• 폴리머
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• 제36권5호
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• pp.643-650
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• 2012

폴리우레탄의 열적 안정성을 개선하기 위하여, poly(oxydiethylene adipate)-diol(PAD), 4,4'-MDI, Cloisite 30B(30B), melamine phosphate(MP)를 사용하여 poly(adipate urethane)(PAU)과 PAU/30B(30B 2.7 wt%), PAU/MP(MP 2.2 wt%), PAU/30B/MP(30B 2.2 wt%, MP 2.2 wt%) 복합체를 합성하고 열분해 특성을 연구하였다. PAU 복합체에서 Cloisite 30B와 MP의 분산을 안정하고 균일하게 유지시키기 위하여, adipic acid와 diethylene glycol의 에스테르 반응 단계에서 Cloisite 30B와 MP를 도입하였다. $250^{\circ}C$ 이하에서 PAU 복합체가 순수 PAU보다 더 빠르게 열분해 되었다. 고온에서는 30B와 MP에 의하여 열안정성이 개선되어 분해속도가 현저히 감소하였으며, $700^{\circ}C$ 잔량도 크게 증가하였다.

• 한국전기전자재료학회논문지
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• 제20권10호
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• pp.839-845
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• 2007

In this paper, a polishing pad has been analyzed in detail, to understand surface phenomena of polishing process. The polishing pad plays a key role in polishing process and is one of the important layer in polishing process, because it is a reaction layer of polishing[1]. Pad surface physical property is also ruled by pad profile. The profile and roughness of pad is controlled by different types of conditioning tool. Conditioning tool add mechanical force to pad, and make some roughness and profile. Formed pad surface will affect on polishing performance such as RR (Removal Rate) and uniformity in CMP Pad surface condition is changed by conditioning tool and dummy run and is stable at final. And this research, we want to reduce break-in and dummy polishing process by analysis of pad surface and artificial machining to make stable pad surface. The surface treatment or machining enables to control the surface of polishing pad. Therefore, this research intends to verify the effect of the buffing process on pad surface through analysis of the removal rate, friction force and temperature. In this research, urethane polishing pad which is named IC pad(Nitta-Haas Inc.) and has micro pore structure, is studied because, this type of pad is most conventional type.

• 소성∙가공
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• 제18권7호
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• pp.556-564
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• 2009

Flexible forming process for sheet material using reconfigurable die is introduced based on numerical simulation. In general, this flexible forming process using the reconfigurable die has been utilized for manufacturing of curved thick plates used for hull structures, architectural structures and so on. In this study, numerical simulation of sheet metal forming process is carried out by using flexible dies model instead of conventional matched die set. The numerical simulation and experimental verification for sheet metal forming process using a flexible forming machine that is more suitable for thick plate forming process are carried out to confirm the appropriateness of the simulation process. As an elastic cushion, urethane pads are utilized using hyperelastic material model in the simulation for smoothing the forming surface which is discrete due to characteristics of the flexile die. In the flexible forming process for sheet metal, effect of a blank holder is also investigated according to blank holding methods. Formability in view of occurrence of dimples is compared with regard to the various punch sizes. Consequently, it is confirmed that the flexible forming for sheet material using urethane pad has enough capability and feasibility for manufacturing of smoothly curved surface instead of conventional die forming method.

• 소성∙가공
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• 제33권1호
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• pp.5-11
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• 2024

The development of a next-generation hydrogen compressor, a key component in the expansion of hydrogen charging infrastructure, is in progress. In order to improve compression efficiency and durability, it is important to optimize the precision forming and shearing processes of the diaphragm, which is the bellows unit cell, as well as the optimization of diaphragm shape itself. In this study, we aim to show that die and process design technology that can synchronize the inner and outer shearing points of the diaphragm for the precision forming of product can be constructed based on a numerical simulation. First, the damage model that can predict the fracture points will be determined using the shear load and shear zone measurements obtained by performing a blanking test of AISI-633 stainless steel. Next, we will explain the overall procedure based on numerical analysis model how to determine the shearing points according to the deformation pattern of urethane die for various shearing die design.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 추계학술대회
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• pp.1816-1821
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• 2003

The sapphire wafer for blue light emitting device was manufactured by the implementation of the chemical and mechanical polishing process. The surface polishing of crystalline sapphire wafer was characterized by zeta potential measurement. The reduction process with the alkali slurry provides the surface chemical reaction with sapphire atoms. The poly-urethane pad also provides the frictional force to take out the chemically-reacted surface layers. The surface roughness was measured by the atomic force microscope and the crystalline quality was characterized by the double crystal X -ray diffraction analysis.

