• Journal of the Korean Society for Precision Engineering
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• v.29 no.11
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• pp.1256-1263
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• 2012

The present study covers the ultrasonic patterning process to replicate micro-patterns on a polymer substrate. The ultrasonic patterning process uses ultrasonic waves to generate frictional heat between an ultrasonic horn and the polymer substrate, from which the surface region of the polymer substrate is softened sufficiently for the replication of micro-patterns. The ultrasonic patterning process can divided into two categories according to the direction of vibration transmission: direct patterning and indirect patterning. The direct patterning uses a patterned horn, and the ultrasonic vibration is transferred directly from the patterned horn to the substrate. On the contrary, the indirect patterning process uses a plain horn, and the micro-patterns are engraved on a mold that is located below the substrate. Thus, the micro-patterns are replicated as an indirect manner. In this study, these direct and indirect patterning processes are compared in terms of the replication characteristics. Additionally, the possibility of double-side patterning is also discussed in comparison with the conventional single-side patterning process.

• Transactions of Materials Processing
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• v.21 no.2
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• pp.119-125
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• 2012

The present study addresses a direct patterning process on a plastic film using ultrasonic vibration energy. In this process, a tool horn containing micro-patterns is attached to an ultrasonic power supply, and is used with ultrasonic vibration to replicate micro-patterns on the surface of a plastic film. To improve the replication characteristics of the micro-patterns, the effect of the die shape of the ultrasonic patterning process was investigated with respect to the flow direction control. Finite element analyses were performed to predict the flow characteristics of the polymer with variations in die design parameters. Experiments were conducted using the optimally-designed die, from which it was possible to attain much improved pattern replication.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.419-420
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• 2008

• Journal of the Korean Society for Precision Engineering
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• v.23 no.7 s.184
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• pp.138-145
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• 2006

A nanopatterning technique was proposed and demonstrated for low cost and mass productive process using the scanning probe lithography (SPL) and soft lithography. The nanometer scale structure is fabricated by the localized generation of oxide patterning on the H-passivated (100) silicon wafer, and soft lithography was performed to replicate of nanometer scale structures. Both height and width of the silicon oxidation is linear with the applied voltagein SPL, but the growth of width is more sensitive than that of height. The structure below 100 nm was fabricated using HF treatment. To overcome the structure height limitation, aqueous KOH orientation-dependent etching was performed on the H-passivated (100) silicon wafer. Soft lithography is also performed for the master replication process. Elastomeric stamp is fabricated by the replica molding technique with ultrasonic vibration. We showed that the elastomeric stamp with the depth of 60 nm and the width of 428 nm was acquired using the original master by SPL process.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.4
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• pp.382-393
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• 2024

The Microplotter system with a fluid dispensing method, sprays fluid based on ultrasonic pumping through piezoelectric devices. This technique can possible for various materials with a wide range of viscosities to be printed in microscale. In this paper, we introduces dispenser printing technology as well as aim to understand and apply various processes using the equipment. In addition, we will explain how to optimize the equipment by adjusting parameters such as spray intensity, tip height during printing, and patterning speed. By utilizing Microplotter's advantage of being compatible with a wide range of fluids, including metal nanoparticles, carbon nanotubes, DNA, and proteins, it is expected to be used in various fields such as printed electronics, biotechnology, and chemical engineering.