• Title/Summary/Keyword: Uncooled thermal image

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Small Camera Module for TEC-less Uncooled Thermal Image (TEC-less 비냉각 열영상 검출기용 소형카메라 모듈 개발)

  • Kim, Jong-Ho
    • IEMEK Journal of Embedded Systems and Applications
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    • v.12 no.2
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    • pp.97-103
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    • 2017
  • Thermal imaging is mainly used in military equipment required for night observation. In particular, technologies of uncooled thermal imaging detectors are being developed as applied to low-cost night observation system. Many system integrators require different specifications of the uncooled thermal imaging camera but their development time is short. In this approach, EOSYSTEM has developed a small size, TEC-less uncooled thermal imaging camera module with $32{\times}32mm$ size and low power consumption. Both domestic detector and import detector are applied to the EOSYSTEM's thermal imaging camera module. The camera module contains efficient infrared image processing algorithms including : Temperature compensation non-uniformity correction, Bad/Dead pixel replacement, Column noise removal, Contrast/Edge enhancement algorithms providing stable and low residual non-uniformity infrared image.

Uncooled Microbolometer FPA Sensor with Wafer-Level Vacuum Packaging (웨이퍼 레벨 진공 패키징 비냉각형 마이크로볼로미터 열화상 센서 개발)

  • Ahn, Misook;Han, Yong-Hee
    • Journal of Sensor Science and Technology
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    • v.27 no.5
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    • pp.300-305
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    • 2018
  • The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

Image Correction Method for Uncooled IR TECless Detector with Non-linear characteristics due to Temperature Change

  • Shin, Jung-Ho;Ye, Seong-Eun;Kim, Bo-Mee;Park, Chan
    • Journal of the Korea Society of Computer and Information
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    • v.22 no.10
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    • pp.19-26
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    • 2017
  • In this paper, we propose an efficient image equipment implementation for the detector characteristics of various detectors by analyzing un-cooled thermal detector that exhibits nonlinear changes due to external temperature effects. First, we explain Thermal Electric Cooler for un-cooled detector temperature control system and Non-image correction methode for IR system. Second, we present the results of a study on an efficient control technique that can minimize the deterioration of image quality by controlling a un-cooled thermal detector without a thermal electric cooler(TEC) inside. Third, we suggest Image Correction Methods for Uncooled IR TECless Detector with Non-linear characteristics due to Temperature Change. So, we analyze and present the results of Image correction methods for various un-cooled thermal detector.

Novel control scheme for the absence of the thermoelectric(TEC) of infrared detector in an Uncooled thermal system (비냉각 열상시스템에서의 적외선 검출기의 열전소자(TEC) 부재에 대한 효율적인 제어기법)

  • Kim, Yong-Jin;Seo, Jae-Gil;Kim, Young-Kil
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.16 no.10
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    • pp.2335-2340
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    • 2012
  • The detector is an uncooled detector system that functions inside the thermoelectric cooler (TEC) equipped with features instead of the cooler. The function of the thermoelectric device to control the temperature of the detector based on a function of temperature to prevent degradation of image quality to perform the role, the latest technology trend by removing the thermoelectric device size, cost a lot of effort to reduce has been studied. In this paper, It would be proposed of the actual test result using real chamber environment of for the best TECless algorithm as to minimize the degradation of image quality and obtain the low price of the uncooled detector.

Novel Accuracy Enhancement Method for Absolute Temperature Measurement Using TEC-LESS Control in Uncooled Thermal Imaging (비냉각 열상시스템에서 TEC-Less를 이용한 절대온도 측정 정밀도 향상 기법)

  • Han, Joon Hwan
    • Journal of the Korea Society of Computer and Information
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    • v.17 no.12
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    • pp.41-47
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    • 2012
  • Every object over $O^{\circ}K$ emits radiant energy based on its own temperature. Uncooled thermal imaging system displays the detected incident radiant energy as an image by signal processing. Recently, the uncooled thermal imaging system is applied to various areas such as medical, industrial, and military applications. Also, several researches are in progress to find new applications of the uncooled thermal imaging system. In this paper, we present effective method for controlling TEC-less detector in the uncooled thermal imaging system and also present the efficient control scheme for maximizing the accuracy of temperature measurement. The proposed scheme is to apply TEC-less and temperature detection algorithm in Uncooled thermal imaging system. In results of tests performed by using the actual chamber, we acquired images of better quality than the former system and temperature measurement accuracy was improved to less than $1^{\circ}C$.

A study on MicroCantilever Deflection for the Infrared Image Sensor using Bimetal Structure (바이메탈형 적외선 이미지 센서 제작과 칸틸레버 변위에 관한 고찰)

  • Kang, Jung-Ho
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.4 no.4
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    • pp.34-38
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    • 2005
  • This is a widespread requirement for low cost lightweight thermal imaging sensors for both military and civilian applications. Today, a large number of uncooled infrared detector developments are under progress due to the availability of silicon technology that enables realization of low cost IR sensor. System prices are continuing to drop, and swelling production volume will soon drive process substantially lower. The feasibility of micromechanical optical and infrared (IR) detection using microcantilevers is demonstrated. Microcantilevers provide a simple Structurefor developing single- and multi-element sensors for visible and infrared radiation that are smaller, more sensitive and lower in cost than quantum or thermal detectors. Microcantilevers coated with a heat absorbing layer undergo bending due to the differential stress originating from the bimetallic effect. This paper reports a micromachined silicon uncooled thermal imager intended for applications in automated process control. This paper presents the design, fabrication, and the behavior of cantilever for thermomechanical sensing.

