• Journal of the Korean Vacuum Society
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• v.14 no.1
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• pp.29-34
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• 2005

The degradation of the SiGe hetero-junction bipolar transistor(HBT) properties in SiGe BiCMOS process was investigated in this paper. The SiGe HBT prepaired by SiGe BiCMOS process, unlike the conventional one, showed the degraded DC characteristics such as the decreased Early voltage, the decreased collector-emitter breakdown voltage, and the highly increased base leakage current. Also, the cutoff frequency(f/sub T/) and the maximum oscillation frequency(f/sub max/) representing the AC characteristics are reduced to below 50%. These deteriorations are originated from the change of the locations of emitter-base and collector-base junctions, which is induced by the variation of the doping profile of boron in the SiGe base due to the high-temperature source-drain annealing. In the result, the junctions pushed out of SiGe region caused the parastic barrier formation and the current gain decrease on the SiGe HBT device.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.178-178
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• 2010

With the scaling down of ULSI(Ultra Large Scale Integration) circuit of CMOS(Complementary Metal Oxide Semiconductor)based electronic devices, the electronic devices become more faster and smaller size that are promising field of semiconductor market. However, very narrow line width has some disadvantages. For example, because of narrow line width, deposition of conformal and thin barrier is difficult. Besides, proportion of barrier width is large, thus resistance is high. Conventional PVD(Physical Vapor Deposition) thin films are not able to gain a good quality and conformal layer. Hence, in order to get over these side effects, deposition of thin layer used of ALD(Atomic Layer Deposition) is important factor. Furthermore, it is essential that copper atomic diffusion into dielectric layer such as silicon oxide and hafnium oxide. If copper line is not surrounded by diffusion barrier, it cause the leakage current and devices degradation. There are some possible methods for improving the these secondary effects. In this study, TaNx, is used of Tertiarybutylimido tris (ethylamethlamino) tantalum (TBITEMAT), was deposited on the 24nm sized trench silicon oxide/silicon bi-layer substrate with good step coverage and high quality film using plasma enhanced atomic layer deposition (PEALD). And then copper was deposited on TaNx barrier using same deposition method. The thickness of TaNx was 4~5 nm. TaNx film was deposited the condition of under $300^{\circ}C$ and copper deposition temperature was under $120^{\circ}C$, and feeding time of TaNx and copper were 5 seconds and 5 seconds, relatively. Purge time of TaNx and copper films were 10 seconds and 6 seconds, relatively. XRD, TEM, AFM, I-V measurement(for testing leakage current and stability) were used to analyze this work. With this work, thin barrier layer(4~5nm) with deposited PEALD has good step coverage and good thermal stability. So the barrier properties of PEALD TaNx film are desirable for copper interconnection.

• Journal of the Korean Vacuum Society
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• v.9 no.4
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• pp.360-366
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• 2000

$Sr_xBi_{2.4}Ta_2O_9$ (SBT) thin films of 150 nm thickness were prepared using LSMCD (Liquid Source Misted Chemical Deposition) process with variation of the Sr/Ta mole ratio of 0.35~0.65, and their crystalline phase, microstructure, ferroelectric properties and leakage current characteristics were investigated. Ferroelectric characteristics of the LSMCD-derived SBT films were optimized at the Sr/Ta moleratio of 0.425. The remanent polarization (2Pr) and coercive field (Ec) of the SBT film with the Sr/Ta mole ratio of 0.425 were measured as 15.01 $\mu$C/$ \textrm{cm}^2$ and 41 kV/cm at an applied voltage of $\pm$5 V respectively. LSMCD-derived SBT films with the Sr/Ta mole ratio of 0.35~0.5 exhibited leakage current densities lower than $10^{-5} A/\textrm{cm}^2$ at an applied field of 100 kV/cm, and excellent fatigue-free characteristics of the remanent polarization decrement less than 1% after $10^{10}$ switching cycles at$\pm$5 V.

• Journal of the Korean Vacuum Society
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• v.17 no.2
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• pp.117-121
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• 2008

The SiOC film of carbon centered system was prepared using bistrimethylsilylmethane and oxygen mixed precursor by the chemical vapor deposition. The chemical properties of the SiOC film were analyzed by the I-V measurement and FTIR spectra analysis. The main bond of $950{\sim}1200cm^{-1}$ was composed of the Si-C, Si-O-C and Si-O bonds. The leakage current of the SiOC film increased with the increasing of the carbon content, and the drift of the current was in proportion to the Si-O-C bond content. The deconvoluted data of FTIR spectra could be classified the three types such as organic, hybrid and inorganic types, and the contact angle showed the difference of three types.

