• Title/Summary/Keyword: Vacuum package

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Heat Transfer Analysis in the Vacuum Carburizing Furnace (진공 침탄로 내의 전열 해석)

  • Lee, In-Sub;Ryou, Hong-Sun;Kim, Won-Bae;Yang, Je-Bok
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.27 no.7
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    • pp.877-882
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    • 2003
  • The main objective of the present study is to analyze the heat transfer characteristics in the vacuum carburizing furnace. Local temperatures are measured at different locations in the self-fabricated furnace for various operating conditions using K-type thermocouples. In addition, the present study simulates the fluid flows and heat transfer in the vacuum carburizing furnace using a commercial package (Fluent V. 6.0), and compares the predictions of local temperatures with experimental data. The temperature and flow fields are predicted. It is found that the time taken for reaching the steady-state temperature under the vacuum pressure is shorter than that under the normal pressure condition. It means that the carburizing furnace under vacuum pressure condition is capable of saving the required energy more efficiently than the furnace under the normal pressure condition. Furthermore, the temperature variations predicted by the numerical simulations are in good agreement with experimental data.

Packaging technology of fresh-cut produce (신선편의식품 포장기술)

  • Kim, Ji Gang
    • Food Science and Industry
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    • v.50 no.2
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    • pp.12-26
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    • 2017
  • Processing steps such as washing and cutting, involved in preparing fresh-cut produce causes tissue damage, leading to rapid quality deterioration. Major defects of fresh-cut produce are discoloration, softening, off-odor development, and microbial growth. Packaging of fresh-cut produce has been changed to reduce these quality problems. Flexible packaging film is widely used to pack fresh-cut produce. Vacuum packaging was the popular packaging method in the beginning of fresh-cut industry in Korea. Vacuum packaging creates high $CO_2$ and low $O_2$ levels to control browning of fresh-cut produce. However, these conditions induce some visual defects and off-odor development. Discoloration problem was also found when fresh-cut produce was packaged with conventional packaging film or plastic tray. Modified atmosphere (MA) packaging is effective for prolonging shelf-life of fresh-cut produce by decreasing $O_2$ and increasing $CO_2$ concentration in the package. Retail MA packaging using different oxygen transmission rate (OTR) film and micro-perforated film has started to be applied to fresh-cut produce in Korea. Proper MA package design that provides optimum range of $O_2$ and $CO_2$ partial pressures is one of the major challenges in the industry. An initial package flushing with $N_2$ or an low $O_2$/high $CO_2$ atmosphere is also used to more rapidly establish steady-state MA condition. Film OTR and $O_2$ flushing affects the fermentative volatile production, off-odor development, electrolyte leakage, discoloration, $CO_2$ injury, microbial population of fresh-cut produce. There is also a demand for convenient packaging to attract consumers. Rigid fresh-cut produce container for retail market has increased since the packaging provides excellent protection from physical damage during transport. Rigid tray used as actual serving vessel for the consumer is increasing in Korea. The tray with flexible lid to wrap or seal fresh-cut produce is more and more gaining popularity. Further practical technology to control quality change and microbial growth for each fresh-cut product has been studied since various fresh-cut items were required. The fresh-cut industry also focuses on searching for more convenient and environmentally friendly packaging.

Results of the key comparison in absolute pressure from 1 Pa to 1000 Pa

  • Hong, Seung-Soo;Shin, Yong-Hyeon;Chung, Kwang-Hwa;A. P. Miiller
    • Journal of Korean Vacuum Science & Technology
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    • v.6 no.3
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    • pp.109-115
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    • 2002
  • This paper describes a CCM key comparison of low absolute-pressure standards at seven National Measurement Institutes that was carried out during the period March 1998 to September 1999 in order to determine their degrees of equivalence at pressures in the range 1 Pa to 1000 Pa. The Korea Research Institutes of Standards and Science(KRISS) participated from 10 Pa to 1000 Pa pressure range in 1999. The primary standards, which represent two principal measurement methods, included five liquid-column manometers and four static expansion systems. The transfer standard package consisted of four high-precision pressure transducers, two capacitance diaphragm gauges to provide high resolution at low pressures, and two resonant silicon gauges to provide the required calibration stability.

