• The Korean Journal of Ceramics
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• 제3권3호
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• pp.177-181
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• 1997

Epitaxial films of cubic silicon carbide (3C-SiC, $\beta$-SiC) have been grown on Si(001) and Si(111) substrates by high vacuum chemical vapor deposition using the single precursor 1,3-disilabutane, $H_3SiCH_2SiH_2CH_3$, at temperatures 900~$100^{\circ}C$. The advantage of using the single precursor over the covnentional chemical vapor deposition is evident in that the source chemical is safe to handle, carbonization of the substrates is not necessary, accurate stoichiometry of the silicon carbide films is easily achieved, and the deposition temperature is much lowered. The films were characterized by XPS, XRD, SEM, RHEED, RBS, AES, and TED.

• 한국세라믹학회지
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• 제56권3호
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• pp.277-283
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• 2019

We have examined minimization of the number of impurity particles by replacing the load-lock chamber materials of the chemical vapor deposition equipment through optimization of the pumping method in the deposition chamber. In order to reduce the number of impurity particles in the chamber, the load-lock spacer material was changed from monomer casting nylon to Torlon. Furthermore, we controlled the pumping speed and number of pumping ports, which resulted in a reduction in the impurity particle generation from 2.67% to 0.52%. This study revealed that the selection of the material for the parts of a chemical vapor deposition chamber can minimize particle generation, thereby presenting a method of optimization method of the chemical vapor deposition chamber.

• 대한기계학회논문집
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• 제18권5호
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• pp.1301-1309
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• 1994

A study of heat transfer and thermophoretic particle deposition has been carried out for the Modified Chemical Vapor Deposition(MCVD) process. A new concept utilizing two torches is suggested to simulate the heating effects from repeated traversing torches. Calculation results for the wall temperatures and deposition efficiency are in good agreement with experimental data. The effects of variable properties are included and heat flux boundary condition is used to simulate the moving torch heating. A conjugate heat transfer which includes heat conduction through solid layer and heat teansfer in a gas in a tube is analyzed. Of particular interests are the effects of torch speeds and solid layer thicknesses on the deposition efficiency, rate and the tapered entry length.

• 대한기계학회논문집
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• 제18권11호
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• pp.3057-3065
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• 1994

An experimental study has been made for heat transfer and particle deposition during the Modified Chemical Vapor Deposition process which is currently utilized to manufacture high quality optical waveguides. The distributions of tube wall temperatures, rates and efficiencies of particle deposition were measured. Results indicate that the temperature distributions of the tube wall in the axial direction yield the quasi-steady form in which temperature distributions fit in one curve if the relative distance from the moving torch is used as an axial coordinate. Due to the repeated heatings from the traversing torch, the wall temperatures are shown to reach the minimum ahead of torch and it is shown that the two torch formulation suggested by Park and Choi is valid to predict this minimum temperature. Measured wall temperatures, particle deposition efficiencies and tapered entry length are compared with the previous modelling results and shown to be in agreement.

• 한국전기전자재료학회논문지
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• 제19권6호
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• pp.512-518
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• 2006

In this paper, we investigated the deposition of pentacene thin film on a large area substrate by Organic Vapor Phase Deposition(OVPD) and applied it to fabrication of Organic Thin Film Transistor(OTFT). We extracted the optimum deposition conditions such as evaporation temperature of $260^{\circ}C$, carrier gas flow rate of 10 sccm and chamber vacuum pressure of 0.1 torr. We fabricated 72 OTFTs on the 4 inch size Si Wafer, Which produced the average mobility of $0.1{\pm}0.021cm^2/V{\cdot}s$, average subthreshold slope of 1.04 dec/V, average threshold voltage of -6.55 V, and off-state current is $0.973pA/{\mu}m$. The overall performance of pentacene TFTs over 4 ' wafer exhibited the uniformity with the variation less than 20 %. This proves that OVPD is a suitable methode for the deposition of organic thin film over a large area substrate.