• 한국전기전자재료학회논문지
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• 제20권12호
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• pp.1027-1033
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• 2007

In this research, the polishing pad for W CMP has been analyzed to understand stabilization of polishing performance. For stabilization of process, the polishing pad condition is one of important factors. The polishing pad plays a key role in polishing process, because it contact with reacted surface of wafer[1]. The physical property of pad surface is ruled by conditioning tool which makes roughness and profile of pad surface. Pad surface affects on polishing performance such as RR(Removal Rate) and uniformity in CMP. The stabilized pad surface has stable roughness. And its surface has high level of wettability which can increase the probability of abrasive adhesion on pad. The result of this research is that the reduction of break-in and dummy polishing process were achieved by artificial machining to make stable pad surface. In this research, urethane polishing pad which is named IC pad(Nitta-Haas Inc.) and has micro pore structure, is studied. Because, this type of pad is the most conventional type.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.434-437
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• 2005

Chemical Mechanical Polishing (CMP) has become an essential step in the overall semiconductor wafer fabrication technology. In general, CMP is a surface planarization method in which a silicon wafer is rotated against a polishing pad in the presence of slurry under pressure. The polishing pad, generally a polyurethane-based material, consists of polymeric foam cell walls, which aid in removal of the reaction products at the wafer interface. It has been found that the material removal rate of any polishing pad decreases due to the so-called 'pad glazing' after several wafer lots have been processed. Therefore, the pad restoration and conditioning has become essential in CMP processes to keep the urethane polishing pad at the proper friction coefficient and to allow effective slurry transport to the wafer surface. Diamond pad conditioner employs a single layer of brazed bonded diamond crystals. Due to the corrosive nature of the polishing slurry required in low pH metal CMP such as copper, it is essential to minimize the possibility of chemical interaction between very low pH slurry (pH <2) and the bond alloy. In this paper, we report an exceptional protective coated conditioner for in-situ pad conditioning in low pH Cu CMP process. The protective Cr-coated conditioner has been tested in slurry with pH levels as low as 1.5 without bond degradation.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2000년도 추계학술대회논문집
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• pp.425-430
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• 2000

This paper describes the effect of the pad stiffness on the noise reduction of impact noise isolation pads of a floor. And also a new semi-experimental method for measuring the impact noise isolation capability of a pad is introduced. The impact noise isolation pads made of wire-mesh, urethane-chip and foam rubber are used for measuring the stiffness, the vibrational insulation performance and the impact noise isolation capability. The correlation between the stiffness and impact noise isolation capability of pads is theoretically reviewed, and confirmed from the experimental results. For measuring the impact noise isolation capability of only an isolation pad, a semi-experimental method proposed in this study is more effective than the reverberation room method.

• 대한기계학회논문집A
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• 제34권5호
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• pp.549-556
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• 2010

가변성형공정에서는 형상 변형이 가능한 가변금형의 성형면을 고르게 형성하기 위하여 일반적으로 우레탄, 고무 등 같은 탄성체 패드를 가변금형과 소재 사이에 삽입하여 이용한다. 이에 본 연구에서는 이러한 탄성패드가 성형성에 미치는 영향에 대한 조사를 위하여 탄성체의 경도 및 두께를 주요 변수로 고려한 수치해석적 연구를 수행하였다. 탄성패드 소재로는 우레탄을 이용하였으며, 이의 물성 획득을 위한 압축시험을 수행하였고, 초탄성체 재료 모델로 가정하여 가변성형공정해석에 적용하였다. 탄성체의 경도와 두께의 변화에 따른 해석 결과로부터 성형 정확도를 조사하기 위하여 주방향의 단면형상을 비교하였으며, 목적형상에 대한 오차를 비교하였다. 이로부터 가변성형공정에 이용되는 탄성 패드가 적절히 선정되어야 함을 확인하였으며, 패드의 경도 및 두께 선정에 대한 기준을 제안하였다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.279-284
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• 2007

Elasto-forming has been dedicated to specific and limited production. Today, using enhanced pad materials, it has become an efficient and economical process alternative for low and medium volume metal-forming production. The non-linear properties of elastomer which are described as strain energy function are important parameter to design and evaluate of elastomer component. These are determined by material tests which are uni-axial tension and bi-axial tension. In order to investigate the design paramerer, Finite element analysis was carried out for elasto-forming process.