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Establishment of Shelf-life of Vacuum Packaged Pork Loins for exporting to Japan (대일 수출용 진공포장 냉장등심의 유통기한 설정)

  • 이무하
    • Food Science of Animal Resources
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    • v.18 no.2
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    • pp.115-124
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    • 1998
  • This study was carried out investigate hygienic conditions of domestic packing plant for export and the shelf-life by Japanese standards. vacuum packaged chilled port loins provided by five packers(A, B, C, D and E) were transported to Japan in the same condition, Four packers(A, B, C adn d) produced the samples as hygienic as possible and one packer produced loins in the traditional hygienic condition, In TTC(2,3,5-triphenyl tetrazolium chloride) test all samples showed the negative reaction from the date of the quarantine(14 days after slaughtering) to 50 days The numbers of total plate count(TPC) of A, B, C and D packers that were below 108CFU/g until 50 days were accepted by Japanese Standards but TPC of E packer was over 107CFU/g at 30 days. VBN values increased sig-nificantly(P<0.01) in samples of A,B and D packers in the samples of C packer and E packer at 5% and 0.1% level respectively. The pH values of the vacuum packaged chilled pork for export at 14 days after slaughtering were 5.43∼6.00 In sensory evaluation, A, B, C and D packers which improved hygi-enic condition produced the products with good color and appearance. low drip until 40 days storage at $0^{\circ}C$ But as the storage time increase off-flavor occured at 40days in A and D packer and at 50days in B and C packer. In conclusion according to the above results of microbiological physicochemical and sensory evalution the edible periods of Korean vacuum package chilled porks may be estimated to 40∼50 days for the packers who improved hygienic condition and the shelf lives were calculated as 32∼40 days from edible period by a factor of 0.8(safety coefficient) while that of the pork from E packer which was produced in the traditional hygienic condition was estimated to 30 days after slaughtering at $0^{\circ}C$ Therefore the shelf-life of the pork of E packer would be only 24 days.

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Wafer-Level Packaged MEMS Resonators with a Highly Vacuum-Sensitive Quality Factor

  • Kang, Seok Jin;Moon, Young Soon;Son, Won Ho;Choi, Sie Young
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.14 no.5
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    • pp.632-639
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    • 2014
  • Mechanical stress and the vacuum level are the two main factors dominating the quality factor of a resonator operated in the vacuum range 1 mTorr to 10 Torr. This means that if the quality factor of a resonator is very insensitive to the mechanical stress in the vacuum range, it is sensitive to mainly the ambient vacuum level. In this paper, a wafer-level packaged MEMS resonator with a highly vacuum-sensitive quality factor is presented. The proposed device is characterized by a package with out-of-plane symmetry and a suspending structure with only a single anchor. Out-of-plane symmetry helps prevent deformation of the packaged device due to thermal mismatch, and a single-clamped structure facilitates constraint-free displacement. As a result, the proposed device is very insensitive to mechanical stress and is sensitive to mainly the ambient vacuum level. The average quality factors of the devices packaged under pressures of 50, 100, and 200 mTorr were 4987, 3415, and 2127, respectively. The results demonstrated the high controllability of the quality factor by vacuum adjustment. The mechanical robustness of the quality factor was confirmed by comparing the quality factors before and after high-temperature storage. Furthermore, through more than 50 days of monitoring, the stability of the quality factor was also certified.

Process Characteristics of Atmospheric Pressure Plasma for Package Substrate Desmear Process (패키지 기판 디스미어 공정의 대기압 플라즈마 처리 특성)

  • Ryu, Sun-Joong
    • Journal of the Korean Vacuum Society
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    • v.18 no.5
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    • pp.337-345
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    • 2009
  • When the drill hole diameter for the package substrate is under $100{\mu}m$, the smear in the drill hole cannot be eliminated by wet desmear process only. We intended to change the substrate's hydrophobic characteristics to hydrophilic characteristics by adapting the atmospheric pressure plasma prior to the wet desmear process. Atmospheric pressure plasma process was made as the inline type equipment which is adequate for the package substrate's manufacturing process and remote DBD type electrodes were used for the equipment. As the result of atmospheric pressure plasma processing, the contact angle of the substrate was enhanced from 71 degree to 30 degree. Dielectric film thickness, drill hole diameter and surface roughness were measured to evaluated the characteristics of the wet desmear process in case of plasma processing and in case of none. By the measurement, it was analyzed that the process uniformity within the whole panel was largely enhanced. Also, it was verified that the smear in the drill hole was eliminated efficiently which was analyzed by the SEM image of the drill hole.

