• Journal of the Korean Vacuum Society
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• v.4 no.S2
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• pp.40-48
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• 1995

$TiB_2$-TiN double-layer coating have been prepared by ion beam enhanced deposition. AES, XRD, TEM and HRTEM were employed to characterize the $TiB_2$ layer. The microhardness of the coatings was evaluated by an ultra low-load microhardness indenter system, and the tribological behavior was examined by a ball-on-disc tribology wear tester. It was found that in a single titanium diboride layer, the composition is uniform along the depth of the film, and it is mainly composed of nanocrystalline $TiB_2$ with hexagonal structure, which resulted from the ion bombardment during the film growth. The hardness of the $TiB_2$ films increases with increasing ion energy, and approaches a maximum value of the $TiB_2$ films increases with increasing ion energy, and approaches a maximum value of 39 Gpa at ion energy of 85 keV. The tribological property of the TiB2 films is also improved by higher energy of 85keV. The tribological property of the $TiB_2$ films is also improved by higher energy ion beam bombardment. There is no major disparity in the mechanical properties of double-layer $TiB_2$/TiN coatings and TiN/$TiB_2$ coatings. Both show an improved wear resistance compared with single-layer $TiB_2$ films. The adhesion of double-layer coatings is also superior to that of single-layer films.

• Korean Journal of Materials Research
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• v.32 no.9
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• pp.361-368
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• 2022

The overall process, from the pre-treatment of aluminum substrates to the eco-friendly neutral electroless Ni-P plating process, was observed, compared, and analysed. To remove the surface oxide layer on the aluminum substrate and aid Ni-P plating, a zincation process was carried out. After the second zincation treatment, it was confirmed that a mostly uniform Zn layer was formed and the surface oxide of aluminum was also removed. The Ni-P electroless plating films were formed on the secondary zincated aluminum substrate using electroless plating solutions of pH 4.5 and neutral pH 7.0, respectively, while changing the plating bath temperature. When a neutral pH7.0 electroless solution was used, the Ni-P plating layer was uniformly formed even at the plating bath temperature of 50 ℃, and the plating speed was remarkably increased as the bath temperature was increased. On the other hand, when a pH 4.5 Ni-P electroless solution was used, a Ni-P plating film was not formed at a plating bath temperature of 50 ℃, and the plating speed was very slow compared to pH 7.0, although plating speed increased with increasing bath temperature. In the P contents, the P concentration of the neutral pH 7.0 Ni-P electroless plating layer was reduced by ~ 42.3 % compared to pH 4.5. Structurally, all of the Ni-P electroless plating layers formed in the pH 4.5 solution and the neutral (pH 7.0) solution had an amorphous crystal structure, as a Ni-P compound, regardless of the plating bath temperature.

• Applied Chemistry for Engineering
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• v.34 no.2
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• pp.106-110
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• 2023

Lignin is compatible with various polymeric materials and useful as a carbon precursor. In this work, carbon monolith films were produced from polyacrylonitrile (PAN)@lignin precursor films by a controlled carbonization cycle. In addition, their morphological features, electrical properties, and adsorption behavior were analyzed and compared with those of carbonized PAN films. The successful formation of PAN@lignin precursor was confirmed by Fourier-transform infrared (FT-IR) spectroscopy. SEM was used to examine the morphology of precursor and carbonized films, revealing that both precursor and carbonized films retained structural stability following carbonization. A trace of lignin in the carbonized films was also found. The pore structure of the carbonized PAN@lignin film was measured using the BET method, indicating the formation of fairly uniform pores. The electrical properties were also analyzed to obtain the Ohmic relation, which demonstrated that the electrical signal was influenced by incoming materials. Finally, the carbonized PAN@lignin films were useful as adsorbents to remove metal ions. This study provides important information for future initiatives in relevant research fields.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.19-25
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• 2023

With an attempt to investigate the correlation between the internal pressure distribution of slit nozzle and the thickness uniformity of slot-coated thin films, we have performed computational fluid dynamics (CFD) simulations of slit nozzles and slot coating of high-viscosity (4,800 cPs) polydimethylsiloxane (PDMS) using a gantry slot-die coater. We have calculated the coefficient of variation (CV) to quantify the pressure and velocity distributions inside the slit nozzle and the thickness non-uniformity of slot-coated PDMS films. The pressure distribution inside the cavity and the velocity distribution at the outlet are analyzed by varying the shim thickness and flow rate. We have shown that the cavity pressure uniformity and film thickness uniformity are enhanced by reducing the shim thickness. It is addressed that the CV value of the cavity pressure that can ensure the thickness non-uniformity of less than 5% is equal to and less than 1%, which is achievable with the shim thickness of 150 ㎛. It is also found that as the flow rate increases, the average cavity pressure is increased with the CV value of the pressure unchanged and the maximum coating speed is increased. As the shim thickness is reduced, however, the maximum coating speed and flow rate decrease. The highly uniform PDMS films shows the tensile strain as high as 180%, which can be used as a stretchable substrate.