• Journal of Chest Surgery
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• v.57 no.2
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• pp.152-159
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• 2024

Background: Anastomotic leakage (AL) following esophagectomy represents a serious complication that often results in prolonged hospitalization and necessitates repeated interventions, including nothing-by-mouth (NPO) restriction, endoscopic vacuum therapy (EVT), or surgical repair. In this study, we evaluated the patterns and outcomes of AL treatment. Methods: We retrospectively reviewed the medical records of patients who underwent esophagectomy for esophageal cancer at a single center between 2003 and 2020. Of 3,096 examined cases, 181 patients (5.8%) with AL were included in the study: 114 patients (63%) with cervical anastomosis (CA) and 67 (37%) with intrathoracic anastomosis (TA). Results: The incidence of AL was 11.9% in the CA and 3.2% in the TA group (p<0.001). Among patients with CA who developed AL, 87 (76.3%) were managed with NPO, 15 (13.2%) with EVT, and 12 (10.5%) with surgical repair. Over 90% of patients with cervical AL resumed an oral diet by the time of discharge, regardless of treatment method. Among patients with TA and AL, 36 (53.7%) received NPO, 25 (37.7%) underwent EVT, and 6 (9%) required surgery. Of these, 34 patients who were managed with NPO and 19 with EVT could resume an oral diet. However, only 2 patients who underwent surgery resumed an oral diet, and 2 patients required additional EVT. Conclusion: Although patients with CA displayed a higher incidence of AL, their rate of successful oral intake exceeded that of those with TA, regardless of treatment method. Among patients exhibiting AL with TA, EVT was more commonly employed than in CA cases, and it appears effective.

• International Journal of Fluid Machinery and Systems
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• v.4 no.1
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• pp.67-75
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• 2011

Recent results are presented concerning the development of magnetofluidic leakage-free rotating seals for vacuum and high pressure gases, evidencing significant advantages compared to mechanical seals. The micro-pilot scale production of various types of magnetizable sealing fluids is shortly reviewed, in particular the main steps of the chemical synthesis of magnetic nanofluids and magnetic composite fluids with light hydrocarbon, mineral oil and synthetic oil carrier liquids. Design concepts and some constructive details of the magnetofluidic seals are discussed in order to obtain high sealing capacity. Different types of magnetofluidic sealing systems and applications are reviewed. Testing procedures and equipment are presented, as well as the sealing capabilities of different types of magnetizable fluids.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.134-134
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• 2011

High-k dielectric materials such as $HfO_2$, $ZrO_2$ and $Al_2O_3$ increase gate capacitance and reduce gate leakage current in MOSFET structures. This behavior suggests that high-k materials will be promise candidates to substitute as a tunnel barrier. Furthermore, stack structure of low-k and high-k tunnel barrier named variable oxide thickness (VARIOT) is more efficient.[1] In this study, we fabricated the $WSi_2$ nanocrystals nonvolatile memory device with $SiO_2/HfO_2/Al_2O_3$ tunnel layer. The $WSi_2$ nano-floating gate capacitors were fabricated on p-type Si (100) wafers. After wafer cleaning, the phosphorus in-situ doped poly-Si layer with a thickness of 100 nm was deposited on isolated active region to confine source and drain. Then, on the gate region defined by using reactive ion etching, the barrier engineered multi-stack tunnel layers of $SiO_2/HfO_2/Al_2O_3$ (2 nm/1 nm/3 nm) were deposited the gate region on Si substrate by using atomic layer deposition. To fabricate $WSi_2$ nanocrystals, the ultrathin $WSi_2$ film with a thickness of 3-4 nm was deposited on the multi-stack tunnel layer by using direct current magnetron sputtering system [2]. Subsequently, the first post annealing process was carried out at $900^{\circ}C$ for 1 min by using rapid thermal annealing system in nitrogen gas ambient. The 15-nm-thick $SiO_2$ control layer was deposited by using ultra-high vacuum magnetron sputtering. For $SiO_2$ layer density, the second post annealing process was carried out at $900^{\circ}C$ for 30 seconds by using rapid thermal annealing system in nitrogen gas ambient. The aluminum gate electrodes of 200-nm thickness were formed by thermal evaporation. The electrical properties of devices were measured by using a HP 4156A precision semiconductor parameter analyzer with HP 41501A pulse generator, an Agillent 81104A 80MHz pulse/pattern generator and an Agillent E5250A low leakage switch mainframe. We will discuss the electrical properties for application next generation non-volatile memory device.