Simulation of High-current Vacuum Arcs: (I)Axial Magnetic Field (진공차단부 대전류 아크 해석: (I)축방향 자기장)

  • Hwang, Jung-Hoon;Lee, Jong-Chul;Choi, Myung-Jun;Kwon, Jung-Lock;Kim, Youn-Jea
    • Proceedings of the KSME Conference
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    • 2007.05b
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    • pp.2500-2505
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    • 2007
  • The vacuum interrupter (VI) is used for medium-voltage switching circuits due to its abilities and advantages as a compact and environmental friendly circuit breaker. In general, the application of a sufficiently strong axial magnetic field (AMF) permits the arc to be maintained in a diffused mode to a high-current vacuum arc. A full understanding of the vacuum arc physics is very important since it can aid to improve the performance of vacuum interrupter. In order to closely examine the vacuum arc phenomena, it is necessary to predict the magnetohydrodynamic (MHD) characteristics by the multidisciplinary numerical modeling, which is coupled with the electromagnetic and hydrodynamic fields, simultaneously. In this study, we have investigated the electromagnetic behaviors of high-current vacuum arcs for two different types of AMF contacts, which are coil-type and cup-type, using a commercial finite element analysis (FEA) package, ANSYS. The present results are compared with those of MAXWELL 3D, a reliable electromagnetic analysis software, for verification.

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Effects of Electrode Configurations on the Characteristics of Axial Magnetic Fields in Vacuum Interrupter (전극형상 변화가 진공차단기내 축방향 자기장 특성에 미치는 영향)

  • Hwang, Jung-Hoon;Lee, Jong-Chul;Kim, Youn-Jea
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.32 no.1
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    • pp.7-12
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    • 2008
  • The vacuum interrupter (VI) is used for medium-voltage switching circuits due to its abilities and advantages as a compacted environmental friendly circuit breaker. In general, the application of a sufficiently strong axial magnetic field (AMF) permits the arc to be maintained in a diffused mode to a high-current vacuum arc. A full understanding of the vacuum arc physics is very important since it can aid to improve the performance of vacuum interrupter. In order to closely examine the vacuum arc phenomena, it is necessary to predict the magnetohydrodynamic (MHD) characteristics by the multidisciplinary numerical modeling, which is coupled with the electromagnetic and hydrodynamic fields, simultaneously. In this study, we have investigated the effect of changing geometrical parameters for electromagnetic behaviors of high-current vacuum arcs with two different types of AMP contacts, which are coil-type and cup-type, using a commercial finite element analysis (FEA) package, ANSYS. The present results are compared with those of MAXWELL 3D, a reliable electromagnetic analysis software, for verification.

Residual gas analysis of small cavity for emissive flat panel display (미소체적을 갖는 평판표시소자용 패널내부의 잔류가스 분석)

  • 조영래;오재열;최정옥;김봉철;이병교;이진호;조경익
    • Journal of the Korean Vacuum Society
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    • v.10 no.1
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    • pp.9-15
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    • 2001
  • The total pressure and partial pressure of small cavity for flat panel display have been successfully measured by using an ultra-high vacuum chamber with mass spectrometer. The total pressure in the panel was in the range of $10^{-6}$ Torr and the major partial pressure affecting increase in total pressure were those of Ar, $CH_4$and He. The baking temperature during evacuation process was very important for high-vacuum package, the total pressure and partial pressure of $CH_4$ were decreased as the increase of baking temperature.

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Vacuum Packaging of MEMS (Microelectromechanical System) Devices using LTCC (Low Temperature Co-fired Ceramic) Technology (LTCC 기술을 이용한 MEMS 소자 진공 패키징)

  • 전종인;최혜정;김광성;이영범;김무영;임채임;황건탁;문제도;최원재
    • Journal of the Microelectronics and Packaging Society
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    • v.10 no.1
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    • pp.31-38
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    • 2003
  • In the current electronic technology atmosphere, MEMS (Microelectromechanical System) technology is regarded as one of promising device manufacturing technologies to realize market-demanding device properties. In the packaging of MEMS devices, the packaged structure must maintain hermeticity to protect the devices from a hostile atmosphere during their operations. For such MEMS device vacuum packaging, we introduce the LTCC (Low temperature Cofired Ceramic) packaging technology, in which embedded passive components such as resistors, capacitors and inductors can be realized inside the package. The technology has also the advantages of the shortened length of inner and surface traces, reduced signal delay time due to the multilayer structure and cost reduction by more simplified packaging processes owing to the realization of embedded passives which in turn enhances the electrical performance and increases the reliability of the packages. In this paper, the leakage rate of the LTCC package having several interfaces was measured and the possibility of LTCC technology application to MEMS devices vacuum packaging was investigated and it was verified that improved hermetic sealing can be achieved for various model structures having different types of interfaces (leak rate: stacked via; $4.1{\pm}1.11{\times}10^{-12}$/ Torrl/sec, LTCC/AgPd/solder/Cu-tube; $3.4{\pm}0.33{\times}10^{-12}$/ Torrl/sec). In real application of the LTCC technology, the technology can be successfully applied to the vacuum packaging of the Infrared Sensor Array and the images of light-up lamp through the sensor way in LTCC package structure was presented.

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