• Korean Journal of Materials Research
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• v.34 no.6
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• pp.283-290
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• 2024

The aggressive scaling of dynamic random-access memory capacitors has increased the need to maintain high capacitance despite the limited physical thickness of electrodes and dielectrics. This makes it essential to use high-k dielectric materials. TiO₂ has a large dielectric constant, ranging from 30~75 in the anatase phase to 90~170 in rutile phase. However, it has significant leakage current due to low energy barriers for electron conduction, which is a critical drawback. Suppressing the leakage current while scaling to achieve an equivalent oxide thickness (EOT) below 0.5 nm is necessary to control the influence of interlayers on capacitor performance. For this, Pt and Ru, with their high work function, can be used instead of a conventional TiN substrate to increase the Schottky barrier height. Additionally, forming rutile-TiO₂ on RuO₂ with excellent lattice compatibility by epitaxial growth can minimize leakage current. Furthermore, plasma-enhanced atomic layer deposition (PEALD) can be used to deposit a uniform thin film with high density and low defects at low temperatures, to reduce the impact of interfacial reactions on electrical properties at high temperatures. In this study, TiO₂ was deposited using PEALD, using substrates of Pt and Ru treated with rapid thermal annealing at 500 and 600 ℃, to compare structural, chemical, and electrical characteristics with reference to a TiN substrate. As a result, leakage current was suppressed to around 10^-6 A/cm² at 1 V, and an EOT at the 0.5 nm level was achieved.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.61 no.3
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• pp.116-121
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• 2012

Recently, in the field of renewable energy such as solar cells including the semiconductor and display industries, thin film deposition process is being diversified. Furthermore, to deal with trend of making high-quality and fast, the high-capacity and output plasma power supply which can control high density plasma is required. The biggest problem is arc discharge caused by using high voltage power supply. Thus, the key function of plasma power supply is to prevent arc discharge and there is a need to maintain the possible minimum arc energy. In DC sputtering power supply, on a periodic basis (-)voltage powering up is able to significantly reduce arcing, as well as arc discharge prevention, and maintaining uniform charge density. This conventional method for powering up (-)voltage requires heavy mutual inductance of the transformer to avoid distortion problem of the output voltage. This study is about energy recovery circuit for arc discharge prevention in sputtering plasma power supply. By using energy recovery circuit, it is possible to reduce the mutual inductance and size of the transformer dramatically, prevent distortion of the output voltage and has a stable output waveform. This work was proved through simulation and experimental study.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.5
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• pp.285-290
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• 2015

The phase change memory material is an active element in phase change memory and exhibits reversible phase transition behavior by thermal energy input. The doping of the phase change memory material with Ga leads to the increase of its crystallization temperature and the improvement of its amorphous stability. In this study, we investigated the effect of GaGe sputtering power on the formation of the phase change memory material including Ga. The deposition rate linearly increased to a maximum of 127 nm and the surface roughness remained uniform as the GaGe sputtering power increased in the range from 0 to 75 W. The Ga concentration in the thin film material abruptly increased at the critical sputtering power of 60 W. This influence of GaGe sputtering power was confirmed to result from a combined sputtering-evaporation process of Ga occurring due to the low melting point of Ga ($29.77^{\circ}C$).

• Bulletin of the Korean Chemical Society
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• v.33 no.2
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• pp.464-468
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• 2012

Three solvent systems, chlorobenzene (ink 1), chlorobenzene/o-dichlorobenzene (ink 2) and chlorobenzene/tetrahydronaphthalene (ink 3), were compared as printable inks for the fabrication of polymer light-emitting diodes (PLEDs) using poly[2-methoxy-5-(2-ethylhexyl-oxyl)-1,4-phenylenevinylene (MEH-PPV) as an emissive material and an inkjet printer (Fujifilm Dimatix DMP-2831). Ink 1 clogged the printer's nozzle and gave non-uniform film. Inks 2 and 3 were used to fabricate PLEDs with ITO/PEDOT:PSS/MEH-PPV/LiF/Al configurations. The best performance (turn-on voltage, 3.5 V; luminance efficiency, 0.17 cd/A; luminance, 1,800 cd/m) was obtained when ink 3 was used to form the emissive layer (thickness, 49 nm), attributable to the better morphology and suitable thickness of the MEH-PPV layer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.113-113
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• 2009

This paper describes the characteristics of a poly 3C-SiC micro heater which was fabricated on $AlN(0.1{\mu}m)/3C-SiC(1.0{\mu}m)$ suspended membranes by surface micro- machining technology. The 3C-SiC and AlN thin films which have wide energy bandgap and very low lattice mismatch were used sensors for high temperature and voltage environments. The 3C-SiC thin film was used as micro heaters and temperature sensor materials simultaneously. The implemented 3C-SiC RTD (resistance of temperature detector) and the power consumption of micro heaters were measured and calculated. The TCR (thermal coefficient of the resistance) of 3C-SiC RTD is about -5200 $ppm/^{\circ}C$ within a temperature range from $25^{\circ}C$ to $50^{\circ}C$ and -1040 $ppm/^{\circ}C$ at $500^{\circ}C$. The micro heater generates the heat about $500^{\circ}C$ at 10.3 mW. Moreover, durability of 3C-SiC micro heaters in high voltages is better than pt micro heaters. A thermal distribution measured and simulated by IR thermovision and COMSOL is uniform on the membrane surface.

• Bulletin of the Korean Chemical Society
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• v.25 no.4
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• pp.475-479
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• 2004

$TiO_2$ thin films were grown on Si (100) substrates by atomic layer deposition using $[Ti(OPr^i )_2(dmae)_2]$ and water as precursors. The thickness, chemical composition, crystalline structure, and morphology of the deposited films were investigated by transmission electron microscopy, UV spectrometry, X-ray photoelectron pectroscopy, X-ray diffraction, and atomic force microscopy. The results show that $TiO_2$ ALD using $[Ti(OPr^i )_2(dmae)_2]$ as a precursor is self-controlled at temperatures of 100-300$^{\circ}C$. At the growth temperatures below 300$^{\circ}C$, the surface morphology of the $TiO_2$ films is smooth and uniform. The $TiO_2$ film was grown with a preferred orientation toward the [101] direction at 400$^{\circ}C$.