• Journal of Advanced Marine Engineering and Technology
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• v.39 no.9
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• pp.876-880
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• 2015

In 2016, the IMO's new rules for an 80% reduction in NOx emissions in newly built ships will necessitate the use of LNG as a clean fuel. So far, the developed European countries have led the development of LNG bunkering ships and related facilities. An LNG bunkering system stores LNG in a horizontal or vertical IMO "C"-Type tank insulated with perlite powder, and a vacuum in the annular space between the double walls, like the cryogenic liquid nitrogen tank. Current storage tanks have high heat leakage, evaporating over 2.0% daily, and are difficult to build with the required vacuum. A more efficiently insulated storage tank could reduce the evaporation rate. This research carried out thermal analysis on a new effective insulation method that separates high vacuum in the annular space between two tanks with a solid insulation material, such as urethane foam, lining the outer vessel. This highly efficient insulation system obtained an evaporation rate of 0.03% per day under a $10^{-3}torr$ vacuum, and an evaporation rate of 0.11% at $10^{-45}torr$. Even if the space loses its vacuum, the new insulation system showed a lower evaporation rate of 4.12% than the present perlite system of 4.9%. This newly developed tank can increase the efficiency of LNG storage tank and may help keep LNG bunkering systems safe.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.329-329
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• 2012

Mobile 기기로 둘러싸여있는 현대의 환경에서 Flash memory에 대한 중요성은 날로 더해가고 있다. Flash memory의 가격 경쟁력 강화와 사용되는 기기의 소형화를 위해 flash memory의 비례축소가 중요한 문제로 부각되고 있다. 그러나 다결정 실리콘을 플로팅 게이트로 이용하는planar flash memory 소자의 경우 비례 축소 시 short channel effect 와 leakage current, subthreshold swing의 증가로 인한 성능저하와 같은 문제들로 인해 한계에 다다르고 있다. 이를 해결하기 위해 CTF 메모리 소자, nanowire FET, FinFET과 같은 새로운 구조를 가지는 메모리소자에 대한 연구가 활발히 진행되고 있다. 본 연구에서는 22 nm 게이트 크기의 FinFET 구조를 가지는 플래시 메모리소자에서 fin의 두께와 높이의 변화에 따른 메모리 소자의 전기적 특성을 3-dimensional 구조에서 technology computer aided design ( TCAD ) tool을 이용하여 시뮬레이션 하였다. 본 연구에서는 3D FinFET 구조를 가진 플래시 메모리에 대한 시뮬레이션 하였다. FinFET 구조에서 채널영역은 planar 구조와 다르게 표면층이 multi-orientation을 가지므로 본 계산에서는 multi-orientation Lombardi mobility model을 이용하여 계산하였다. 계산에 사용된 FinFET flash memory 구조는 substrate의 도핑농도는 $1{\times}10^{18}$로 하였으며 source, drain, gate의 도핑농도는 $1{\times}10^{20}$으로 설정하여 계산하였다. Fin 높이는 28 nm로 고정한 상태에서 fin의 두께는 12 nm부터 28nm까지 6단계로 나누어서 각 구조에 대한 프로그램 특성과 전기적 특성을 관찰 하였다. 계산결과 FinFET 구조의 fin 두께가 두꺼워 질수록 채널형성이 늦어져 threshold voltage 값이 커지게 되고 subthreshold swing 값 또한 증가하여 전기적 특성이 나빠짐을 확인하였다. 각 구조에서의 전기장과 전기적 위치에너지의 분포가 fin의 두께에 따라 달라지므로써 이로 인해 프로그램 특성과 전기적 특성이 변화함을 확인하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.396-396
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• 2012

$TiO_2$ anatase nanotube arrays (NTAs) were grown by electrochemical anodization and followed annealing of Ti foil. Ethylene glycol/$NH_4F$-based organic electrolyte was used for electrolyte solution and using second anodization process to obtain free-standing NTAs. After obtaining NTAs, ITO film was deposited by sputtering process on bottom of NTAs. UV-curable NOA was used for attach free-standing NTAs on flexible plastic substrate (PEN). Solid state electrolyte (spiro-OMeTAD) was coated via spin-coating method on top of attached NTAs. Ag was deposited as a counter electrode. Under AM 1.5 simulated sunlight, optical characteristics of devices were investigated. In order to use flexible polymer substrate, processes have to be conducted at low temperature. In case of $TiO_2$ nano particles (NPs), however, crystallization of NPs at high temperature above $450^{\circ}C$ is required. Because NTAs were conducted high temperature annealing process before NTAs transfer to PEN, it is favorable for using PEN as flexible substrate. Fabricated flexible solid-state DSSCs make possible the preventing of liquid electrolyte corrosion and leakage, various application.