The modified SPs were characterized by $^{29}Si$ MAS NMR and physicochemical properties including SEM, TEM, BET, adsorption/desorption isotherms, etc. were measured and compared each other in details. This research demonstrates that the organosilanetriol is a good modifier applicable for the surface modification of inorganic oxide particles using a low amount of modifier on the basis of oxide particles used.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.165-165
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• 2009

현재 반도체나 이동통신 분야는 사용자의 요구에 따라 PCB의 회로선폭이 갈수록 좁아지고 있다. 이러한 정밀 부품을 제조하기 위한 제조공정에서 각광받기 시작한 기술 중 하나가 대기압 플라즈마 기술이다. 본 연구에서는 미세패턴 형성이 가능한 에폭시 본딩 필름위에 무전해 도금공정을 통한 패턴 도금법을 이용하여 패턴을 형성하였고, 형성된 패턴에 대기압 플라즈마 처리 횟수에 따른 접촉각(Contact Angle)과 Peel Strength의 변화를 분석하였다. 또한 에폭시 본딩 필름을 이용한 Build-up공정을 거쳐 Micro Via를 형성하여 대기압 플라즈마 처리 횟수에 따른 Via 표면을 분석하였다. 대기압 플라즈마 기술은 진공식에 비해 소규모 장비를 이용한 전처리가 가능하고, 초기 설비비용을 절감하는데 탁월한 효과가 있어 널리 사용하는 기술 중 하나이다. 이 연구를 통하여 대기압 플라즈마 처리 횟수에 따른 표면에너지의 변화로 인한 접촉각이 좋아지는 것을 알 수 있으며, 대기압 플라즈마 처리를 한 패턴표면이 친수성으로 변하면서 현상된 드라이 필름 사이로 도금액이 원활히 공급되어서 미세패턴 모양이 우수하게 구현되었음을 알 수 있었다. 또한 Via Filling에도 뛰어난 효과가 있었음을 확인할 수 있었다.