• 대한임베디드공학회논문지
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• 제12권2호
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• pp.97-103
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• 2017

Thermal imaging is mainly used in military equipment required for night observation. In particular, technologies of uncooled thermal imaging detectors are being developed as applied to low-cost night observation system. Many system integrators require different specifications of the uncooled thermal imaging camera but their development time is short. In this approach, EOSYSTEM has developed a small size, TEC-less uncooled thermal imaging camera module with $32{\times}32mm$ size and low power consumption. Both domestic detector and import detector are applied to the EOSYSTEM's thermal imaging camera module. The camera module contains efficient infrared image processing algorithms including : Temperature compensation non-uniformity correction, Bad/Dead pixel replacement, Column noise removal, Contrast/Edge enhancement algorithms providing stable and low residual non-uniformity infrared image.

• 센서학회지
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• 제27권5호
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• pp.300-305
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• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

• 한국컴퓨터정보학회논문지
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• 제22권10호
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• pp.19-26
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• 2017

In this paper, we propose an efficient image equipment implementation for the detector characteristics of various detectors by analyzing un-cooled thermal detector that exhibits nonlinear changes due to external temperature effects. First, we explain Thermal Electric Cooler for un-cooled detector temperature control system and Non-image correction methode for IR system. Second, we present the results of a study on an efficient control technique that can minimize the deterioration of image quality by controlling a un-cooled thermal detector without a thermal electric cooler(TEC) inside. Third, we suggest Image Correction Methods for Uncooled IR TECless Detector with Non-linear characteristics due to Temperature Change. So, we analyze and present the results of Image correction methods for various un-cooled thermal detector.

• 한국정보통신학회논문지
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• 제16권10호
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• pp.2335-2340
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• 2012

비냉각 방식의 검출기는 검출기 내부에 냉각기 기능을 하는 열전소자(TEC : Thermal Electric Cooler)를 탑재하여 냉각기의 기능을 대신하고 있다. 이 열전소자의 기능은 검출기의 기준온도를 제어하여 온도변화에 따른 영상화질의 저하를 방지하는 역할을 수행한다. 최근에는 이 열전소자를 삭제하여 크기, 가격을 줄일 수 있는 노력이 많이 연구되고 있다. 본 논문에서는 비냉각 형태의 적외선 검출기는 내부에 열전소자가 없는 검출기를 보다 효과적으로 제어하여 영상의 화질저하를 최소화 하면서 크기를 최소화 하고 가격경쟁력을 높일 수 있는 효율적인 제어기법에 대해 실제 챔버를 활용한 시험결과를 제시하고자 한다.

• 한국컴퓨터정보학회논문지
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• 제17권12호
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• pp.41-47
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• 2012

모든 물체는 절대온도 0도 이상에서 복사에너지를 방출한다. 비냉각 열상시스템은 입사된 복사에너지를 검출하여 신호처리를 통해 영상으로 출력하는 장비이다. 최근에는 비냉각 열상장비를 활용하여 의료, 산업, 및 군수 등의 다양한 분야에 응용 되고 있으며, 다양한 응용분야에 대한 많은 연구가 진행되고 있다. 본 논문에서는 비냉각 열상시스템 검출기 내부에 열전소자가 없는 검출기를 보다 효과적으로 제어하여 영상의 화질을 향상시키고 이를 기반으로 온도 측정 정밀도를 극대화 할 수있는 효율적인 제어기법에 대해 설명한다. 제안하는 기법은 비냉각 열상시스템에 TEC-less 및 온도 검출 알고리듬을 적용하는 것이다. 실제 챔버를 활용하여 시험을 수행한 결과 알고리듬 적용 전 시스템보다 우수한 화질의 영상을 획득하고 온도 측정 정밀도가 $1^{\circ}C$이하로 향상됨을 확인할 수 있었다.

