• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.337-337
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• 2000

This paper describes a Chuck System developed for scaling PDP gas hole on PDP panel glass. There are lots of constraints for designing Chuck System: high temperature, high vacuum, precious motor control etc. A such constraints was considered by design of structure and by selecting of parts and material for Chuck System. The Chuck System was manufactured and assembled after the design process. It was applied on the PDP process unit. For sealing POP hole, precious control of a step motor was important in this system. For this experiment, a step motor, motor driver and micro controller(80196KC) were used.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.3
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• pp.53-58
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• 2008

This study was conducted to evaluate the flatness of the porous type of dicing chuck. Two measurement systems for a vacuum chuck with a porous type of ceramic plate were prepared using a digital indicator and a laser interferometer. 6 inch of silicon and glass wafer were also used. Vacuum pressure from 100mmHg to 700mmHg by 100mmHg was increased. From experiments, chucked-wafer flatness was converged to the dicing chuck flatness itself even though the repeatability of contact method using indicator was unstable. Finally, the chuck flatness was estimated below $2{\mu}m$ with peak-to valley value.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.121-127
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• 2022

Micro-LED is a light-emitting diode smaller than 100 ㎛ in size. It attracts much attention due to its superior performance, such as resolution, brightness, etc., and is considered for various applications like flexible display and VR/AR. Micro-LED display requires a mass transfer process to move micro-LED chips from a LED wafer to a target substrate. In this study, we proposed a vacuum chuck method as a mass transfer technique. The vacuum chuck was fabricated with MEMS technology and PDMS micro-mold process. The spin-coating approach using a dam structure successfully controlled the PDMS mold's thickness. The vacuum test using solder balls instead of micro-LED confirmed the vacuum chuck method as a mass transfer technique.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.6 no.2
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• pp.28-33
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• 2007

This paper describes development of low cost precision machine that has a vacuum chuck. This study mainly aims to find out a cutting condition for maintaining optimum surface condition and to examine cutting characteristics of the precision machine that is equipped by diamond bites. The cutting materials is oxygen free copper. Several experiments were carried out to find out the main factors that affect the surface roughness such as principal axis RPM(rotation per minute), feeding speed, and cutting depth. As a result, we obtain The optimum cutting condition of the developed precision machine.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.193-193
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• 1999

• Tribology and Lubricants
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• v.24 no.6
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• pp.326-331
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• 2008

The contact surfaces between mold and target should be in parallel for a proper imprinting process. However, large size of contacting area makes it difficult for both mating surfaces (mold and target planes) to be in all uniform contact with the expected precision level in terms of thickness and position. This is caused by the waviness of mold and target although it is very small relative to the area scale. The gripping force for both mold and target by the vacuum chuck is other major effect to interrupt the uniform contact, which must be avoided in imprinting mechanism. In this study, the cause of non-conformal contact mechanism between mold and target is investigated with the consideration of deformation due to the vacuum gripping for the size $470{\times}370\;mm^2$ LCD panel.

• Current Optics and Photonics
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• v.1 no.6
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• pp.618-625
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• 2017

In the present research, a new bending system using a segmented vacuum chuck for Stressed Mirror Polishing (SMP) is developed. SMP is a special fabrication method for thin aspheric mirrors, where simple flat or spherical fabrication is applied while a mirror blank is deflected. Since a mirror blank is usually glued to a bending fixture in the conventional SMP process, there are drawbacks such as long curing time, inconvenience of mirror replacement, risk of mirror breakage, and stress concentration near the glued area. To resolve the drawbacks, a new bending system is designed to effectively hold a mirror blank by vacuum. For the developed bending system, the optimal bending load to achieve the designated mirror deflection is found by finite element analysis and an optimization algorithm. With the measurement results of the deflected mirror surfaces with the optimal bending loads, the feasibility of the developed bending system is investigated. As a result, it is shown that the bending system is appropriate for the SMP process.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2006.05a
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• pp.269-272
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• 2006

Surface contacts between mold and target should be in parallel for the imprinting mechanism. However, the size of contacting area makes it difficult for both mating surfaces to be in all contact because of precision level of the imprinting machine and the waviness of mold and target. The gripping force for both mold and target with the vacuum chuck is also major effect to interrupt the full contact, which must be avoided in imprinting mechanism. In this study, the preliminary study for the causes of non-uniformity of contacting surfaces such as mold and target is performed with $470{\times}370mm^2$ LCD panel size.

• Elastomers and Composites
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• v.50 no.1
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• pp.55-61
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• 2015

Manufacturing process of OLED contains adsorption-desorption process of glass substrate. There are several adsorption methods of glass substrate such as atmospheric pressure, vacuum and electrostatic adsorption. However, these methods are very complex to connect system. Therefore, the adsorption method using silicone rubber based sticking chuck was proposed in this study. Three types of silicone rubbers having 0, 19.3 and 32.2 wt% of fluorine were used and their mechanical properties, surface energies and adsorption properties were examined. According to the results ${\sigma}_{300}$ and hardness increased with increasing fluorine contents, but elongation was decreased. Also, fluorosilicone rubber containing 32.2 wt% of fluorine showed the lowest surface tension, among three types of rubber and resulted in the highest initial tack with glass substrate. After the adsorption-desorption test of 300,000 cycles was performed, the adsorption force of S-1 (silicone rubber) decreased largely from 2.34 to 0.73 MPa. However, the S-3 (fluorosilicone rubber having 32.2 wt%. of fluorine) decreased only from 3.15 to 2.24 MPa. From this study, we obtained the valuable equations related to long term durability of silicone based sticking chuck. Finally the transfer of silicone rubber to glass substrate with the adsorption-desorption process was not occurred and this phenomenon was examined by UV-Visible spectroscopy.

• Korean Journal of Materials Research
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• v.19 no.2
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• pp.68-72
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• 2009

This study investigated dry etching of acrylic in capacitively coupled $SF_6$, $SF_6/O_2$ and $SF_6/CH_4$ plasma under a low vacuum pressure. The process pressure was 100 mTorr and the total gas flow rate was fixed at 10 sccm. The process variables were the RIE chuck power and the plasma gas composition. The RIE chuck power varied in the range of $25{\sim}150\;W$. $SF_6/O_2$ plasma produced higher etch rates of acrylic than pure $SF_6$ and $O_2$ at a fixed total flow rate. 5 sccm $SF_6$/5 sccm $O_2$ provided $0.11{\mu}m$/min and $1.16{\mu}m$/min at 25W and 150W RIE of chuck power, respectively. The results were nearly 2.9 times higher compared to those at pure $SF_6$ plasma etching. Additionally, mixed plasma of $SF_6/CH_4$ reduced the etch rate of acrylic. 5 sccm $SF_6$/5 sccm $CH_4$ plasma resulted in $0.02{\mu}m$/min and $0.07{\mu}m$/min at 25W and 150W RIE of chuck power. The etch selectivity of acrylic to photoresist was higher in $SF_6/O_2$ plasma than in pure $SF_6$ or $SF_6/CH_4$ plasma. The maximum RMS roughness (7.6 nm) of an etched acrylic surface was found to be 50% $O_2$ in $SF_6/O_2$ plasma. Besides the process regime, the RMS roughness of acrylic was approximately $3{\sim}4\;nm$ at different percentages of $O_2$ with a chuck power of 100W RIE in $SF_6/O_2$ plasma etching.