• 제목/요약/키워드: Using analysis

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Short Circuit Electromagnetic Force Prediction by Coupled Electromagnetic-Mechanical Field Analysis of Dry-Type Transformer (전자계-기계계 결합해석에 의한 건식변압기의 단락강도 예측)

  • Ahn, Hyun-Mo;Hahn, Sung-Chin
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.60 no.2
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    • pp.301-308
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    • 2011
  • This paper deals with the coupled electromagnetic-mechanical field analysis for short-circuit electromagnetic force of the dry-type transformer. The short-circuit currents are calculated using external circuit in accordance with short-circuit test equipment. According to short-circuit current, the generated magnetic leakage flux density in dry-type transformer model is calculated by finite element method. The radially-directed electromagnetic forces in windings are calculated using electromagnetic field analysis and then axially-directed electromagnetic forces in windings are calculated using electromagnetic-mechanical field analysis. The calculated axially-directed electromagnetic forces in high voltage winding are compared to those of measured ones and showed good agreement with experimental results.

Structural Analysis and Safety of FCT Inspection Automation System (FCT 검사 자동화 System의 구조해석 및 구조 안전성에 관한 연구)

  • Jeong, Hae-Jin;Lee, Jong-Chan
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.21 no.7
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    • pp.114-119
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    • 2022
  • The analysis conditions were established using the self-weight of the FCT automation equipment, and natural frequency analysis was performed under the same conditions. For the structural analysis, 3D modeling was performed using Inventor, and structural analysis was performed using the Ansys workbench. From the structural analysis, it was concluded that the resulting values of the stress and deformation of the equipment do not affect the equipment. From the dynamic analysis, the resonance does not occur in the equipment driving area, and thus it is judged to be stable.

Building frame-pile foundation-soil interactive analysis

  • Chore, H.S.;Ingle, R.K.;Sawant, V.A.
    • Interaction and multiscale mechanics
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    • v.2 no.4
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    • pp.397-411
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    • 2009
  • The effect of soil-structure interaction on a simple single storeyed and two bay space frame resting on a pile group embedded in the cohesive soil (clay) with flexible cap is examined in this paper. For this purpose, a more rational approach is resorted to using the three dimensional finite element analysis with realistic assumptions. The members of the superstructure and substructure are descretized using 20 node isoparametric continuum elements while the interface between the soil and pile is modeled using 16 node isoparametric interface elements. Owing to viability in terms of computational resources and memory requirement, the approach of uncoupled analysis is generally preferred to coupled analysis of the system. However, an interactive analysis of the system is presented in this paper where the building frame and pile foundation are considered as a single compatible unit. This study is focused on the interaction between the pile cap and underlying soil. In the parametric study conducted using the coupled analysis, the effect of pile spacing in a pile group and configuration of the pile group is evaluated on the response of superstructure. The responses of the superstructure considered include the displacement at top of the frame and moments in the superstructure columns. The effect of soil-structure interaction is found to be quite significant for the type of foundation used in the study. The percentage variation in the values of displacement obtained using the coupled and uncoupled analysis is found in the range of 4-17 and that for the moment in the range of 3-10. A reasonable agreement is observed in the results obtained using either approach.

A Study on the Weight Reduction of X,Y stage of Semiconductor Inspection Equipment using Sensitivity Analysis (민감도 분석을 이용한 반도체 검사 장비의 X, Y 스테이지 구조의 경량화 연구)

  • Koh, Man Soo;Kwon, Soon Ki;Kim, Cham Nae
    • Journal of Digital Convergence
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    • v.17 no.7
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    • pp.125-130
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    • 2019
  • Sensitivity analysis is used to determine the effect of a change in a design parameter on the total system, and the calculated sensitivity is an important indicator of the improvement of a structure. In this study, we investigated the method of deriving and analyzing the sensitivity of design parameters by using finite element analysis and the method of improving a structure by using sensitivity analysis results. Design parameters for weight reduction design were selected using actual semiconductor inspection equipment that requires structural improvement, and the sensitivity to design parameters was calculated by using and finite difference method. We propose an improvement method that can reduce the weight while maintaining the transient response required by the equipment. By using the results of the sensitivity analysis through finite element analysis and finite difference method, we can create a structurally improved design that satisfies the desired stress or displacement by improving the design of the structure. Therefore, sensitivity analysis is applicable to various fields as well as semiconductor inspection equipment.

A Study on the Effective Evaluation of Slope Berm Construction using Slope Stability Analysis Program (사면안정해석 프로그램을 이용한 사면 소단 설치의 효용성 평가에 관한 연구)

  • 이종현;이정엽;김승현;유기정;구호본
    • Proceedings of the Korean Geotechical Society Conference
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    • 2003.03a
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    • pp.485-492
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    • 2003
  • In this study, We peformed on the effective evaluation of slope berm construction using slope stability analysis programs. The effective evaluation of slope berm construction was performed by stability of slope and economy of construction. This time, used slope stability analysis programs are Talren97 that use Limit equilibrium method (LEM) and FLAC-SLOPE that use finite difference method (FDM), and carried out using Rocfall program to evaluate slope stability by rockfall occurrence.

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Reliability Analysis of laminated Composite Panel using Response Surface Method (반응면 기법을 이용한 적층복합재료판의 신뢰성해석)

  • 방제성;김용협
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2001.10a
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    • pp.187-190
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    • 2001
  • Response surface method is applied to evaluate the reliability of laminated composite panels. Since the linear and nonlinear first-ply failure load are computed using deterministic finite element analysis, new probabilistic finite element analysis is not necessary. Tsai-Wu criterion is used to construct the limit state suface. Material properties, layer thickness and lamina strengths of laminated composite panel are treated as random design variables. feasibility and accuracy of current method is validated using Monte-Carlo method Which perform thousand times of finite element analysis directly.

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The Acoustic Emission Energy Analysis of Subambient Pressure Tri-Pad Slider

  • Pan Galina;Hwang Pyung;Xuan Wu
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 2004.11a
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    • pp.139-142
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    • 2004
  • The object of the present work is the acoustic emission energy analysis of subambient pressure tri-pad slider. Head/disk interaction during start/stop and constant speed were detected by using acoustic emission (AE) test system The frequency spectrum analysis is performed using the AE signal obtained during the head/disk interaction Natural frequency analysis was performed using Ansys program. Acoustic emission energy was calculated for the slider modes.

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An Analysis of Variance Procedure for the Split-Plot Design Using SPSS Syntax Window

  • Choi Byoung-Chul
    • Communications for Statistical Applications and Methods
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    • v.12 no.1
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    • pp.61-69
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    • 2005
  • In conducting the analysis of variance for the split-plot design using the statistical package SPSS, users including statisticians are faced with difficulties because of no appropriate example in the SPSS applications guide book. In this paper, therefore, we present an analysis of variance procedure for the split-plot design using SPSS syntax window.