• 제목/요약/키워드: Velocity uniformity

검색결과 204건 처리시간 0.026초

KSR-III 매니폴드의 추진제 분사균일성 해석

  • 조원국
    • 항공우주기술
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    • 제1권2호
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    • pp.113-122
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    • 2002
  • 3단형 과학로켓의 주엔진 추진제의 분사균일성에 대하여 수치해석을 수행하고 설계 개선안을 도출하였다. 분사기 유로는 동일한 압력강하를 가지는 다공성 매질로 처리하였다. 산화제와 연료 모두 공급 유로의 반대쪽에서 분사속도가 높은 것으로 예측되었으며 이는 유동정체에 따른 정압 상승에 기인한다. 산화제 매니폴드 내부의 수직분리판에 유로를 구성함으로써 매니폴드 중심과 외곽에서의 분사균일성을 향상시킬 수 있었다. 산화제 공급유로가 경사를 가지더라도 분사균일성과 압력손실에 미치는 영향은 거의 없었다. 또한 산화제/ 연료에 대한 분사속도로부터 혼합비의 분포를 예측하였다.

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디퓨저 타입 레큐퍼레이터 헤더에서 유동분배에 미치는 베인의 영향 (Effect of Vanes on Flow Distribution in a Diffuser Type Recuperator Header)

  • 정영준;김서영;김광호;곽재수;강병하
    • 설비공학논문집
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    • 제18권10호
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    • pp.819-825
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    • 2006
  • In a SOFC/GT (solid oxide fuel cell/gas turbine) hybrid power generation system, the recuperator is an indispensible component to enhance system performance. Since the expansion ratio to the recuperator core is very large, generally, the effective header design to distribute the flow uniformly before entering the core is crucial to guarantee the required performance. In the present study, we focus on the design of a diffuser type recuperator header with a 90 degree turn inlet port. To reduce the flow separation and recirculation flows, multiple horizontal vanes are used. The number of horizontal vanes is varied from 0 to 24. The air flow velocity is measured at 40 points just behind the core outlet by using a hot wire anemometer. Then, the flow non-uniformity is evaluated from the measured flow velocity. The experimental results showed that inlet air velocity did not effect on relative flow non-uniformity. According to increasing the number of horizontal vanes, flow non-uniformity reduced about $40{\sim}50%$ than without using horizontal vanes.

왕복패들이 패턴화된 음극의 전착균일성에 미치는 영향 (Effect of a Reciprocating Paddle on the Electrodeposit Uniformity of Patterned Cathodes)

  • 오영주;정순효
    • 한국재료학회지
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    • 제14권3호
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    • pp.196-202
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    • 2004
  • A numerical simulation based on the finite element method is used to investigate the effect of a reciprocal paddle on the uniformity of deposition rates at a patterned electrode. The calculated deposition rates agreed well with the measured values. The influences of the paddle velocity, the gap between cathodes and paddles, anode size and the distance between the anode and cathode have been studied. The optimum conditions on the paddle and geometric factors for electrodeposit uniformity could be obtained.

전기집진기 (ESP) 덕트 내부 유동 균일화를 위한 연구 (Optimization of Flow Uniformity in an Electrostatic Precipitator (ESP) Duct)

  • 홍준형;황민승;한종호;최웅철;성정모;황원태
    • 한국가시화정보학회지
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    • 제20권3호
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    • pp.86-93
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    • 2022
  • An electrostatic precipitator (ESP) is an industrial post processing facility for high efficiency dust mitigation. Uniformity of the flow passing through the inlet duct leading into the main chamber is important for efficient reduction of dust. To examine flow uniformity, this study conducted a numerical analysis of the flow within a scale-down ESP inlet duct. Magnetic resonance velocimetry (MRV) results from a prior study were utilized to validate the Reynolds-averaged Navier-Stokes (RANS) numerical simulations. Both the experimental and computational results displayed a similar recirculation zone shape and normalized velocity profile near the duct outlet for the baseline geometry. To optimize the uniformity of the flow, the number of guide vanes was modified, and the guide vanes were partially extended straight upward. Design evaluation is done based on the outlet velocity distribution and mass flowrate balance between the two outlets. Simulation results indicate that the vane extension is critical for flow optimization in curved ESP ducts.

PIV를 이용한 Chemical Mechanical Polishing 공정 중의 연마용액 유동흐름 측정 (Visualization of the Slurry Flow-Field during Chemical Mechanical Polishing by PIV)

  • 신상희;김문기;윤영빈;고영호
    • 한국가시화정보학회:학술대회논문집
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    • 한국가시화정보학회 2004년도 추계학술대회 논문집
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    • pp.48-51
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    • 2004
  • Chemical Mechanical Polishing(CMP) is popularly used in production of semiconductor because of large area polishing ability probability of improvement for more integrated circuit. However, present CMP processing causes some non-uniformity errors which can be critical for highly integrated circuit. Previous studies predict that flow-field of slurry during CMP can create non-uniformity, but no quantitative measurement has conducted. In this study, using PIV, slurry velocity flow-field during CMP is measured by changing the ratio of RPM of pad and carrier with tuned PIV system adequate for small room in CMP machine and Cabot's non-groove pad Epad-A100. The result show that velocity of slurry is majorly determined by pad-rpm and the ratio of between carrier and pad rpm make some changes in streamlines.