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Fabrication of Uncooled Pyroelectric Infrared Detector using Surface M Micromachining Technology (표면 마이크로 가공기술을 이용한 비냉각 초전형 적외선 검출소자 제작)

  • 장철영;고성용;이석헌;김동진;김진섭;이재신;이정희;한석룡;이용현
    • Proceedings of the IEEK Conference
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    • 2000.06b
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    • pp.115-118
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    • 2000
  • Uncooled pyroelectric infrared detectors based on BST(B $a_{-x}$S $r_{x}$Ti $O_3$) thin films have been fabricated by RF magnetron sputtering and surface Micromachining technology. The detectors form BST thin film ferroelectric capacitors grown by RF magnetron sputtering on N/O/N(S $i_3$ $N_4$/ $SiO_2$/S $i_3$ $N_4$) membrane. The sputtered BST thin film exhibits highly c-axis oriented crystal structure that no poling treatment for sensing applications is required. This is an essential factor to increase the yield for realization of an infrared image sensor. surface-Micromachining technology is used to lower the thermal mass of the detector by giving maximum sensor efficiency Gold-black is evaporated on top of the sensing elements used the thermal evaporator. fabricated uncooled pyroelectric infrared detectors is highly output voltage at the low temperature(1$^{\circ}C$).).).

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A Study on the MDTF for Uncooled Infrared Ray Thermal Image Sensors with High Thermal Coefficient of Resistance (높은 열저항 계수를 가지는 비냉각형 적외선 열영상 이미지 센서용 MDTF(Metal-dielectric Thin Film)에 관한 연구)

  • Jung, Eun-Sik;Jeong, Se-Jin;Kang, Ey-Goo;Sung, Man-Young
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.25 no.5
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    • pp.366-371
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    • 2012
  • In this paper, fabricated by MEMS uncooled micro-bolometer detector for the study in the infrared sensitivity enhancement. Absorption layer SiOx-Metal series MDTF (metal-dielectric thin film) by high absorption rate and has a high thermal coefficient of resistance, low noise characteristics were implemented. Then MDTF were made in a vacuum deposition method. And MDTF for the analysis of the physical properties of silicon wafers were fabricated, TCR (temperature coefficient of resistance) value was made in order to measure the glass wafer and FT-IR (Fourier Transform Infrared spectroscopy) values were made in order to measure the germanium window. The analyzed results of MDTF -3 [%/K] has more characteristics of the TCR. And 8~12 um wavelength region close to 70% in the absorption characteristic.

Thermal Characterization of Individual Pixels in Microbolometer Image Sensors by Thermoreflectance Microscopy

  • Ryu, Seon Young;Choi, Hae Young;Kim, Dong Uk;Kim, Geon Hee;Kim, Taehyun;Kim, Hee Yeoun;Chang, Ki Soo
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.15 no.5
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    • pp.533-538
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    • 2015
  • Thermal characterization of individual pixels in microbolometer infrared image sensors is needed for optimal design and improved performance. In this work, we used thermoreflectance microscopy on uncooled microbolometer image sensors to investigate the thermal characteristics of individual pixels. Two types of microbolometer image sensors with a shared-anchor structure were fabricated and thermally characterized at various biases and vacuum levels by measuring the temperature distribution on the surface of the microbolometers. The results show that thermoreflectance microscopy can be a useful thermal characterization tool for microbolometer image sensors.

Performance Comparison of Thermal Imagers with Uncooled and Cooled Detectors For Fire Fighting Application (비냉각형 적외선 센서를 이용한 열상시스템과 냉각형 적외선 센서를 이용한 열상시스템의 화재 진압 시 성능 비교)

  • Kim, Byung-Hyuk;Jung, Han;Kim, Young-Ho
    • Journal of Institute of Control, Robotics and Systems
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    • v.13 no.2
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    • pp.128-132
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    • 2007
  • Thermal Imaging systems are reported to be crucial for fire fighting and beginning to be used by fire fighters. The performance of thermal imaging system is determined by both the radiation of infrared from the target and the attenuation of infrared signal in the optical path by the absorption, scattering, diffraction and reflection. In the scene of fire, water drops with various sizes such as vaporized water, wafer mist from sprinkler, and wafer to suppress the fire reside with various gas generated by burning. To measure the transmission of infrared radiation in the scene of fire, fire simulating system and thermal imagers with cooled detector which detects $3{\sim}5{\mu}m$ infrared and uncooled detector fabricated by the MEMS technology which detects $8{\sim}12{\mu}m$ infrared. are made. With thermal imagers and Ire simulating system, the change of thermal image with respect to the change of visibility controlled with the burned fas was measured. It was found that the transmission of infrared was not reduced by the burned gas, which could be explained by the long wavelength of infrared ray compared with visible ray. However, the transmission of infrared ray was largely reduced by the combination of burned gas and water mist supplied by sprinkler. This is contrary to the results of calculated transmission through the pure water mist and shows that the transmission of infrared ray is mostly affected by the compounds of water mist and burned gas. In this case, it was found that the uncooled detector which detects $8{\sim}12{\mu}m$ infrared ray is better than cooled detector which detects $3{\sim}5{\mu}m$ infrared ray for fire fighting.