• 한국기계가공학회지
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• 제4권4호
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• pp.34-38
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• 2005

This is a widespread requirement for low cost lightweight thermal imaging sensors for both military and civilian applications. Today, a large number of uncooled infrared detector developments are under progress due to the availability of silicon technology that enables realization of low cost IR sensor. System prices are continuing to drop, and swelling production volume will soon drive process substantially lower. The feasibility of micromechanical optical and infrared (IR) detection using microcantilevers is demonstrated. Microcantilevers provide a simple Structurefor developing single- and multi-element sensors for visible and infrared radiation that are smaller, more sensitive and lower in cost than quantum or thermal detectors. Microcantilevers coated with a heat absorbing layer undergo bending due to the differential stress originating from the bimetallic effect. This paper reports a micromachined silicon uncooled thermal imager intended for applications in automated process control. This paper presents the design, fabrication, and the behavior of cantilever for thermomechanical sensing.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 하계종합학술대회 논문집(2)
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• pp.115-118
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• 2000

Uncooled pyroelectric infrared detectors based on BST(B $a_{-x}$S $r_{x}$Ti $O_3$) thin films have been fabricated by RF magnetron sputtering and surface Micromachining technology. The detectors form BST thin film ferroelectric capacitors grown by RF magnetron sputtering on N/O/N(S $i_3$ $N_4$/ $SiO_2$/S $i_3$ $N_4$) membrane. The sputtered BST thin film exhibits highly c-axis oriented crystal structure that no poling treatment for sensing applications is required. This is an essential factor to increase the yield for realization of an infrared image sensor. surface-Micromachining technology is used to lower the thermal mass of the detector by giving maximum sensor efficiency Gold-black is evaporated on top of the sensing elements used the thermal evaporator. fabricated uncooled pyroelectric infrared detectors is highly output voltage at the low temperature(1$^{\circ}C$).).).

• 한국전기전자재료학회논문지
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• 제25권5호
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• pp.366-371
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• 2012

In this paper, fabricated by MEMS uncooled micro-bolometer detector for the study in the infrared sensitivity enhancement. Absorption layer SiOx-Metal series MDTF (metal-dielectric thin film) by high absorption rate and has a high thermal coefficient of resistance, low noise characteristics were implemented. Then MDTF were made in a vacuum deposition method. And MDTF for the analysis of the physical properties of silicon wafers were fabricated, TCR (temperature coefficient of resistance) value was made in order to measure the glass wafer and FT-IR (Fourier Transform Infrared spectroscopy) values were made in order to measure the germanium window. The analyzed results of MDTF -3 [%/K] has more characteristics of the TCR. And 8~12 um wavelength region close to 70% in the absorption characteristic.

• JSTS:Journal of Semiconductor Technology and Science
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• 제15권5호
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• pp.533-538
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• 2015

Thermal characterization of individual pixels in microbolometer infrared image sensors is needed for optimal design and improved performance. In this work, we used thermoreflectance microscopy on uncooled microbolometer image sensors to investigate the thermal characteristics of individual pixels. Two types of microbolometer image sensors with a shared-anchor structure were fabricated and thermally characterized at various biases and vacuum levels by measuring the temperature distribution on the surface of the microbolometers. The results show that thermoreflectance microscopy can be a useful thermal characterization tool for microbolometer image sensors.

• 제어로봇시스템학회논문지
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• 제13권2호
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• pp.128-132
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• 2007

Thermal Imaging systems are reported to be crucial for fire fighting and beginning to be used by fire fighters. The performance of thermal imaging system is determined by both the radiation of infrared from the target and the attenuation of infrared signal in the optical path by the absorption, scattering, diffraction and reflection. In the scene of fire, water drops with various sizes such as vaporized water, wafer mist from sprinkler, and wafer to suppress the fire reside with various gas generated by burning. To measure the transmission of infrared radiation in the scene of fire, fire simulating system and thermal imagers with cooled detector which detects $3{\sim}5{\mu}m$ infrared and uncooled detector fabricated by the MEMS technology which detects $8{\sim}12{\mu}m$ infrared. are made. With thermal imagers and Ire simulating system, the change of thermal image with respect to the change of visibility controlled with the burned fas was measured. It was found that the transmission of infrared was not reduced by the burned gas, which could be explained by the long wavelength of infrared ray compared with visible ray. However, the transmission of infrared ray was largely reduced by the combination of burned gas and water mist supplied by sprinkler. This is contrary to the results of calculated transmission through the pure water mist and shows that the transmission of infrared ray is mostly affected by the compounds of water mist and burned gas. In this case, it was found that the uncooled detector which detects $8{\sim}12{\mu}m$ infrared ray is better than cooled detector which detects $3{\sim}5{\mu}m$ infrared ray for fire fighting.