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산화막 CMP에서 발생하는 온도가 연마특성에 미치는 영향 (Effect of Temperature on Polishing Properties in Oxide CMP)

  • 김영진;박범영;김형재;정해도
    • 한국전기전자재료학회논문지
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    • 제21권2호
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    • pp.93-98
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    • 2008
  • We investigated the effect of process temperature on removal rate and non-uniformity based on single head kinematics in oxide CMP. Generally, it has been known that the temperature profile directly transfers to the non~uniformity of removal rate on the wafer, which has similar tendency with the sliding distance of wafer. Experimental results show that platen velocity is a dominant factor in removal rate as well as average temperature. However, the non-uniformity does not coincide between process temperature and removal rate, due to slurry accumulation and low deviation of temperature. Resultantly, the removal rate is strongly dependent on the rotational speed of platen, and its non -uniformity is controlled by the rotational speed of polishing head. It means lower WIWNU (With-in-wafer-non-uniformity) can be achieved in the region of higher head speed.

슬릿 노즐 내부 압력 분포와 코팅 박막 두께 균일도 간의 상관관계 연구 (Study on Correlation Between the Internal Pressure Distribution of Slit Nozzle and Thickness Uniformity of Slit-coated Thin Films)

  • 김기은;나정필;정모세;박종운
    • 반도체디스플레이기술학회지
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    • 제22권4호
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    • pp.19-25
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    • 2023
  • With an attempt to investigate the correlation between the internal pressure distribution of slit nozzle and the thickness uniformity of slot-coated thin films, we have performed computational fluid dynamics (CFD) simulations of slit nozzles and slot coating of high-viscosity (4,800 cPs) polydimethylsiloxane (PDMS) using a gantry slot-die coater. We have calculated the coefficient of variation (CV) to quantify the pressure and velocity distributions inside the slit nozzle and the thickness non-uniformity of slot-coated PDMS films. The pressure distribution inside the cavity and the velocity distribution at the outlet are analyzed by varying the shim thickness and flow rate. We have shown that the cavity pressure uniformity and film thickness uniformity are enhanced by reducing the shim thickness. It is addressed that the CV value of the cavity pressure that can ensure the thickness non-uniformity of less than 5% is equal to and less than 1%, which is achievable with the shim thickness of 150 ㎛. It is also found that as the flow rate increases, the average cavity pressure is increased with the CV value of the pressure unchanged and the maximum coating speed is increased. As the shim thickness is reduced, however, the maximum coating speed and flow rate decrease. The highly uniform PDMS films shows the tensile strain as high as 180%, which can be used as a stretchable substrate.

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Particle Image Velocimetry 기법을 이용한 CMP 공정의 Slurry유동 분석 (Velocity Measurements of Slurry Flows in CMP Process by Particle Image Velocimetry)

  • 김문기;윤영빈;고영호;홍창기;신상희
    • 한국정밀공학회지
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    • 제23권5호
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    • pp.59-67
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    • 2006
  • Chemical Mechanical Polishing(CMP) in semiconductor production is characterized its output property by Removal Rate(RR) and Non-Uniformity(NU). Some previous works show that RR is determined by production of pressure and velocity and NU is also largely affected by velocity of flowfield during CMP. This study is about the direct measurement of velocity of slurry during CMP and whole flowfield upon the non-groove pad by Particle Image Velocimetry(PIV). Typical PIV system is modified adequately for inspecting CMP and slurry flowfield is measured by changing both pad rpm and carrier rpm. We performed measurement with giving some variation in the kinds of pad. The results show that the flowfield is majorly determined not by Carrier but by Pad in the case of non-groove pad.

A curtain traveling pluviator to reconstitute large scale sand specimens

  • Kazemi, Majid;Bolouri, Jafar B.
    • Geomechanics and Engineering
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    • 제14권2호
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    • pp.131-139
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    • 2018
  • The preparation of repeatable and uniformly reconstituted soil specimens up to the specified conditions is an essential requirement for the laboratory tests. In this study for large samples replication, the simultaneous usage of the traveling pluviation and curtain raining technique is used to develop a new method, called the curtain travelling pluviator (CTP). This simple and cost effective system is based on the air pluviation approach, whilst reducing the sample production time, can reproduce uniform samples with relative densities ranging from 25% to 96%. In order to investigate the resulting suitability and uniformity from the proposed method, a series of tests is performed. The effect of curtain traveling velocity, curtain width, drop height, and flow rate on the parameters of the sample is thoroughly investigated. Increase in the curtain velocity and drop height leads to the increase in relative density for the sand specimen. Increase in curtain width typically resulted in the reduction of relative density. Test results reveal that the terminal drop height for the sand specimen in this study is more than 500 mm. Relative density contour lines are presented that can be utilized in optimizing the drop height and curtain width parameters. Sample uniformity in the vertical and horizontal orientation is investigated through the sampling containers. Increasing relative density tends to result in the higher sample repeatability and uniformity.

균일한 에피층 성장을 위한 입구 유속분포 최적화 (Optimization of inlet velocity profile for uniform epitaxial growth)

  • 조원국;최도형;김문언
    • 한국전산유체공학회:학술대회논문집
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    • 한국전산유체공학회 1998년도 추계 학술대회논문집
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    • pp.121-126
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    • 1998
  • A numerical optimization procedure is developed to find the inlet velocity profile that yields the most uniform epitaxial layer in a vertical MOCVD reactor. It involves the solution of fully elliptic equations of motion, temperature, and concentration; the finite volume method based on SIMPLE algorithm has been adopted to solve the Navier-Stokes equations. The overall optimization process is highly nonlinear and has been efficiently treated by the sequential linear programming technique that breaks the non-linear problem into a series of linear ones. The optimal profile approximated by a 6th-degree Chebyshev polynomial is very successful in reducing the spatial non-uniformity of the growth rate. The optimization is particularly effective to the high Reynolds number flow. It is also found that a properly constructed inlet velocity profile can suppress the buoyancy driven secondary flow and improve the growth-rate uniformity.

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