• 대한기계학회논문집B
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• 제21권3호
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• pp.371-379
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• 1997

A theoretical study for a forced uniform flow impinging on a rotating disk, typically involved in Chemical Vapor Deposition(CVD) and Vapor-phase Axial Deposition(VAD) processes, has been carried out. A set of exact solutions for flow and temperature fields are developed by employing a similarity variable obtained from force balance on a control volume near the disk. The solutions depend on the rotating speed of the disk, .omega., and the forced flow speed toward the disk, a. For constant forced flow speed, the overall boundary layer thickness decreases when the rotating speed increases. Approximately 5%, 15%, and 30% decreases of the thickness are obtained for .omega./a = 2, 5, and 10, respectively, compared to the case of .omega./a = 0 (axisymmetric stagnation point flow). For constant rotating disk speed the boundary layer thickness immediately decreases as the forced flow speed increases, compared to the case of .omega./a .rarw. .inf. (induced flow near a rotating disk). Effects of .omega. and a on heat transfer coefficient are studied and explained with the boundary layer characteristics.

• 대한기계학회논문집
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• 제18권1호
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• pp.212-222
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• 1994

In the annular Modified Chemical Vapor Deposition process using two concentric tubes, the inner tube is heated to maintain high temperature gradients to have high thermophoretic force which can increase particle deposition efficiency. However, higher axial velocity in a narrow gap between inner and outer tubes can result in a longer tapered entry length. In the present paper, a new concept using an annular jet from the inner tube is presented and shown to significantly reduce the tapered entry length with maintaining high efficiency. Effects of a jet injection on heat transfer, fluid flow and particle deposition have been studied. Of particular interests are the effects of jet velocity, jet location and temperature on the deposition efficiency and tapered length . Torch heating effects from both the previous and present passes are included and the effect of surface radiation between inner and outer tubes is also considered.

• E2M - 전기 전자와 첨단 소재
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• 제9권8호
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• pp.776-782
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• 1996

The electrical properties of vapor deposition polymerized polymide thin films for getting an in-line system with manufacturing process of semiconductor device, have been studied. Polyimide thin films fabricated by vapor deposition polymerization(VDP) method based on PMDA and 4,4'-DDE monomer were confirmed by FT-IR spectra. It is found that the major conduction carriers of thin films are ions, and the hopping length of ions is almost same with monomer length at the temperature over 120.deg. C through the analysis of electrical conduction mechanism. Also, The activation energy is about 0.69 eV at the temperature of >$30^{\circ}C$ - >$150^{\circ}C$ and it is shown that the resistivity at which thin films can be used as an insulating film between layers of semiconductor device, is 3.2*10$^{15}$ .ohm.cm.

• Bulletin of the Korean Chemical Society
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• 제30권10호
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• pp.2245-2248
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• 2009

This paper demonstrates room temperature chemical vapor deposition (RTCVD) for fabricating titania inverse opals. The colloidal crystals of monodisperse polymer latex spheres were used as a sacrificial template. Titania was deposited into the interstices between the colloidal spheres by altermate exposures to water and titanium tetrachloride (Ti$Cl_4$) vapors. The deposition was achieved under atmospheric pressure and at room temperature. Titania inverse opals were obtained by burning out the colloidal template at high temperatures. The filling fraction of titania was controlled by the number of deposition of Ti$Cl_4$ vapor. The morphology of inverse opals of titania were investigated. The optical reflection spectra revealed a photonic band gap and was used to estimate the refractive index of titania.

• 한국진공학회지
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• 제5권4호
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• pp.354-358
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• 1996

precuror alternating metalorganic chemical vapor deposition(PAMOCVD)에 의한 InGaAs의 성장시에 높은 indium의 유입이 관찰되었다. gallium과 indium의 전구물질의 분해의 차이 그리고 이에따른 분해된 전구물질 분자의 흡착행동의 차이를 고려함으로써 PAMOCVD 성장시의 결정내로의 높은 indium유입의 mechanism을 제안하였다.