• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.665-667
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• 2005

VIATRON TECHNOLOGIES has developed FE-RTP system that enables LTPS LCD and AMOLED manufacturers to produce poly-Si films at low cost, high throughput, and high yield. The system employs sequential heat treatment methods using temperature control and rapid thermal processor modules. The temperature control modules provide exceptionally uniform heating and cooling of the glass substrates to within ${\pm}2^a\;C$. The rapid thermal process that combines heating with field induction accelerates the treatment rates. The new FE-RTP system can process $730{\times}920mm$ glass substrates as thin as 0.4 mm. The uniform nature of poly-Si films produced by FE-RTP resulted in AMOLED panels with no laser-Muras. Furthermore, FE-RTP system also showed superior performances in other heat treatment processes involved in poly-Si TFT fabrications, such as dopant activation, gate oxide densification, hydrogenation, and pre-compaction.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.14 no.11
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• pp.923-930
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• 2002

Cooling characteristics of a parallel channel with protruding heat sources using convection and conduction heat transfer are studied numerically. A two-dimensional model has been developed for numerical prediction of transient, compressible, viscous, laminar flow, and conjugate heat transfer between parallel plates with uniform block heat sources. The finite volume method is used to solve the problem. The assembly consists of two channels formed by two covers and one printed circuit board which has three uniform heat source blocks. Six different cooling methods are considered to find out the most efficient cooling method in a given geometry and heat sources. The velocity and temperature fields of cooling medium, the temperature distribution along the block surface, and the maximum temperature in each block are obtained. The results are compared to examine the cooling characteristics of the different cooling methods.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.10 no.5
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• pp.523-534
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• 1998

The convection heat transfer on horizontal circular tube is studied as a conjugated heat transfer problem. With uniform heat generation in a cylindrical heater placed in a cross flow boundary condition, heat flow that is conducted along the wall of the heater creates a non-isothermal surface temperature and non-uniform heat flux distribution. In the present investigation, the effects of circumferential wall heat conduction on convection heat transfer are investigated for the case of forced convection around horizontal circular tube in cross flow of air and water. Non-dimensional conjugation parameter $ K^*$ which can be deduced from the governing energy differential equation should be used to express the effect of circumferential wall heat conduction. Two-dimensional temperature distribution$ T({\gamma,\theta})$ is presented. The influence of circumferential wall heat conduction is demonstrated on graph of local Nusselt number.

• Journal of Advanced Marine Engineering and Technology
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• v.28 no.1
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• pp.46-55
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• 2004

Thermal characteristics of the various cooling methods in electronic equipment are studied numerically. A common chip cooling system is modeled as a parallel channel with protruding heat sources. A two-dimensional model has been developed for the numerical analysis of compressible. viscous. laminar flow. and conjugate heat transfer between parallel plates with uniform block heat sources. The finite volume method is used to solve this problem. The assembly consists of two channels formed by two covers and one printed circuit board that is assumed to have three uniform heat source blocks. Various cooling methods are considered to find out the efficient cooling method in a given geometry and heat sources. The velocity and the temperature fields. the local temperature distribution along the surface of blocks. and the maximum temperature in each block are obtained. The results are compared to examine the thermal characteristics of the different cooling methods both quantitatively and qualitatively.

• The Magazine of the Society of Air-Conditioning and Refrigerating Engineers of Korea
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• v.8 no.3
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• pp.151-157
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• 1979

A general solution for temperature distribution And heat transfer for a uniform straight fin is yen. Thermal conductivity and heat transfer coefficient between the fin and the surrounding fluid can be arbitrary functions of temperature. Minimum weight conditions for a rectangular fin are analyzed, Numerical results for some special cases are given in graphical forms.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.9
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• pp.947-954
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• 2015

The homogeneous coating of a flexible film that is applied to dye-sensitized solar cells is related to the performance and durability of the product. The applied coating is obtained from the uniform temperature distribution and the mass flow rate in the nozzle of the hot air dryer. In this study, we determine the uniform temperature distribution and mass flow rate of each nozzle by performing numerical simulations to understand how various factors affect the performance of the hot air dryer. The numerical model is composed of the momentum equation for flow motion and the energy equation for temperature. In addition, we compare the numerical results to the experimental results to validate the model. Based on the results, the round-hole plate inside the hot air dryer significantly affects the uniform temperature and the mass flow rate.

• Journal of the Korean Vacuum Society
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• v.19 no.1
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• pp.45-51
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• 2010

We measured the temperature of target surface inducing by various physical phenomenon on magnetron sputtering target and confirmed the possibilities if the temperature distribution could affect plasma and deposited thin film. The target of magnetron sputtering has two types: round type and rectangular type. In a rectangular target, the concentrated discharge area by corner effect by magnetic field and non-uniform erosion of target are generated. And we found the generation of non-uniform temperature distribution on the target surface from this. This area was $10{\sim}20^{\circ}C$ higher than non-sputtering area. And if particles are generated during sputtering process, they were $20^{\circ}C$ higher than the area where is higher than non-sputtering area. These effects result in non-uniformity of thin films, crack of ceramic target, and shortening target life by non-uniform erosion.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.2
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• pp.743-750
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• 2017

It is important to ensure a uniform temperature distribution in greenhouses for the mushroom cultivation. The air temperature of the mushroom cultivation greenhouse is made uniform by supplying a constant air temperature with the underground air. The mushroom cultivation array in a greenhouse in seven columns and four rows can make smooth air flows between the rows and prevent air differences between the top and bottom. The buoyancy effect in the entering air of 0.5m/s based on following density difference depending on initial internal temperature needs to be considered. The locations of the Fan Coil Unit (FCU) and fan were defined through flow analysis in a greenhouse to distribute the optimal uniform temperature. In this study, the air conditioning system of a greenhouse with a sandwich heat insulting panel shape which is composed of a FCU and fan was designed by flow analysis. A relatively uniform temperature distribution can be formed because the circulation path of air becomes longer in the different locations of the FCU (inlet) and fan (outlet) through the internal temperature and flow analysis. The cultivation and quality uniformity of the mushrooms could be promoted through these environmental improvements.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1917-1921
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• 2008

Ultraviolet-nanoimprint lithography (UV-NIL) is promising technology for cost effectively defining micro/nano scale structure at room temperature and low pressure. In addition, this technology is fascinating because of it's possibility for high-throughput patterning without complex processes. However, to acquire good micro/nano patterns using this technology, there are some challenges such as uniformity and fidelity of patterns, etc. In this paper, we have focused on uniform contact mechanism and performed contact mechanics analysis. The dimension of the flexible sheet to get adequate uniform contact area has been obtained from contact mechanics simulation. Based on this analysis, we have made a uniform pressurizing device and confirmed its uniform pressurized zone using a pressure sensing paper.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.5
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• pp.76-81
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• 2008

Nanoimprint lithography(NIL) is an emerging technology enabling cost-effective and high-throughput nanofabrication. Among NILs, significant efforts from both academia and industry have been put in UV NIL research and development because of its ability to pattern at room temperature and at low pressure. In UV NIL, there may be in-line set-up error of the stamp and the substrate. To compensate this error, the dummy blocks are put on the stamp and pressurized uniformly. Contact problems between the stamp and the photoresist layer on the substrate are often happened, which results in the non-uniform residual layer In this paper, the pressurization method on the dummy block is investigated by the finite element method. A new method is recommended and evaluated far the uniform stamp deformation.